Systems using Intel® Pentium® D Processors and Intel® Pentium® Processor Extreme Edition require thermal management. To follow these recommendations, you should have general knowledge of and experience with system operation, integration, and thermal management.
The terms "boxed Intel® Pentium® D Processors" and "boxed Intel® Pentium® Extreme Edition Processors" refer to processors packaged for use by system integrators.
|Note||"Processor" is the generic term for the Intel Pentium D Processor and Intel Pentium Processor Extreme Edition. The tables below include both processors, but may only state "Pentium D".|
Thermal management in these boxed processor-based systems can affect both performance (Thermal Monitor feature) and noise level (variable speed fan).
The Intel Pentium D Processor uses the Thermal Monitor feature (see Intel Pentium D Processor Datasheet for details) to protect the processor when the silicon would otherwise operate above specification. The feature helps prevent long-term reliability damage to the processor. It also protects against unusual circumstances like higher than normal internal chassis temperatures and inlet air temperature, defined as the air temperature entering the processor fan heat sink, or failure of a system thermal management component (such as a system fan).
In its active state, the Thermal Monitor feature scales back processor power consumption if the factory programmed thermal design temperature is exceeded. See Table 2 or the Intel Pentium D Processor Datasheet for complete thermal specifications. While the Thermal Monitor feature is active, the system's performance may drop below its normal peak performance level. Systems must maintain low enough internal chassis and processor inlet air temperatures to prevent the Intel Pentium D Processor from entering a Thermal Monitor active state. In a properly designed, thermal managed system, the Thermal Monitor feature should never become active. We recommend that the internal chassis temperature for boxed Intel Pentium D Processor-based systems remain below the lower set point (39°C) for nominal operating environments. See Table 1.
In addition to the Thermal Monitor feature, the boxed Intel Pentium D Processor fan heat sink uses a newly designed, high-quality variable speed fan. The fan allows the processor to remain within operating thermal specifications by running at different speeds over a short range of internal chassis temperatures and processor power consumption levels.
As processor power increases, required thermal solutions generates more noise. We have added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.
Previous generation boxed Intel fan heat sinks contain built-in circuitry to control fan speed. They have a thermistor in the fan hub, which measures the chassis ambient air temperature. The fan circuitry adjusts the fan speed to properly cool the processor at the slowest speed allowable. If the chassis ambient temperature is cool, the processor will run slower and quieter. If the ambient temperature is hot, then the fan will run faster.
This fan was designed to work in a variety of operating conditions so it had to be designed in such a way that it would cool the processor when running at its maximum power at any given ambient temperature (up to 39°C). In normal operating environments the processor is running at its maximum power only a fraction of the time.
Under most conditions the fan is spinning faster and louder than necessary. (The fan heat sink is required to work this way so that it will properly cool the CPU in all specified operating environments.)
We are aware of customer concerns over increasing fan noise. We designed a new fan speed control technology since the processor is not always running at its maximum power. We based the fan speed control on actual CPU temperature and power usage.
The speed of the new fan heat sink is controlled by the additional 4th wire of the fan cable. The new technology is sometimes referred to as "4-wire fan speed control."
The additional 4th wire sends a signal from the motherboard to the fan heat sink to control its speed. There is a thermal diode in the processor which measures actual CPU temperature. The processor sends information to the motherboard about its specific thermal requirements and the actual processor temperature. The motherboard then uses this information to optimally control the speed of the processor fan.
Figure 1 shows the current fan speed curve (Red) of a 3-wire, fan heat sink-thermistor based fan speed control. The additional curves in blue represent fan operations at lower CPU temperature and power consumption levels based on the 4-wire fan speed control fan heat sink.
The "Max Temp" in Figure 1 represents the upper set point or worse case ambient temperature of 39C. The "Min Temp" represents the lower set point or the slowest possible fan speed at an ambient temperature of 30°C. (see Table 1.)
The acoustic benefits of the 4-wire based fan speed control may vary depending on the specific motherboard implementation. The acoustic benefits are reliant on the motherboard design.
If the new 4-pin active fan heat sink solution is connected to an older 3-pin motherboard CPU fan header it will default back to a fan heat sink thermistor controlled mode, allowing compatibility with existing 3-pin motherboard designs. The fan heat sink has onboard circuitry that will control the fan speed based on internal chassis ambient temperature.
A 4-wire fan does not guarantee a quieter system. If the processor is being used in a hot environment and under heavy loads the fan will have to run fast enough to properly cool the processor. The internal chassis temperature is required to be maintained at 39°C (or lower). See the Integration Overview for Systems Based on the Boxed Intel Pentium D Processor in the LGA775 Package.
|For Boxed Intel® Pentium® D Processors in the 775-land package|
|Internal Chassis Temperature (°C)||Boxed Processor Fan Heat sink Set Points|
|X <= 301||Lower Set Point: Fan speed constant at lowest fan speed. Recommended temperature for nominal operating environment.|
|Y = 35||Recommended maximum internal chassis temperature for boxed Intel Pentium D Processor-based systems.|
|Z >= 391||Higher Set Point: Fan speed constant at highest fan speed.|
1 Set point variance is approximately ±1°C from fan heat sink to fan heat sink.
back to top
Allowing processors to operate at temperatures beyond their maximum specified operating temperature may shorten the life of the processor and can cause unreliable operation. Meeting the processor's temperature specification is ultimately the responsibility of the system integrator. When building quality systems using the boxed Intel Pentium D Processor, it is imperative to carefully consider the thermal management of the system and verify the system design with thermal testing. This document details specific thermal requirements of the boxed Intel Pentium D Processor. System integrators using the boxed Intel Pentium D Processor should become familiar with this document as well as the two related documents listed below.
