Article ID: 000077567 Content Type: Product Information & Documentation Last Reviewed: 09/11/2012

How much can I expect the solder balls of a BGA package to shrink after reflow?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT

Description

You can expect the solder balls of a BGA package to shrink by about a third after reflow.

For example, if the solder balls have a height of 0.3mm before reflow, they will shrink to a height of about 0.2mm after reflow.

Stratix® V FPGAs

Stratix® IV FPGAs

Stratix® III FPGAs

Stratix® II FPGAs

Stratix® FPGAs

Intel® MAX® 10 FPGAs

MAX® V CPLDs

MAX® II CPLDs

MAX® 9000 CPLD

Cyclone® V FPGAs and SoC FPGAs

Cyclone® IV FPGAs

Cyclone® III FPGAs

Cyclone® II FPGA

Cyclone® FPGAs

Intel® Arria® 10 FPGAs and SoC FPGAs

Arria® V FPGAs and SoC FPGAs

Arria® II FPGAs

Arria® GX FPGA

Apex™ II

Apex™ 20K

Acex® 1K

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