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Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Intel’s ESD prevention methods prevent costly damage to electronic devices.