PCNs, PDNs, and Advisories

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Process Change Notifications

Title

Release Date
PCN 1912 Rev 1.1.0 Alternate Assembly Site for Selected Cyclone® III and Cyclone® IV Devices March 2020
PCN 1918 Bill of Material (BOM) Change for Selected Enpirion® Power SoC Devices Nov 2019
PCN 1909 Alternate Assembly Site for Selected Enpirion® Power SoC Devices July 2019
PCN 1817 Rev 1.1.0 Alternate Assembly and Test Site for Intel® Stratix®10 Devices May 2019
PCN 1907 Alternate Wafer Fabrication Site for Intel® Stratix®10 Devices April 2019
PCN 1904 Alternate Assembly Site for Selected Stratix® Device Family Variants April 2019
PCN 1807 Rev 1.1.0 Alternate Assembly Sites for Selected Enpirion® Power SoC Devices in QFN Modules with Metal Lids Aug 2018
PCN 1808 Alternate Assembly Site for Selected Enpirion® Power SoC Devices May 2018
PCN 1801 Capillary Underfill for Thermal Composite Flip Chip Ball Grid Array (BGA) Packages on Selected Arria II GX and Arria V Devices Jan 2018
PCN 1716 Rev 1.1.0 Substrate Material Change for Selected Stratix® GX Ball Grid Array Package Types Dec 2017
PCN 1717 Mold Compound Change for Selected Cyclone® and Cyclone® II devices in TQFP100/144 and QFP208 Packages Nov 2017
PCN 1714 Rev 1.1.0 Substrate Material Change for Selected Ball Grid Array – Wire Bond Package Types Sep 2017
PCN 1705 Rev 1.1.0 Substrate Material Change for Cyclone® III and MAX® II in FBGA-100/256/324 and UBGA-256 Packages Sep 2017
PCN 1701 Rev 1.1.0 Die Attach Film Material Change for Cyclone® V 484-Pin UBGA Package Apr 2017
PCN 1510 Rev 2.0.0 Bill of Materials (BOM) Change for MicroBGA Cyclone V Products Jul 2016
PCN 1604 Material Change for Cyclone III, Cyclone IV GX, Cyclone IV E Products in BGA Package Jul 2016
PCN 1512 Rev 2.0.0 Solder Paste (Inductor Attach) Change for Power Products in QFN Package May 2016
PCN 1606 Alternate Assembly Site for Cyclone IV FBGA-484/672/896 Pins Selected Devices Apr 2016
PCN 1502 Rev 1.2.0 Package Appearance Change Feb 2016
PCN 1505 Bill of Materials Change for Altera Enpirion QFN Packages Jul 2015
PCN 1408 Transfer of Wafer Bump Operations Apr 2015
PCN 1407 Additional Assembly Site for FLEX 6K and Stratix Products Nov 2014
PCN 1312 Rev 1.1.0 Additional Foundry Source for MAX II Z Products Nov 2013
PCN 1205 Rev 1.3.0 Additional Assembly Source (ASE) and Transition to Center Pin Gate Mold for FBGA Packages Jan 2013
PCN 1201 Additional Assembly Source (ASE) for the MAX V Device Family Apr 2012
PCN 1105 Rev 1.3.0 Introducing "Green" Materials and Bill of Material Change for the Cyclone II and MAX II Devices Mar 2012
PCN 1106 Rev 1.2.0 Additional Bill of Materials and Suppliers for Altera's Flip Chip and Wirebond BGA Packages Oct 2011
PCN 1003 Rev 1.2.0 Alternative Assembly Site for the EPCS Serial Configuration Device Family Mar 2011
PCN 1102 Additional Wafer Fabrication Site for Stratix IV, Arria II, and HardCopy Devices Jan 2011
PCN 1002 Additional Assembly Source and Power Quad Flat Pack (RQFP) 208 and 240 Package Conversion Jun 2010
PCN 0714 Rev 1.3.0 Assembly Plant Change for PQFP and TQFP Packages Jun 2010
PCN 0904 Rev 1.2.0 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Jun 2010
PCN 0902 Rev 1.1.0 Additional Assembly Source and Bill of Material Change for Altera Flip Chip Products Feb 2010
PCN 0805 Rev 1.6.0 Wafer Fabrication Site Change for Serial Configuration Devices Dec 2009
