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Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Get ultra-fast PC performance and tablet mobility for work and play with Intel® Core™ M processors.
Provides searchable on-demand content and works on mobile devices throughout your home.
Watch how the SteadyServ iKeg* measures supply and delivers real-time analytics from the cloud.
Collaboration to streamline IoT