Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Gain SDN and NFV benefits on open, flexible, and high-performance infrastructure for evolving demands.
New features and capabilities help improve performance, energy efficiency, and security.
Intel® Integrated I/O merges the I/O controller onto the processor for reduced latency.
Get ultra-fast PC performance and tablet mobility for work and play with Intel® Core™ M processors.