Package information includes the ordering code reference, package acronym, leadframe material, lead finish (plating), JEDEC® outline reference, lead coplanarity, weight, moisture sensitivity level, and other special information. The thermal resistance information includes device pin count, package name, and resistance values.
Package and Thermal Resistance
| Stratix Series | Arria Series | Cyclone Series | MAX Series | HardCopy Series | Serial Configuration Devices |
|---|---|---|---|---|---|
| Stratix V | Arria 10 | Cyclone 10 | MAX 10 | HardCopy IV | EPCQ-A |
| Stratix IV | Arria V | Cyclone V | MAX V | HardCopy III | EPCQ-L |
| Stratix III | Arria II | Cyclone IV | MAX II | EPCQ | |
| Cyclone III | EPCS |
For other devices not listed in the table above, please see the Devices Packaging Datasheet.
Search using Package Drawing Search.
For other related packaging technical information, refer to the following literature.
| Packaging |
| Title |
|---|
| Application Notes |
| AN752: Guidelines for Handling Altera Wafer Level Chip Scale Package (This application note provides guidelines for handling Altera’s Wafer Level Chip Scale Package (WLCSP) components.) |
| AN657: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices (This application note provides guidance on thermal management and mechanical handling of thermal composite flip chip ball-grid array (TCFCBGA) for Altera devices. ) |
| AN659: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array (This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array (FCBGA) for Altera devices. ) |
| AN 114: Designing with High-Density BGA Packages for Intel Devices |
| AN 353: SMT Board Assembly Process Recommendations |
| AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless Devices |
| White Papers |
| Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components |