Certifies that Intel Corporation—D1 in Hillsboro, Oregon, complies with the ISO 9001:2015 requirements of wafer fabrication, associated equipment, and processes.
Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.