Intel® Thermal Solution BXTS13X (PDF)
This manual has illustrated installation instructions for the boxed liquid-cooled Intel® Thermal Solution BXTS13X. This thermal solution supports LGA115x, LGA1366, LGA2011, LGA2011-v3 sockets.
LGA115x refers to the LGA1156, LGA1155, and LGA1150 sockets. Instructions are the same for these sockets since the sockets and thermal solution footprint are the same.
Two packets of Thermal Interface Material (TIM) are supplied with this thermal solution since the TIM is not pre-applied.
File name: TS13X_liquid_cooling_thermal_solution.pdf
Size: 3,017 KB
Date: September 2014
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