No. Intel® PDN1926 provides notification of changes for several device families:
- Arria® II GX
- Arria® V
- Stratix® III
- Stratix® IV
For the Arria V and Stratix III devices, the package changes from a lidless package to a molded thermal composite package that is also lidless. These changes do not affect the thermal performance of the devices, and their thermal resistance specifications are unchanged.
For reference, the figure shows the lidless package (N) and the molded thermal composite package (G). Note that both packages feature direct thermal contact with the die.