Packaging Device Information

The following table lists the device, number of pins, part number, silicon type, package type, and downloadable package drawing for the devices.


For information about trays, tubes, and dry packs, refer to Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices (PDF). .

Restriction of hazardous substances (RoHS)-compliant devices are compatible with leaded-reflow temperatures. For more information, refer to Extended Temperature Device Support page.

For moisture sensitivity level of Intel FPGA devices, go to Moisture Sensitivity Level Calculator.

For package information of other device families, go to Package and Thermal Resistance.