Summary of findings from the Responsible Business Alliance (RBA) Validated Audit Process (VAP) for Intel’s assembly and test facility in Chengdu, China. This was the second full VAP of the Intel Chengdu site; the first was in 2012. During the 2012 audit eight minor findings were identified and were closed prior to this audit in 2016. Auditors commended the facility in a number of areas.
See how the Intel® She Will Connect program is helping women change their lives.
The Maker Movement has the potential to change the future of computing for girls and women.
Intel CIO Paula Tolliver discusses her plans to accelerate the pace of business through IT innovation.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.