Article ID: 000084168 Content Type: Troubleshooting Last Reviewed: 11/05/2013

Bonding Does Not Work for Multiple MPFE Ports in Hard Memory Controller

Environment

  • Quartus® II Subscription Edition
  • BUILT IN - ARTICLE INTRO SECOND COMPONENT

    Critical Issue

    Description

    This problem affects DDR2, DDR3, and LPDDR2 products.

    In Arria V and Cyclone V devices, you can bond two hard memory controllers to increase their bandwidth. To use bonding, you must generate both hard memory interfaces with Export Bonding Interface turned on, and then connect the bonding signals between the two interfaces in the RTL code.

    Bonding is supported only for hard memory controllers configured with one port. Do not use the bonding configuration when there is more than one port in each hard memory controller.

    Resolution

    There is no workaround for this issue.

    For additional information, refer to Bonding Configurations and Parameter Requirements in the Functional Description - Hard Memory Interface chapter of the External Memory Interface Handbook, volume 3.

    This issue will not be fixed.

    Related Products

    This article applies to 1 products

    Arria® V FPGAs and SoC FPGAs