Description
The solder stencil aperture opening can be derived from the Ball Grid Array (BGA) pad pitch and the BGA pad opening specifications of your target Altera® device.
The BGA pad pitch for Altera devices can be found from the Packaging Specifications and Dimensions web page, and the BGA pad opening can be found in AN114 : Designing With High-Density BGA Packages for Altera Devices (PDF)