Course DescriptionIn this training you will learn about design considerations for the Intel® Agilex™ FPGA. This training covers power delivery network, thermal design, board layout techniques and power solutions for your Intel® Agilex™ FPGA board design. It will introduce new power delivery network methodology to determine decoupling capacitors. Thermal design analysis and considerations will be introduced and include some examples of typical cooling solutions. Intel® Agilex™ FPGA hex ball pattern affecting PCB layout considerations will also be discussed. We will review improvements in the Power and Thermal calculator and then wrap up the course with Intel® Enpirion® Power solutions.
At Course Completion
You will be able to:
> Understand how to properly deliver power to the Intel® Agilex™ FPGA.
> Understand Thermal design flow methodology and determine what cooling solution best fits your board design.
> Understand the benefits of hex ball pattern in PCB layout.
> Understand Power design challenges and how to solve them with Intel® Enpirion® Power solutions.
> Familiarity with the Intel® Quartus® Prime Pro Edition design software.
Applicable Training Curriculum
This course is part of the following Intel FPGA training curriculum: