Processor Support for Intel® Server M50FCP Family


Install & Setup



The Intel® Server M50FCP Family includes two Socket-E LGA4677 processor sockets compatible with the 4th Generation Intel® Xeon® Scalable Processor family.

This article provides information on processor heat sinks, thermal design power (TDP), and population rules, including a processor family overview.


Previous-generation Intel® Xeon® Processors and Intel® Xeon® Scalable Processor families and their supported processor heat sinks are not compatible with server boards described in this document.

Processor Family Overview

Supported processor SKUs for this Intel® server product family can be identified as follows:
Intel® Xeon® Platinum 84xxxx
Intel® Xeon® Gold 64xxxx
Intel® Xeon® Gold 54xxxx
Intel® Xeon® Silver 44xxxx
Intel® Xeon® Bronze 34xxxx

The following figure illustrates how to identify supported processor SKUs.
how to identify supported processor SKUs

  • 4th Gen Intel® Xeon® Scalable processor SKU model numbers that end in (Q) are NOT supported.
  • Intel® Xeon® Bronze processor SKUs are supported in single processor configurations only

4th Gen Intel® Xeon® Scalable Processor Family Feature Comparison

Feature Platinum 8xxx
Gold 6xxx
Gold 5xxx
Silver 4xxx
# of Intel® UPI Links 3 3 3 2
Intel® UPI Speed 16 GT/s 16 GT/s 16 GT/s 16 GT/s
Supported Topologies 2S-2UPI
Node Controller Support No No No No
RAS Capability Advanced Advanced Advanced Standard
Intel® Turbo Boost Technology Yes Yes Yes Yes
Intel® Hyper-Threading Technology
(Intel® HT Technology)
Yes Yes Yes Yes
Intel® Advanced Vector Extensions 512
(Intel® AVX-512) ISA Support
Yes Yes Yes Yes
Intel® AVX-512 - # of 512b FMA Units 2 2 1 2
# of PCIe* Lanes 80 80 80 80
Intel® Volume Management Device
(Intel® VMD)
Yes Yes Yes Yes

Features may vary between processor SKUs

Supported Technologies

The 4th Gen Intel® Xeon® Scalable processors combine several key system components into a single processor package including the processor cores, Integrated Memory Controllers (IMCs), and Integrated IO Module.
The core features and technologies for the processor family include:

  • Intel® Ultra Path Interconnect (Intel® UPI): supports up to 16 GT/s
  • Intel® Speed Shift Technology
  • Intel® 64 architecture
  • Enhanced Intel® SpeedStep® Technology
  • Intel® Turbo Boost Technology 2.0
  • Intel® Hyper-Threading Technology (Intel® HT Technology)
  • Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x)
  • Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)
  • Execute Disable Bit
  • Intel® Trusted Execution Technology (Intel® TXT)
  • Intel® Advanced Vector Extensions (Intel® AVX-512)
  • Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
  • Intel® Deep Learning Boost (Intel® DL Boost) through VNNI
  • Intel® Speed Select Technology (Intel® SST) on select processor SKUs
  • Intel® Resource Director Technology (Intel® RDT)


Processor Heat Sink Module (PHM) Overview

The server board includes two processor socket assemblies, each consisting of a processor socket and bolster plate. The factory installed bolster plate is secured to the server board and is generally used to align
the processor cooling hardware over the processor socket and secure it to the server board.

Processor cooling options in a server system may use a passive or active heat sink that use airflow to dissipate heat generated by the processors. Other processor cooling options may use liquid cooling plates,
where cool liquid is pumped through the cooling plates to absorb and evacuate the heat from the processor. For air cooled systems. the processor and heat sink are generally pre-assembled into a single Processor
Heat-sink Module (PHM) before being installed onto the processor socket assembly. The PHM concept reduces the risk of damaging pins within the processor socket during the processor installation process.