PCN 0903 Rev 1.0.1 Alternative Assembly Site for the EPC Configuration Family Nov 2009
PCN 0901 Rev 1.1.0 Substrate Change for Selected FBGA Packages Mar 2009
PCN 0513 Rev 1.2.1 Additional TSMC Wafer Fabrication Site Nov 2008
PCN 0813 Polyimide Wafer Coat Removal for Selected Altera Devices Oct 2008
PCN 0801 Rev 1.1.0 Alternative Manufacturing Site for EPCS Family Sep 2008
PCN 0808 Wire-Bond Diameter Reduction for Selected TQFP Packages Sep 2008
PCN 0803 Package-Lid Stiffener Change for the Stratix Flip-Chip Family Mar 2008
PCN 0802 Additional TSMC Wafer Fabrication Site for Cyclone III FPGAs Feb 2008
PCN 0715 Rev 1.1.1 Alternate Kyocera Substrate for Flip-Chip Packages Jan 2008
PCN 0716 Additional TSMC Wafer Fabrication Site for Stratix GX FPGAs Nov 2007
PCN 0708 Rev 1.1.0 Encapsulant Material Change for BGA Pb-Free Packages Oct 2007
PCN 0712 Mold Compound Changes for BGA, UBGA, MBGA and FBGA Packages Oct 2007
PCN 0702 Rev 1.2.0 Mold Compound Change for PQFP, PDIP, and RQFP Packages Sep 2007
PCN 0710 Discontinuance of QFP Carriers for MAX 7000 Devices Jul 2007
PCN 0707 Sealing Glass Change for Ceramic Dual In-Line Package Assembled in the Philippines Mar 2007
PCN 0701 EPCS16SI16N Process Change Jan 2007
PCN 0412 Rev01 FineLine BGA Substrate Second Source (Kinsus) Jul 2006
PCN 0602 Mold Compound Change for Cyclone II PQFP & TQFP Packages Apr 2006
PCN 0603 Cyclone II Family M4K Memory Block Modification Apr 2006
PCN 0517 Introducing Kinsus BT Substrate for BGA 600 and 652 Packages Mar 2006
PCN 0515 Mold Compound Change for FPGA Packages Jan 2006
PCN 0516 Mold Compound Change For PBGA Packages Dec 2005
PCN 0514 Manufacturing Changes on EPCS Family Oct 2005
PCN 0512 Implementing Standard Sumitomo-G6000 Series Mold Compound for PLCC Packages Aug 2005
PCN 0506 Addition of Intel Flash Memory as Source for EPC4, EPC8 & EPC16 Enhanced Configuration Devices Aug 2005
PCN 0504 Standardized EME-G700 Series Mold Compound for QFP Packages Jul 2005
PCN 0415 Additional Mold Compound for FBGA Packages from ASE Malaysia Nov 2004
PCN 0414 Standardized EME-G700 Mold Compound for TQFP Packages Nov 2004
PCN 0413 Additional Wafer Fabrication Site (Fab 14 ) Jul 2004
PCN 0410 Additional Assembly, Test, and FGI Location Jun 2004
PCN 0411 Additional Test and Finished Goods Inventory Location Jun 2004
PCN 0407 UFBGA 88 Package Substrate Change May 2004
PCN 0404 Additional Mold Compound for TQFP 144 Package Mar 2004
PCN 0310 Mold Compound Change for 100 Lead QFP Package Aug 2003
PCN 0304 300 MM Wafer Schedule May 2003
PCN 0216 New Wafer Fabrication Source Nov 2002
PCN 0214 Copper Lid for Selected Altera BGA and FineLine BGA Packages Oct 2002
PCN 0119 ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100 Nov 2001
PCN 0116 Amkor Korea will be added as a second source for FineLine BGA packages currently assembled in ASAT, Hong Kong Oct 2001
PCN 0114 Configuration Device Flash Memory Supply Source Addition Aug 2001
PCN 0113 FineLine BGA and QFP Package Assembly Site Addition Aug 2001
PCN 0109 ACEX 1K Device Process Improvement Jan 2001
PCN 0010 MAX 3000A Device Process Transition Nov 2000
PCN 0008 MAX 7000AE Device Process Transition Sep 2000
PCN 0005 EP20K400 Device Process Migration Mar 2000
PCN 9918 EPM7064 & EPM7064S Additional Source of Supply Dec 1999
PCN 9915 EPF10K50V Device Process Transition Aug 1999
PCN 9911 EPF10K50E And EPF10K200E Device Process Migration Jun 1999
PCN 9903 EPF6010A, EPF6016A, and EPF6024A devices transition to a 0.3-micron process at WaferTech Jan 1999
