| Customer Advisory |
| Title |
Release Date |
|---|
| ADV 1829 Stratix®10 GX and SX L-Tile Device Updates |
Feb 2019 |
| ADV 1833 Datasheet Update for Stratix®V Devices |
Jan 2019 |
| ADV 1832 Datasheet Update for Arria®V Devices |
Jan 2019 |
| ADV 1831 Datasheet Update for Cyclone®V Devices |
Jan 2019 |
| ADV 1828 Readiness Plan: EU RoHS Exemption 15 Scope Change |
Jan 2019 |
| ADV 1821 Ordering Part Number and Software Update for Intel® Programmable Acceleration Card with Intel Arria®10 GX FPGA |
Oct 2018 |
| ADV 1818 36-Month Shelf Life for Sealed, Dry-Packed Power Products |
Oct 2018 |
ADV 1820 Transition to Laser Marking for Bare Die and Molded Flip Chip Ball Grid Array Packages
|
Oct 2018 |
ADV 1814 Conversion to Intel Processes and Services
|
Aug 2018 |
| ADV 1812 Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is notifying customers of a packing conversion |
Aug 2018 |
| ADV 1805 Power Model Update to Cyclone®10 GX Devices |
Jul 2018 |
| ADV 1804 Power Model Update to Arria®10 Devices |
Jul 2018 |
| ADV 1806 Update to Package Outline Drawing Package Height Specification for Selected Arria®10 FBGA Flip Chip Packages |
May 2018 |
| ADV 1803 Conversion to Intel Label and Packing Box |
Mar 2018 |
| ADV 1719 Intel® Stratix® 10 FPGA IHS Dimple Fiducial Addition |
Jan 2018 |
| ADV 1715 ARRIA® 10 Device Lifetime Guidance Update |
Aug 2017 |
| ADV 1713 STRATIX® 10 Top Mark Layout and Label Change |
Jul 2017 |
| ADV 1712 Removal of 3-Year Date Code Shipment Restriction for Selected Configuration Devices (EPCQL; EPCQ 256Mb and larger) |
Jul 2017 |
| ADV 1704 FineLine BGA-1152, 35x35 mm with >2.2 mm Thickness Shipping Tray Standardization |
Mar 2017 |
| ADV 1616 Rev 1.0.1 Shelf Life Extension to 36 Months for Sealed, Dry-Packed Power Products |
Nov 2016 |
| ADV 1613 Altera MAX 10 FPGA Product Family Ordering Information Update |
Sep 2016 |
| ADV 1607 Replacement of EPCQ512SI16N with EPCQ512ASI16N |
Apr 2016 |
| ADV 1601 Ink to Laser Mark Change for RQFP Packages |
Feb 2016 |
| ADV 1513 Label Change for Enpirion Power Devices |
Jan 2016 |
| ADV 1508 Acquisition of Altera Corporation by Intel Corporation |
Dec 2015 |
ADV 1511 Packing Reel Size Change from 13 Inch to 7 Inch
|
Dec 2015 |
| ADV 1509 Altera MAX 10 FPGA Product Family Ordering Information Update |
Nov 2015 |
| ADV 1503 Altera Arria V SoC and Cyclone V SoC FPGA Product Family Ordering Information Update |
Mar 2015 |
| ADV 1409 Logo Change on Arria 10 and MAX 10 Topside Mark |
Dec 2014 |
| ADV 1405 Altera Cyclone V FPGA Product Family Ordering Information Update |
Aug 2014 |
| ADV 1314 Acquisition of Enpirion Inc., by Altera Corporation |
Nov 2013 |
| ADV 1313 Altera Cyclone V GX FPGA Development Kit Update |
Oct 2013 |
| ADV 1311 PowerSoC Product Shipment Box and Label Format Changes |
Sep 2013 |
| ADV 1309 Additional Dimples On Plastic BGA Package Top Surface |
Sep 2013 |
| ADV 1307 Altera FPGA Product Family Ordering Information Update |
Jun 2013 |
| ADV 1305 Altera Shipment Box and Label Changes |
May 2013 |
| ADV 1301 Additional Dimples on PBGA Package Top Surface |
Mar 2013 |
| ADV 1104 Rev 1.2.0 Second Foundry Source Qualification for the MAX II/G and MAX II Z Devices |
May 2012 |
| ADV 1204 Additional Altera Company Label Included On the Moisture Barrier Bag for Altera Configuration Devices |
Apr 2012 |
| ADV 1202 Full Laser Mark Introduction for Products Using Lidded/Heat Spreader Packages |
Feb 2012 |
| ADV 1101 Enhancements to Altera Moisture Barrier Bag and Unit Box Labels |
Mar 2011 |
| ADV 1103 Topside Mark Change for Altera Arria II GX Devices |
Jan 2011 |
| ADV 1007 Rev 1.0.1 Additional Bump Line for Altera's Flipchip Devices |
Jan 2011 |
| ADV 1005 Additional Assembly Site for the Arria II GX FBGA Package |
Oct 2010 |
| ADV 0908 Rev 1.0.1 Product Shelf Life Extension to 36 Months |
Dec 2009 |
| ADV 0907 Additional Assembly Plant for MBGA Packages |
Aug 2009 |
| ADV 0901 Implementing New Shipping Carton Label |
