Q1: Does Intel FPGA device comply with EU RoHS II?
A: Intel offers device packages that are fully compliant with the restriction of hazardous substances (RoHS) directive adopted by the European Union. Intel's Pb-free products are in full compliance with current RoHS II (Directive 2011/65/EU) requirements.
Q2: Where can I find Material Declaration report for a given OPN?
A: IPC has established a common platform for Material Composition Declaration. Intel has adopted the IPC-1752 reporting format for material declaration data exchange between Intel and the downstream supply-chain participants.
For IPC reports, please go to our Material Declaration site:
Q3: Where can I find ROHS certificate for a given OPN?
A: You can obtain the ROHS II declaration of conformity by entering Intel ordering part number in the Intel website below.
Q4: Would you please provide ROHS compliance letter?
A: You can download customer letter in Intel website below.
Q5: Do you have ROHS II report that covers additional 4 substances to meet 2015/863/EU directive?
A: Intel now plans to prepare for ROHS additional substances in 2015/863/EU below before the 22 July 2019 deadline.
Bis(2-ethylhexyl) phthalate (DEHP) (0.1 %)
Butyl benzyl phthalate (BBP) (0.1 %)
Dibutyl phthalate (DBP) (0.1 %)
Diisobutyl phthalate (DIBP) (0.1 %)
Q6: What do RoHS5 and RoHS6 mean? What is difference between Intel FPGA product with RoHS5 and RoHS6?
A: When a company uses the term RoHS 5 or RoHS 6 or ROHS 6/6, etc, the company has to provide the definition. The reason is that these are not industry terminology. This is a company specific vocabulary.
For Intel ROHS compliance, please refer to our website below.
Q7: How do I know if the device is a leaded or lead free device?
1. For FPGA, the OPN contains the denoting info. Please refer to the table below.
||OPN without suffix i.e. EP1C6Q240C8
|OPN with suffix “N” i.e. EP2S60F672I4N
||OPN with suffix “G” i.e. 5AGXFB3H4F35I3G
||Solder bump contains lead which is under ROHS exemption 15. It is ROHS compliant device.
2. For Enpirion, all Enpirion devices are lead free.
Q8: In the case that exemption15 is expired, do you have alternative device for Flip Chip?
A: Exemption 15 Working Group petitioning EU extension for boundary conditions for extension. Therefore, the Flip Chip devices with die > 300 mm2 or die using 90nm or older process will be kept with no change if it is granted by EU.
For other Flip Chip devices, Intel will have a qualified solution. RoHS-compliant flip-chip devices with no exemptions are denoted by suffix “G”.
Q9: What is ROHS status for “G” device?
A: It is ROHS compliant flip chip.
Q10: What is Exemption 15 and how does it relate to ROHS Compliance?
A: Exemption 15 allowed semiconductor manufacturers to use leaded bumps to attach the silicon die to the substrate. This creates a packaged semiconductor product. Intel supports two types of lead free products. The first are parts that require exemption 15 and they are designated with an N in the ordering code. The second are parts that do not require exemption 15 and they are designated with a G in the ordering code.
Q11: Will RoHS-compliant packages obsolete leaded packages?
A: No, Intel will continue to sell and support devices with both RoHS-compliant and leaded package options. However all parts remain subject to a yearly end-of-life review, the results of which may impact future availability of some device and package combinations.
Q12: Can I use both leaded and RoHS-compliant parts on the same board?
A: Although it is not recommended, we have seen many customers successfully use both leaded and RoHS-compliant parts on the same board. There are high-volume consumer products that are currently using both types of packages. However, using both leaded and RoHS-compliant parts together will add to the complexity of the manufacturing process. Customers are advised to perform thorough evaluation before going into volume production.
Q13: What issues should I be concerned about when dealing with RoHS-compliant products?
A: You should note that some alternative compounds have a higher melting point than the tin-lead compound. As such, a substantially higher re-flow temperature may be required for RoHS-compliant alternatives. Manufacturing equipment to handle material with these high temperatures, such as a multizone oven, is costly, and will require significant investment from your company or your contract manufacturer.
In addition, since RoHS-compliant is still a relatively new technology, the industry is still in the process of compiling its long-term reliability data. However, Intel has extensive expertise in this field, and works closely with customers to ensure a successful transition to RoHS-compliant products.
Q14: How do I order Intel RoHS-compliant products?
A: All devices on Intel RoHS-Compliant Product Offering list are standard RoHS-compliant devices, and are available directly from your distributor or through your normal sales channel. ROHS-compliant devices with leaded bumps (requires exemption 15) will be marked with a "N" and ROHS-compliant devices with unleaded bumps will be marked with a "G".
For Enpirion PowerSoCs, all Enpirion devices are lead free. No special ordering codes or suffixes are required for lead-free product ordering.
Q15: What are the special terms regarding devices not available in the RoHS-compliant "G" option (Products that do not require Exemption 15)?
A: Intel high volume products are already offered as RoHS-compliant solutions. For limited usage devices, Intel requires a volume commitment from a customer for the RoHS-compliant option. Please contact your local Intel sales representative for details.
Q16: Eventually, I will need to transition to RoHS-compliant products after the exemption expires, but I do not have a set date. Is there anything I need to do right now?
A: Intel RoHS-Compliant Product Offering list provides an easy way to check the availability of devices you will need. As long as the device you want is listed on the availability sheet, no additional work is required until your transition date is set.