PCN 9901 FLEX 10K and FLEX 6016 devices transition to a 0.42-micron process at WaferTech Jan 1999
PCN 9810 EPF10K50V, EPF10K10A, EPF10K30A, and EPF10K100A devices move to a 0.3-micron process Aug 1998
PCN 9805 Additional source of supply for FLEX 10K and FLEX 6000 products May 1998
PCN 9802 EPC1064 and EPC1213 Devices Feb 1998
PCN 9703 MAX 7000 & MAX 9000 Feb 1997
PCN 9702 Transition Schedule Update EPM7256E Feb 1997
PCN 9616 Assembly & Test Site Addition Sep 1996
PCN 9619 EPM7192E & EPM7256E Devices Sep 1996
PCN 9612 Test & Shipment Site Addition Jun 1996
PCN 9604 MAX 9000 devices transitioned to a 0.65 micron process Mar 1996
PCN 9510 Transition of Classic devices to a 0.65-micron process Oct 1995
PCN 9509 Preliminary reliability data for the 8" 0.6-micron FLEX 8000A devices Sep 1995
PCN 9514 Additional source of supply for MAX 7000 devices Jun 1995
PCN 9501 Reliability data and transition dates for the EPM7032 assembled in ASE Penang Jan 1995
PCN 9407 MAX 5000 to transition from a 0.8-micron EPROM process to a 0.65-micron EPROM process, 1994 Jul 1994

Product Discontinuance Notices

Title

Release Date
PDN 2009 Intel is discontinuing the following Field Programmable Gate Array (FPGA) Flip Chip products that use leaded solder balls as second level interconnect and eutectic Tin-Lead bumps on the first level interconnect   Mar 2020
PDN 2007 Intel is discontinuing the following Field Programmable Gate Array (FPGA) Flip Chip products that use leaded solder bumps on the first level interconnect Mar 2020
PDN 1926 Rev 1.1.0 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following Field Programmable Gate Array (FPGA) Flip Chip products that currently use leaded solder bumps on the first level interconnect Aug 2019
PDN 1929 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following devices and their associated evaluation boards (EVB) and communication dongles April 2019
PDN 1928 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following devices and their associated evaluation boards (EVB) April 2019

PDN 1927 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following devices and their associated evaluation boards (EVB)

 April 2019
PDN 1810 Rev 1.1.0 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the EPC2, Cyclone®, and Stratix®GX product families Feb 2019 
PDN 1825 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the Stratix® V GT devices Nov 2018
PDN 1819 Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following OPNs based on 2018-2019 Plan of Record IP EOL Sep 2018
PDN 1816 Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the following SOC Embedded Design Suite DS5 product
 Aug 2018
PDN 1815 Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing the Selected Development Kit ordering Codes
 Aug 2018
PDN 1802 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) is discontinuing EPCQ (>=256Mb) and EPCQ-L configuration device product families Feb 2018
PDN 1708 Rev 1.1.0 Intel Programmable Solutions Group (“Intel PSG”, formerly Altera) will be discontinuing EPC Standard (excluding EPC2), EPC Enhanced, EPCS and EPCQ (=<128Mb) configuration device product families Feb 2018
PDN 1718 Intel® Programmable Solutions Group (“Intel® PSG”, formerly Altera) is discontinuing the Daisy-Chain sample devices. Nov 2017
PDN 1709 Intel® Programmable Solutions Group will be discontinuing Excalibur, Stratix, Stratix GX (only 17 part numbers affected) and MAX3000A FPGA and CPLD products Jun 2017