Feb 2009 |
| ADV 0813 Product Discontinuance Notice (PDN) Policy |
Nov 2008 |
| ADV 0812 Additional Package Option for Selected Stratix III FPGA Devices |
May 2008 |
| ADV 0804 TSMC Wafer Fabrication Sites for the Stratix III FPGA Family |
Mar 2008 |
| ADV 0217 Rev 1.1.0 Full Laser Marking Introduction |
Feb 2008 |
| ADV 0607 UFBGA 484 Package Coplanarity Enhancement |
Nov 2006 |
| ADV 0601 Rev01 Addition of Assembly Plant for FBGA Packages |
Mar 2006 |
| ADV 0505 Adding Daewon shipping tray for BGA and QFP Package Devices |
May 2005 |
| ADV 0501 Implementing Pb-Free Marking Codes and Indication on Labels |
Mar 2005 |
| ADV 0503 Serial Configuration Device Plating Standardization |
Mar 2005 |
| ADV 0502 Serial Configuration Device Plating Standardization |
Mar 2005 |
| ADV 0406 TQFP 32 Package Top Mold and Ejector Size Change |
May 2004 |
| ADV 0306 Introduction of Dual Marking on MAX 3000A Devices |
May 2003 |
| ADV 0305 Additional Source for Altera's PowerQuad Flat Pack Package for the FLEX 10K and APEX Device Families |
Mar 2003 |
| ADV 0202 Schedule for the MAX 7000AE and MAX 3000A transition to a 0.30-µm process at TSMC, Taiwan |
Feb 2002 |
| ADV 0201 Marking the assembly lot number and a one-line internal traceability code on all non-BGA packages |
Feb 2002 |
| ADV 0115 EP20K200E and EP20K300E 652-pin BGA packages will be reinforced with a stiffener |
Dec 2001 |
| ADV 0012 BGA Package Top Mark Enhancement |
Dec 2000 |
| ADV 0009 FLEX 10K Transition Schedule Update |
Sep 2000 |
| ADV 0003 Alternate QFP Shipping Trays |
Jan 2000 |
| ADV 0001 Additional Assembly Location |
Jan 2000 |
| ADV 9916 Top Mark Enhancement |
Nov 1999 |
| ADV 9914 Additional Assembly Source |
Aug 1999 |
| ADV 9912 FineLine BGA Packages |
Jun 1999 |
| ADV 9910 Test and Shipment Site Addition |
Apr 1999 |
| ADV 9909 EPF6016 and FLEX 10K Transition Schedule Update |
Apr 1999 |
| ADV 9906 Change in Tray Temperature Tolerance |
Mar 1999 |
| ADV 9904 Additional Source of Supply for Configuration Devices |
Jan 1999 |
| ADV 9814 PLCC Moisture Sensitivity Level Reclassification |
Aug 1998 |
| ADV 9812 EPC1064 and EPC1213 Transition Schedule Update |
Jul 1998 |
| ADV 9809 PL-MANUAL, PL-MANUALWS, PL-MNLVHDL, and PL-MNLVERILOG manuals to be consolidated into PL-MANUAL |
Jun 1998 |
| ADV 9803 EPM7032, EPM7160E, EPM9320, and EPM9560 Transition Schedule Update |
Mar 1998 |
| ADV 9801 FLEX 10K Moisture Rating Enhancement |
Jan 1998 |
| ADV 9712 FLEX 10K Additional Source of Supply |
Sep 1997 |
| ADV 9708 MAX 7000 & MAX 9000 0.5-micron Transition Schedule Update |
Jun 1997 |
| ADV 9707 Top Mark Traceability Enhancements |
May 1997 |
| ADV 9705 RQFP & TQFP Moisture Reclassification |
May 1997 |
| ADV 9701 Manufacturing Site Change |
Feb 1997 |
| ADV 9606 MAX 5000 Transition Schedule Update |
Feb 1997 |
| ADV 9623 FLEX 10K Ordering Code Change |
Dec 1996 |
| ADV 9622 FLEX 8000 Ordering Code Change |
Dec 1996 |
| ADV 9621 Classic Family Transition Schedule Update |
Nov 1996 |
| ADV 9617 Date Code Format |
Aug 1996 |
| ADV 9615 FLEX 10K Ordering Code Change |
Jun 1996 |
| ADV 9614 Glass Seal PGA |
Jun 1996 |
| ADV 9611 New Assembly Site |
Jun 1996 |
| ADV 9608 EP9XX and EP18XX Ordering Code Change |
Mar 1996 |
| ADV 9609 MAX 5000 Ordering Code Change |
Mar 1996 |
| ADV 9607 Process transition update for Classic devices |
Jan 1996 |
| ADV 9518 Ordering code changes for EP6xx devices |
Dec 1995 |
| ADV 9505 FLEX 8000 devices in 208-, 240-, and 304-pin RQFP packages to be shipped in dry packs |
Jun 1995 |
| ADV 9515 Errata for Process Change Notification 9407 |
Jun 1995 |
| ADV 9507 Ordering code changes for Classic devices |
Jun 1995 |
| ADV 9506 Ordering code change for the EPM7192, EPM7160, and EPM7128 devices |
Jun 1995 |
| ADV 9502 Transition from a dual mark to a single mark for all products acquired from Intel |
Apr 1995 |
| ADV 9401 New marking procedure for 240- and 304-pin power quad flat pack (RQFP) packages |
Dec 1994 |