Proper "thermal management" depends on two major elements: a heat sink properly mounted to the processor, and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature.
Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Boxed Intel® Pentium® D Processors are shipped with a high-quality variable speed fan heat sink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow.back to top
Fan Heat sink
The fan heat sink included with the boxed Intel® Pentium® D Processor must be securely attached to the processor. Thermal interface material (pre-applied attached to the bottom of the heat sink) provides effective heat transfer from the processor to the fan heat sink. The fan cable provides power to the fan by connecting to a motherboard-mounted power header and also allows the transfer of information to and from the fan with the motherboard. Only motherboards with hardware monitoring circuitry can use the fan speed signal. Additional circuitry is required for motherboard-based fan speed control. Be sure to follow the installation procedures documented in the boxed processor manual and the Integration Overview (for the boxed Intel Pentium D Processor in the 775-land package ).
The fan is a high-quality ball bearing fan that provides a good local air stream. This air stream transfers heat from the heat sink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heat sink will re-circulate warm air, and therefore may not cool the processor adequately.back to top
Thermal Interface Material replacement for fan heat sink
Thermal interface material is required for proper heat transfer from the processor to the fan heat sink. The boxed Intel® Pentium® D processor will have thermal interface material attached to the bottom of the heat sink.
- Thermal Interface Material (TIM) attached to the heat sink
Intel does not recommend the removal of the thermal interface material on the bottom of the boxed processor fan heat sink. Removal of this material may cause damage to the processor and will void the boxed processor warranty. If you must remove and re-use the fan heat sink, it will require replacement TIM. Also, if the thermal interface material is at all damaged, you must also clean and replace the TIM.
Intel recommends system integrators using ATX form factor motherboards to choose a chassis that complies with the ATX 2.01 (or later) specification. System integrators using microATX form factor motherboards should choose a chassis that complies with the microATX 1.0 (or later) specification.
A properly cooled system can help the processor run more reliably and minimize the acoustic noise levels generated from running the cooling fan at higher speeds. Intel thermal specifications require the use of a Thermally Advantaged Chassis (TAC) version 1.1 for Intel® Pentium® D Processor-based systems in the 775-land package.
We recommend using a chassis on the Tested Chassis List to ensure proper chassis airflow, electrical support (ATX12V or SFX12V power supply), and compatibility with boxed Intel Pentium D Processors using an Intel® Desktop Board. Chassis that pass this thermal testing provide system integrators with a starting place for determining which chassis to evaluate.
|Processor specification||PCG* = 05A||PCG* = 05B||PCG* = 05B (Extreme Edition)|
|Power supply requirement for 12V rail:||13A Continuous, 16.5A Peak for 10ms||16A continuous, 19A peak for 10ms||Two 12v rails each rated at: 8A continuous, 11A peak for 10ms|
|Board (chipset specific)||945/955X Chipset||945/955X Chipset||955X Chipset(Intel® Pentium® Processor XE 840), 975X chipset (Intel® Pentium® Processor XE 955)|
|Chassis||TAC 1.1||TAC 1.1 Tested for PCG 05B platform See tested chassis list||TAC 1.1 Tested for Extreme Edition CPU See tested chassis list|
back to top
Intel® Pentium® D Processor thermal specifications
The Pentium® D Processor datasheet listed in Table 2 shows the power dissipation of Intel Pentium D Processors at various processor numbers. For Pentium D processors in the 775-land package, processors with different Platform Compatibility Guides dissipate different amounts of heat. Typically the highest speed processor in a give Platform Compatibility Guide will dissipate the most power. The highest speed processor will be closest to the maximum specification. When building systems featuring many operating frequencies, testing should be performed using the highest frequency processor supported at the highest Platform Compatibility Guide supported. This dissipates the most power. System integrators can perform thermal testing using thermocouples to determine the temperature of the processor's integrated heat spreader.
See Intel® Pentium® Processor in the 775-land Package Thermal Design Guidelines for details, or the temperature of the air entering the boxed processor fan heat sink inlet.
See Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs.
A simple evaluation of the temperature of the air entering the fan heat sink can provide confidence in the system's thermal management. For boxed Intel Pentium D Processors, the testing point is at the center of the fan hub, approximately 0.3 inches above the fan. Evaluation of test data makes it possible to determine if a system has sufficient thermal management for the boxed processor. Systems based on Intel Pentium D Processor in the 775-land package should have a maximum expected temperature of 39°C in the maximum expected external ambient (which is typically 35°C).
|Processor Number||Processor Core Frequency(GHz)||Platform Compatibility Guide|| |
|Maximum Case Temperature (°C)|| |
Max. Recomnd. Fan Inlet Temp
|Processor Thermal Design Power (W)||Notes|
- Specifications are from the Intel® Pentium® D Processor in the 775-land Package Datasheet
- Specifications are from the Intel® Pentium® Processor Extreme Edition in the 775-land Package Datasheet
- This is a boxed Intel® Pentium® Processor with HT Technology Extreme Edition processor