PDN 1707 Intel® Programmable Solutions Group's Power Product Group is obsoleting EP5387HQI and EP5387LQI devices Jun 2017
PDN 1702 -1S Intel® Programmable Solutions Group will be discontinuing select part numbers for 1S speed grade Arria 10 GX and Arria 10 SX Device families Feb 2017
PDN 1620 Intel® Programmable Solutions Group will be discontinuing some of the part numbers of the MAX product family Dec 2016
PDN 1619 Intel® Programmable Solutions Group will be discontinuing select legacy product families Nov 2016
PDN 1612 Altera will be discontinuing an Intel® MAX® 10 FPGA Evaluation Kit ordering code Jun 2016
PDN 1611 Altera will be discontinuing the Arria II GX FPGA development kit, 6G edition Jun 2016
PDN 1610 Altera will be discontinuing the ordering code EPCQ512SI16N Apr 2016
PDN1609: Altera will be discontinuing a Stratix III DSP Development Kit ordering code Apr 2016
PDN 1608 Altera will be discontinuing select Enpirion Power SoC ordering codes Apr 2016
PDN 1605 Altera will be discontinuing select Cyclone IV ordering codes in the QFN-148 package Mar 2016
PDN 1603 Altera will be discontinuing select Altera IP MegaCore function ordering codes Feb 2016
PDN 1504 Altera will be discontinuing select Enpirion Power SoC ordering codes Jun 2015
PDN 1410 Altera will be discontinuing select Altera IP MegaCore function ordering codes Nov 2014
PDN 1403 Altera will be discontinuing select Altera IP MegaCore function ordering codes Mar 2014
PDN 1310 Altera will be discontinuing the Cyclone III Embedded Systems Development Kit ordering code Sep 2013
PDN 1306 Altera will be discontinuing select Altera IP MegaCore ordering codes Jun 2013
PDN 1304 Altera will be discontinuing select Altera IP MegaCore ordering codes Apr 2013
PDN 1303 Altera will be discontinuing the Stratix IV E FPGA Development Kit ordering code Mar 2013
PDN 1208 Altera will be discontinuing select Nios II C-to-Hardware (C2H) Acceleration Compiler ordering codes Dec 2012
PDN 1207 Altera will be discontinuing select IP Reference Design ordering codes Nov 2012
PDN 0912 Altera will be discontinuing select APEX 20K ordering codes Oct 2009
PDN 0911 Altera will be discontinuing select APEX 20KE ordering codes Sep 2009
PDN 0906 Altera will be discontinuing the IP MegaCore® ordering codes listed in Table 1 of this document. Aug 2009
PDN 0903 Rev 1.0.1 Altera will be discontinuing select MAX 7000B, MAX 7000 and MAX 7000S device ordering codes Jun 2009
PDN 0704 Rev 1.1.0 Altera will be discontinuing the EPCS16SI16N ordering code Jan 2008
PDN 0711 Altera will be discontinuing select APEX 20KC, APEX II, FLEX 8000, MAX 7000B, MAX 9000, and Excalibur ordering codes May 2007
PDN 0706 Rev 2 Altera will be discontinuing select APEX 20K, APEX II, FLEX 8000, MAX 9000, and Excalibur ordering codes Feb 2007
PDN 0705 Altera will be discontinuing the EPM7096 products Feb 2007
PDN 0703 Altera will be discontinuing the PL-APU ordering code Feb 2007
PDN 0610: Altera will be discontinuing select programming adapter ordering codes Dec 2006
PDN 0609: Altera will be discontinuing the PL-MASTERBLASTER ordering code Dec 2006
PDN 0605 Altera will be discontinuing the remaining Classic device ordering codes Jul 2006
PDN 0604 Altera will be discontinuing select Classic device ordering codes Jun 2006
PDN 0518 Altera will be discontinuing select APEX II, APEX 20K, APEX 20KC, APEX 20KE,Classic, FLEX 8000, MAX 3000A, MAX 7000, MAX 7000B, and MAX 7000S ordering codes Dec 2005
