Platform engineering and logic technology development group leaders cover the 14 nm product development vision, multi-year product journeys to reinvent the notebook, and the new Intel® Core™ processor microarchitecture.
Intel's Babak Sabi shares how Embedded Multi-die Interconnect Bridge provides solutions for high-speed chip communication.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Introducing Jasper Forest: the newest addition to the Intel® Xeon® processor family.
Answers common questions about Intel® RSA hardware, including key messaging points and architecture specifications.
Shares how Compass* and Intel® Rack Scale Architecture support dynamic, software based infrastructure.