Understanding Technical Documentation for Intel® Processors

Last Reviewed: 08-Sep-2017
Article ID: 000007291

The information contained in this document is designed to provide an understanding of the content contained in the many technical documents available for Intel® Processors. Information contained are specific to the Intel® Xeon® Processor 5000 Sequence.

Application notes:

  • AP-485 Intel® Processor Identification and the CPUID Instruction
    • This application note explains how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools. By taking advantage of the CPUID instruction, software developers can create software applications and tools that can execute compatibly across the widest range of Intel processor generations and models, past, present, and future.
  • Execute Disable Bit and Enterprise Security
    • Malicious buffer overflow attacks pose a significant security threat to businesses, increasing IT resource demands, and in some cases destroying digital assets. This application note provides an overview of the Execute Disable Bit as a solution. Provides information about how this technology helps the Enterprise infrastructure, wireless, and WLAN security.
  • Intel® Socket Test Technology for LGA771
    • Intel® Socket Test Technology for LGA771 has been developed to provide solder-joint and pin contact coverage for LGA771 sockets that have been assembled onto motherboards. This integrated silicon technology dramatically improves coverage (up to 90%), and enables motherboard makers to improve overall product quality and assembly process performance. This document includes the theory on which Intel® Socket Test Technology is based, typical test methods (powered and un-powered), and device specifications.

Boundary scan description language (BSDL) models:

  • These are the boundary scan description language (BSDL) files for Intel® Xeon® Processor 5000 Sequence. Boundary Scan is a method for testing interconnects. The Boundary Scan Description Language files define the Intel® Xeon® Processor 5000 Sequence scan chain.
  • There are separate models available for each of the specific series family for the Intel® Xeon® Processor 5000 Sequence.


  • Information contained in each datasheet is series family specific for the Intel® Xeon® Processor 5000 Sequence. The following information is included in standard Intel® Processor datasheet.
  • Introduction and definitions to commonly used terms and technologies
  • Electrical Specifications
    • Power and ground lands
    • Decoupling
    • Front side bus and processor clocking
    • Voltage Identification
    • Mixing of processor guidelines
    • Processor DC specifications
  • Mechanical Specifications
    • Package drawings
    • Keepout zones
    • Loading and handling guidelines
    • Processor materials
    • Markings and land coordinates
  • Land Listing
    • Lands listed by both name and number
  • Signal Definition
  • Thermal Specifications
    • Package thermal specifications
    • Processor thermal features
    • Platform environment control interface
  • Features
    • Power-on configuration options
    • Clock control and low power states
    • Enhanced Intel® SpeedStep® technology
  • Boxed Processor Specifications
    • Mechanical specifications
    • Electrical requirements
    • Fan and thermal solution specifications
    • Boxed processor contents
  • Debug Tools Specifications
    • Debug port system requirements
    • Target system implementation
    • Logic analyzer interface

Design guidelines:

  • This document discusses thermal management and measurement techniques for the Intel® Xeon® Processor 5000 Sequence, which is intended for dual processor server and workstation platforms. It address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to series family for the Intel Xeon Processor 5000 Sequence datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
  • Introduction and definitions to commonly used terms and technologies
  • Thermal/Mechanical Reference Design
    • Mechanical requirements
    • Processor thermal parameters and features
    • Characterizing cooling solution performance requirements
    • Thermal and mechanical reference design considerations
  • Alternative Heatsink Thermal and Mechanical Design
    • Performance characteristics
    • Profile adherence
  • Heatsink Clip Load Methodology
    • Overview
    • Test preparations
    • Typical and example tests
  • Safety Requirements
  • Quality and Reliability Requirements
    • Intel verification criteria for the reference design
  • Enabled Suppliers Information
    • Supplier information
    • Enabled and additional suppliers

Intel® 64 and IA-32 architectures software developer's manuals:

  • These manuals describe the architecture and programming environment of the Intel® 64 and IA-32 processors. Electronic versions of these documents allow you to quickly get to the information you need and print only the pages you want. At present, downloadable PDFs of Volumes 1 through 3 are at version 028 and printed manuals are at version 025. The downloadable PDF of the Intel 64 and IA-32 Architectures Optimization Reference manual.
  • Intel® 64 Architecture x2 APIC Specification
  • Application Note TLBs, Paging-Structure Caches, and Their Invalidation
  • Intel® 64 and IA-32 Architectures Software Developer's Manual
    • Documentation Changes
    • Volume 1: Basic Architecture
    • Volume 2A: Instruction Set Reference, A-M
    • Volume 2B: Instruction Set Reference, N-Z
    • Volume 3A: System Programming Guide
    • Volume 3B: System Programming Guide
    • Intel® 64 and IA-32 Architectures Optimization Reference Manual
    • Intel® SSE4 Programming Reference

Intel® Packaging information:

  • The Intel® Packaging Databook is intended to serve only as a data reference guide to Intel package selection and availability. As the packaging landscape changes very rapidly, information can become outdated very quickly. Please refer to the product specifications on the Products site for the most current detailed package information.
  • Introduction.
  • Package/Module/PC Card Outlines and Dimensions.
  • Alumina and Leaded Molded Technology.
  • Performance Characteristics of IC Packages.
  • Physical Constants of IC Package Materials.
  • ESD/EOS.
  • Leaded Surface Mount Technology (SMT).
  • Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs.
  • SMT Board Assembly Process Recommendations.
  • Shipping and Transport Media.
  • International Packaging Specifications.
  • Tape Carrier Package.
  • Pinned Packaging.
  • Ball Grid Array (BGA) Packaging.
  • The Chip Scale Package (CSP).
  • Cartridge Packaging.
  • Material Content of IC Packaging.
  • RoHS Material Declaration Data Sheets.

Specification updates:

  • This document is a compilation of device and documentation errata, specification clarifications and changes. It is intended for hardware system manufacturers and software developers of applications, operating systems, or tools.
  • Summary Tables of Changes.
  • Table listing all errata with their reference number, effected steppings, and brief description.
  • Specification changes.
  • Specification clarifications.
  • Documentation changes.
  • Identification information; Component Identification via Programming Interface.
  • Component marking information.
  • Identification information including sSpec, processor number, stepping, and other information.
  • Detailed errata information.

Thermal, mechanical, and component models:

  • Intel® Xeon® Processor 5400 Series Enabled CEK and Package Mechanical Model
  • Common Enabling Kit and Package Mechanical Model
  • Package Thermal Model

White papers:

  • Solving Power and Cooling Challenges for High Performance Computing
    • It takes a comprehensive strategy to scale high performance computing (HPC) capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® Processor and Intel® Itanium® Processor-based servers offer a critical new resource, delivering dramatic increases in performance, price/performance and energy-efficiency across a broad range of HPC applications.
  • Increasing Data Center Density While Driving Down Power and Cooling Costs
    • It takes a comprehensive strategy to scale data center capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® Processor-based servers provide a critical new resource, by delivering leading performance, price/performance and energy-efficiency for a broad range of business applications.
  • Building Cutting-Edge Server Applications
    • The Intel® Xeon® Processor Family features highly scalable performance, powered by the Intel NetBurst® microarchitecture with Hyper-Threading Technology. These technologies allow server applications to support more features, increase transaction throughput and response times, and serve more concurrent users.

Technologies / research:

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