PDN0510 Altera will be discontinuing select APEX 20K, APEX 20KC, APEX 20KE, APEX II, Classic, Configuration Device, FLEX 10KA, FLEX 10KE, FLEX 6000, FLEX 8000, MAX 7000, MAX 7000A, MAX 7000B, MAX 7000S, and MAX 9000 ordering codes Jul 2005
PDN 0509 Altera will be discontinuing select Classic and MAX 9000 ordering codes Jun 2005
PDN 0508 Altera will be discontinuing EPM7256A ordering codes Apr 2005
PDN 0507 Altera will be discontinuing EPM7128A ordering codes Apr 2005
PDN 0409 Altera has discontinued the ARM Developer Suite (ADS) Lite software tool for Altera Excalibur devices May 2004
PDN 0408 Altera will be discontinuing the PCI APEX Development Kits, and PCI32 Nios Target Add-On Kit May 2004
PDN0405 Altera has discontinued the Nios APEX Development Kits, Nios Ethernet Kit, and Nios Linux Development Kit. Apr 2004
PDN0402 Altera has discontinued the printed version of the MAX+PLUS II manual. Jan 2004
PDN0401 Altera will be discontinuing several APEX 20K ordering codes Jan 2004
PDN 0316 Altera will be discontinuing certain APEX 20KE device ordering codes Dec 2003
PDN 0315 Altera will be discontinuing certain configuration device ordering codes Dec 2003
PDN 0314 Altera will be discontinuing certain configuration, FLEX 10KA, FLEX 10KE, FLEX 6000, and FLEX 8000 device ordering codes Dec 2003
PDN 0313 Quartus II Software Support for Mentor Graphics Blast Software Oct 2003
PDN 0312 Altera will be discontinuing the IP MegaCore products listed in Table 1 Sep 2003
PDN 0311 Altera will be discontinuing the APEX DSP Development Kits Starter Version and Professional Edition products Aug 2003
PDN 0307 Altera will be discontinuing the ByteBlasterMV parallel port download cable Jun 2003
PDN 0303 Altera will be discontinuing some Excalibur board products Feb 2003
PDN 0302 Altera will be discontinuing ordering codes: PCI-BOARD/A4E & PCI-BOARD/A4E/UNIV Jan 2003
PDN 0221 Altera will be discontinuing ordering codes PCI-BOARD2/S & PCI-BOARD2/S/UNIV Dec 2002
PDN 0220 FLEX 10KA Product Ordering Codes to Become Obsolete Dec 2002
PDN 0218 Quartus II & MAX+PLUS II Software Operating System Support, October 30, 2002 Oct 2002
PDN 0204 Altera will be discontinuing certain APEX 20K, APEX 20KE, FLEX 10KE, and ACEX 1K device ordering codes Apr 2002
PDN 0203 Altera will be discontinuing certain MAX 7000S, MAX 7000A, and MAX 7000B device ordering codes Apr 2002
PDN 0209 Altera will be discontinuing certain QFP programming and development sockets Mar 2002
PDN 0124 Altera is discontinuing all extraction tools Dec 2001
PDN 0122 Altera will be discontinuing the PL-ASAP2 programming hardware and the PL-MPU and PLP6 components that comprise the PL-ASAP2 product Nov 2001
PDN 0118 Altera began launching new, flexible ways to purchase MegaCore IP functions Nov 2001
PDN 0117 Discontinued MAX 7000, MAX 9000, FLEX, and APEX 20K ordering codes, October 25, 2001 Oct 2001
PDN 0110 PCI-Board2, SOPC-Board/A6E, SOPC-Board/A10E to Become Obsolete Apr 2001
PDN 0107 Selected FLEX 8000, FLEX 10K, FLEX Devices 10KA, FLEX 10KE, and APEX 20K Jan 2001
PDN 0106 Selected MAX 9000 Devices Jan 2001
PDN 0103 Selected MAX 7000 Devices Jan 2001
PDN 0102 Selected Classic Devices Jan 2001
PDN 0007 EPF10K100B To Become Obsolete Jun 2000
PDN 9917 Selected Adapters to Become Obsolete Dec 1999
PDN 9907 EPM7032V to become obsolete Jun 1999
PDN 9817 Fourteen maintenance products are being discontinued Oct 1998
