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Guide: Document provides overview of electrostatic discharge (ESD), and electrical overstress (EOS), includes common causes for ESD and EOS with preventative measures and Intel's strategy for eliminating damage.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.