Article ID: 000081288 Content Type: Troubleshooting Last Reviewed: 04/22/2013

Altera Device Package Information Data Sheet: Known Issues

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description

 

Issue 384162:  Altera Device Package Information Data Sheet, Version 16.6

Pin A1 is missing for some of the 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40 packages and will be corrected in the next revision. Pin A1 is supposed to be shown but is just missing from the mechanical drawing.

 

Issue 10006628: Altera Device Package Information Data Sheet, Version 16.1

 

there is an update on thermal resistance value for EP3C16U484, EP3C40U484 and EP3C40F780 devices as Table below:

Figure 1

 

 

 

Issue 10006284, Altera Device Package Information Data Sheet version 16.1

 

 

The footnote (1) for Table 13. Cyclone III Devices of the Altera Device Package Information Data Sheet is incorrect. The following is the correct footnote:

 

“The E144 package has an exposed ground pad at the bottom of the package. This ground pad is used for electrical connectivity, not for thermal purposes. It must be connected to the ground plane of the PCB.”

 

 

Issue 10006277, Altera Device Package Information Data Sheet version 16.1

 

Be informed that there is an update on thermal resistance value for EP3CLS100 and EP3CLS200 as Table 1 below:

Figure 1

 

 

 

Issue 10006284, Altera Device Package Information Data Sheet version 16.1

The note for the E144 package under table 13 has changed in this edition of the packaging datasheet and is incorrect.  There are not exposed VCC pads under this device, but there is an exposed ground pad.  The drawings for the package are correct.

Issue 10006283, Altera Device Package Information Data Sheet version 16.1

Table 4 incorrectly states that the EP4SGX290 in the FF35 package is a Single-Piece Lid:FBGA, Flip Chip, Option 2 which points to pages 283-284 of the data sheet.  You should use the package outline on pages 303-304 for this device package.

Issue 10006120, Altera Device Package Information Data Sheet version 16.1

The package outline top view of 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Single-Piece Lid -EP4SGX360 is incorrect. The correct top view should be as Figure 1 (below).

 

Figure 1

 

 

 
 
The Altera Device Package Information data sheet (PDF) chapter will be updated to show the correct package outline for Stratix IV GX device (1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Single-Piece Lid -   EP4SGX360).
 

Issue 10006119, Altera Device Package Information Data Sheet version 16.1

 

The POD of 256-Pin FineLine Ball-Grid Array (FBGA), Option 2 – Wire Bond is applicable to F256 packages of Cyclone II, Cyclone III and Cyclone IV products only.

 

The POD of 256-Pin FineLine Ball-Grid Array (FBGA), Option 1 – Wire Bond is applicable to F256 of all products except Cyclone II, Cyclone III and Cyclone IV products, which is assembled in Option 2 package outlines.

 

The Altera Device Package Information Data Sheet will be updated to show the correct package outline for 256-Pin FineLine Ball-Grid Array (FBGA) – Wire Bond.

 

Issue 10006122, Altera Device Package Information Data Sheet version 16.1

 

The 780-Pin EP4SE230 device should have package description as Channel Lid: FBGA, Flip Chip, Option 1, it is not Dual-Piece Lid: FBGA, Flip Chip, Option 1.

 

The Altera Device Package Information Data Sheet will be updated to show the correct package option for 780-Pin EP4SE230 device.

 

Issue 10006121, Altera Device Package Information Data Sheet version 16.1

 

The package outline top view of 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Dual-Piece Lid -  EP4SGX180 is incorrect. The correct top view should be as Figure 1 (below).

 

Figure 1 

 

 

 

Resolved Issue 10005898, Altera Device Package Information Data Sheet version 16.0

 

If you are using an EP4SE820 device it states that the package option you should refer to is Option 4. This is incorrect and you should be referring to Option 3.  Refer to the Altera Device Package Information Data Sheet (PDF) version 16.1 for clarification of this issue.

Related Products

This article applies to 4 products

Cyclone® III FPGAs
Cyclone® II FPGA
Cyclone® IV FPGAs
Stratix® IV GX FPGA

Disclaimer

1

All postings and use of the content on this site are subject to Intel.com Terms of Use.