PDN 9816 Six development system products are being discontinued Aug 1998
PDN 9713 EPM7256SRC208-12 Update Sep 1997
PDN 9710 Selected programming adapters for the EPM5016 are being obsoleted Aug 1997
PDN 9709 Discontinued ordering codes and replacement products for Altera development tools Aug 1997
PDN 9625 FLASHlogic EPX880 & EPX8160 to Become Obsolete Dec 1996
PDN 9624 MAX 5000 Update Dec 1996
PDN 9620 FLASHlogic Download Cable (PL-FLDLC) Sep 1996
PDN 9618 Selected MAX 9000 Ordering Codes Sep 1996
PDN 9610 In 1996, Altera will be consolidating the MAX 5000 device family which will result in selected device ordering codes being discontinued as shown in the Product Discontinuance Notice Apr 1996
PDN 9603 Selected FLEX 8000 devices to be discontinued Feb 1996
PDN 9601 EPX780 to be discontinued Jan 1996
PDN 9517 FLEX 8000 & EPC1213 military device obsolescence schedule Dec 1995
PDN 9516 Selected MAX devices to be discontinued Dec 1995
PDN 9513 Military products to be discontinued Jun 1995
PDN 9512 Selected FLEX 8000 devices to be discontinued Jun 1995
PDN 9511 This notice is to announce Altera's intent to discontinue the EP310I device in 1996. The schedule for phase-out is noted in the Product Discontinuance Notice Jun 1995
PDN 9508 Selected Classic devices to be discontinued Jun 1995
PDN 9401 Phase-out of selected military devices previously acquired from Intel Jun 1995

Customer Advisory

Title

Release Date
ADV 2011 Discontinuance of Selected Intel® Quartus® II Software Subscription & Web Editions March 2020
ADV 2012 Intel® Stratix® 10 Device Datasheet Update March 2020
ADV 2010 Intel Acceleration Stack (IAS) for Xeon® CPUs with FPGAs update 1.2.1 for Intel® Programmable Acceleration Card (PAC) with Intel Arria®10 GX FPGA March 2020
ADV 2003 Rev 1.1.0 Intel® Arria® 10 Device EDCRC and Partial Reconfiguration Update  March 2020
ADV 2002 Label Content Update for FPGA and Power Products Jan 2020
ADV 2004 Intel® Cyclone® 10 Device EDCRC and Partial Reconfiguration Update  Jan 2020
ADV 2001 Pre-alert on End-of-Life (EOL) of Flip Chip Products with Leaded Solder Balls 2nd level interconnect Jan 2020
ADV 1920 Intel® Enpirion® Power Solutions Minor Label Content Change Dec 2019
ADV 1919 Intel® Stratix® 10 Device L-Tile and H-Tile Transceiver Calibration Code Firmware Update  Dec 2019
ADV 1916 Intel® Stratix® 10 SX and TX Hard Processor System Update Oct 2019
ADV 1910 Power Model Update to Selected Intel® Arria® 10 Devices Oct 2019
ADV 1915 Intel® Stratix® 10 Device Datasheet Update Sept 2019
ADV 1917 Intel® Enpirion® Power Solutions Package Outline Drawing Update Sept 2019
ADV 1828 Rev 1.1.0 Readiness Plan: EU RoHS Exemption 15 Scope Change  Sept 2019 
ADV 1913 Intel® Stratix® 10 Devices L-Tile and H-Tile Transceiver Update Aug 2019
ADV 1908 Conversion to Intel Packing Methodology (Change in Humidity Indicator Card Placement and Desiccant Quantity in Tray, Tape & Reel, and Tube Packed Products) July 2019 
ADV 1832 Rev 1.1.0 Datasheet Update for Arria®V Devices April 2019
ADV 1906 Intel® Stratix®10 FPGA Package Outline Drawings Now Available April 2019
ADV 1902 Intel® Stratix®10 FPGA Firmware Updates April 2019
ADV 1829 Intel Stratix®10 GX and SX L-Tile Device Updates Feb 2019 
ADV 1833 Datasheet Update for Stratix®V Devices Jan 2019
ADV 1831 Datasheet Update for Cyclone®V Devices Jan 2019 
ADV 1821 Ordering Part Number and Software Update for Intel® Programmable Acceleration Card with Intel® Arria®10 GX FPGA Oct 2018