The Intel® Server M50FCP Family only supports passive air-cooled options

A PHM assembly consists of a processor, a processor carrier clip, and the processor heat sink. The following figure identifies each component associated with the PHM and processor socket assembly.

example image
PHM Components and Processor Socket Reference Diagram

Figure above is intended as a general reference to components that make up the PHM and processor socket assemblies. The components shown may or may not match exactly what may be used. The diagram
does NOT define the process necessary to assemble the PHM or install it onto the processor socket. See Appendix H on Technical Product Specification document for recommended assembly and installation instructions

Processor Carrier Clips

There are two types of processor carrier clips supported by the 4th Gen Intel® Xeon® Scalable processor family for this server product family, they are identified as E1A and E1B.

example image example image
Supported Processor Carrier Clips

Each type of processor carrier clip will include identifier markings as shown in Figure below. The selected processor SKU determines which processor clip to use when assembling the processor heat
sink module (PHM). A processor carrier clip identifier marking will be etched onto the processor heat spreader as shown in Figure below

Processor Carrier Clip Identifier Markings

The etched identifier location in the figure above is for illustration purposes only. The actual location and color may be different on the actual processor and carrier clip

Disclaimer: Intel® server boards contain and support several high-density VLSI and power delivery components that need adequate airflow to cool and remain within their thermal operating limits. Intel
ensures through its own chassis development and testing that when an Intel server board and Intel chassis are used together, the fully integrated system meets the thermal requirements of these components. It is the responsibility of the system architect or system integrator who chooses to develop their own server system using an Intel server board and a non-Intel chassis, to consult relevant specifications and datasheets to determine thermal operating limits and necessary airflow to support intended system configurations and workloads when the system is operating within target ambient temperature limits. It is also their responsibility to perform adequate environmental validation testing to ensure reliable system operation. Intel cannot be held responsible if components fail or the server board does not operate correctly when published operating and non-operating limits are exceeded.


Processor Cooling Requirements

For the server system to support optimal operation and long-term reliability, the thermal management solution of the selected server chassis must dissipate enough heat generated from within the chassis to keep the processors and other system components within their specified thermal limits. For optimal operation and long-term reliability, processors in the 4th Gen Intel® Xeon® Scalable processor family must operate within their defined minimum and maximum case temperature (TCASE) limits. See the 4th Gen Intel® Xeon® Processor Scalable Family Thermal Mechanical Specifications and Design Guide for additional information concerning processor thermal limits.


It is the responsibility of the system and components architects to ensure compliance with the processor thermal specifications. Compromising processor thermal requirements impacts the processor performance and reliability.

Processor Thermal Design Power (TDP)

The Intel® Server Board M50FCP2SBSTD supports the 4th Gen Intel® Xeon® Scalable processor family with a maximum thermal design power (TDP) limit of 350 W


The maximum supported processor TDP at the system level may be lower than what the server board can support. Supported power, thermal, and configuration limits of the chosen server chassis / system need
to be considered to determine if the system can support the maximum processor TDP limit of the server board or not. Refer to the chosen server chassis/system documentation for additional processor support guidance.

Processor Population Rules


The server board may support dual-processor configurations consisting of different processors that meet the following defined criteria. However, Intel does not perform validation testing of this configuration.
In addition, Intel does not ensure that a server system configured with unmatched processors operates reliably. The system BIOS attempts to operate with processors that are not matched but are generally
compatible. For optimal system performance in dual-processor configurations, Intel recommends that identical processors be installed.

When using a single processor configuration, the processor must be installed in the processor socket labeled CPU_0.


Some server board features may not be functional unless a second processor is installed. For the Intel® Server Board M50FCP2SBSTD, see Server Board Architecture Overview on Technical Product Specification document.

When two processors are installed, the following population rules apply:

  • Both processors must have identical extended family, extended model number and processor type


  • Both processors must have the same number of cores.
  • Both processors must have the same cache sizes for all levels of processor cache memory.
  • Both processors must support identical DDR5 memory frequencies.

Processors with different steppings can be mixed in a system if the rules mentioned in the above bullets are met.

Population rules are applicable to any combination of processors in the 4th Gen Intel® Xeon® Scalable processor family