PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.