ADV 1818 36-Month Shelf Life for Sealed, Dry-Packed Power Products Oct 2018
ADV 1820 Transition to Laser Marking for Bare Die and Molded Flip Chip Ball Grid Array Packages
 Oct 2018
ADV 1814 Conversion to Intel Processes and Services
 Aug 2018
ADV 1812 Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is notifying customers of a packing conversion Aug 2018
ADV 1805 Power Model Update to Intel® Cyclone®10 GX Devices Jul 2018
ADV 1804 Power Model Update to Intel® Arria®10 Devices Jul 2018
ADV 1806 Update to Package Outline Drawing Package Height Specification for Selected Intel® Arria®10 FBGA Flip Chip Packages May 2018
ADV 1803 Conversion to Intel Label and Packing Box Mar 2018
ADV 1719 Intel® Stratix® 10 FPGA IHS Dimple Fiducial Addition Jan 2018
ADV 1715 Intel® Arria® 10 Device Lifetime Guidance Update Aug 2017
ADV 1713 Intel STRATIX® 10 Top Mark Layout and Label Change Jul 2017
ADV 1712 Removal of 3-Year Date Code Shipment Restriction for Selected Configuration Devices (EPCQL; EPCQ 256Mb and larger) Jul 2017
ADV 1704 FineLine BGA-1152, 35x35 mm with >2.2 mm Thickness Shipping Tray Standardization Mar 2017
ADV 1616 Rev 1.0.1 Shelf Life Extension to 36 Months for Sealed, Dry-Packed Power Products Nov 2016
ADV 1613 Intel MAX 10 FPGA Product Family Ordering Information Update Sep 2016
ADV 1607 Replacement of EPCQ512SI16N with EPCQ512ASI16N Apr 2016
ADV 1601 Ink to Laser Mark Change for RQFP Packages Feb 2016
ADV 1513 Label Change for Enpirion Power Devices Jan 2016
ADV 1508 Acquisition of Altera Corporation by Intel Corporation Dec 2015
ADV 1511 Packing Reel Size Change from 13 Inch to 7 Inch
 Dec 2015
ADV 1509 Intel MAX 10 FPGA Product Family Ordering Information Update Nov 2015
ADV 1503 Altera Arria V SoC and Cyclone V SoC FPGA Product Family Ordering Information Update Mar 2015
ADV 1409 Logo Change on Intel® Arria 10 and MAX 10 Topside Mark Dec 2014
ADV 1405 Altera Cyclone V FPGA Product Family Ordering Information Update Aug 2014
ADV 1314 Acquisition of Enpirion Inc., by Altera Corporation Nov 2013
ADV 1313 Altera Cyclone V GX FPGA Development Kit Update Oct 2013
ADV 1311 PowerSoC Product Shipment Box and Label Format Changes Sep 2013
ADV 1309 Additional Dimples On Plastic BGA Package Top Surface Sep 2013
ADV 1307 Altera FPGA Product Family Ordering Information Update Jun 2013
ADV 1305 Altera Shipment Box and Label Changes May 2013
ADV 1301 Additional Dimples on PBGA Package Top Surface Mar 2013
ADV 1104 Rev 1.2.0 Second Foundry Source Qualification for the MAX II/G and MAX II Z Devices May 2012
ADV 1204 Additional Altera Company Label Included On the Moisture Barrier Bag for Altera Configuration Devices Apr 2012
ADV 1202 Full Laser Mark Introduction for Products Using Lidded/Heat Spreader Packages Feb 2012
ADV 1101 Enhancements to Altera Moisture Barrier Bag and Unit Box Labels Mar 2011
ADV 1103 Topside Mark Change for Altera Arria II GX Devices Jan 2011
ADV 1007 Rev 1.0.1 Additional Bump Line for Altera's Flipchip Devices Jan 2011
ADV 1005 Additional Assembly Site for the Arria II GX FBGA Package Oct 2010
ADV 0908 Rev 1.0.1 Product Shelf Life Extension to 36 Months Dec 2009
ADV 0907 Additional Assembly Plant for MBGA Packages Aug 2009
ADV 0901 Implementing New Shipping Carton Label Feb 2009
ADV 0813 Product Discontinuance Notice (PDN) Policy Nov 2008
ADV 0812 Additional Package Option for Selected Stratix III FPGA Devices May 2008
