You can expect the solder balls of a BGA package to shrink by about a third after reflow.
For example, if the solder balls have a height of 0.3mm before reflow, they will shrink to a height of about 0.2mm after reflow.
Device Family: Intel® Arria® 10, Arria® II, Arria® V, Arria® GX, Intel® Cyclone®, Cyclone® II, Cyclone® III, Cyclone® IV, Cyclone® V, Intel® MAX® 10, MAX® II, MAX® V, Intel® Stratix®, Stratix® II, Stratix® III, Stratix® IV, Stratix® V, ACEX 1K, APEX 20K, APEX II, MAX 9000
Type: Answers
Area: Component