ADV 0804 TSMC Wafer Fabrication Sites for the Stratix III FPGA Family Mar 2008
ADV 0217 Rev 1.1.0 Full Laser Marking Introduction Feb 2008
ADV 0607 UFBGA 484 Package Coplanarity Enhancement Nov 2006
ADV 0601 Rev01 Addition of Assembly Plant for FBGA Packages Mar 2006
ADV 0505 Adding Daewon shipping tray for BGA and QFP Package Devices May 2005
ADV 0501 Implementing Pb-Free Marking Codes and Indication on Labels Mar 2005
ADV 0503 Serial Configuration Device Plating Standardization Mar 2005
ADV 0502 Serial Configuration Device Plating Standardization Mar 2005
ADV 0406 TQFP 32 Package Top Mold and Ejector Size Change May 2004
ADV 0306 Introduction of Dual Marking on MAX 3000A Devices May 2003
ADV 0305 Additional Source for Altera's PowerQuad Flat Pack Package for the FLEX 10K and APEX Device Families Mar 2003
ADV 0202 Schedule for the MAX 7000AE and MAX 3000A transition to a 0.30-µm process at TSMC, Taiwan Feb 2002
ADV 0201 Marking the assembly lot number and a one-line internal traceability code on all non-BGA packages Feb 2002
ADV 0115 EP20K200E and EP20K300E 652-pin BGA packages will be reinforced with a stiffener Dec 2001
ADV 0012 BGA Package Top Mark Enhancement Dec 2000
ADV 0009 FLEX 10K Transition Schedule Update Sep 2000
ADV 0003 Alternate QFP Shipping Trays Jan 2000
ADV 0001 Additional Assembly Location Jan 2000
ADV 9916 Top Mark Enhancement Nov 1999
ADV 9914 Additional Assembly Source Aug 1999
ADV 9912 FineLine BGA Packages Jun 1999
ADV 9910 Test and Shipment Site Addition Apr 1999
ADV 9909 EPF6016 and FLEX 10K Transition Schedule Update Apr 1999
ADV 9906 Change in Tray Temperature Tolerance Mar 1999
ADV 9904 Additional Source of Supply for Configuration Devices Jan 1999
ADV 9814 PLCC Moisture Sensitivity Level Reclassification Aug 1998
ADV 9812 EPC1064 and EPC1213 Transition Schedule Update Jul 1998
ADV 9809 PL-MANUAL, PL-MANUALWS, PL-MNLVHDL, and PL-MNLVERILOG manuals to be consolidated into PL-MANUAL Jun 1998
ADV 9803 EPM7032, EPM7160E, EPM9320, and EPM9560 Transition Schedule Update Mar 1998
ADV 9801 FLEX 10K Moisture Rating Enhancement Jan 1998
ADV 9712 FLEX 10K Additional Source of Supply Sep 1997
ADV 9708 MAX 7000 & MAX 9000 0.5-micron Transition Schedule Update Jun 1997
ADV 9707 Top Mark Traceability Enhancements May 1997
ADV 9705 RQFP & TQFP Moisture Reclassification May 1997
ADV 9701 Manufacturing Site Change Feb 1997
ADV 9606 MAX 5000 Transition Schedule Update Feb 1997
ADV 9623 FLEX 10K Ordering Code Change Dec 1996
ADV 9622 FLEX 8000 Ordering Code Change Dec 1996
ADV 9621 Classic Family Transition Schedule Update Nov 1996
ADV 9617 Date Code Format Aug 1996
ADV 9615 FLEX 10K Ordering Code Change Jun 1996
ADV 9614 Glass Seal PGA Jun 1996
ADV 9611 New Assembly Site Jun 1996
ADV 9608 EP9XX and EP18XX Ordering Code Change Mar 1996
ADV 9609 MAX 5000 Ordering Code Change Mar 1996
ADV 9607 Process transition update for Classic devices Jan 1996
ADV 9518 Ordering code changes for EP6xx devices Dec 1995
ADV 9505 FLEX 8000 devices in 208-, 240-, and 304-pin RQFP packages to be shipped in dry packs Jun 1995
ADV 9515 Errata for Process Change Notification 9407 Jun 1995
ADV 9507 Ordering code changes for Classic devices Jun 1995
ADV 9506 Ordering code change for the EPM7192, EPM7160, and EPM7128 devices Jun 1995
ADV 9502 Transition from a dual mark to a single mark for all products acquired from Intel Apr 1995
ADV 9401 New marking procedure for 240- and 304-pin power quad flat pack (RQFP) packages Dec 1994