Components & Interface:Expansion: Generic, HSMC; Industry Standard: RS232, USB Device; Video: ASI
End Market: Automotive, Computer & Storage, Industrial, Wireless, Wireline
Technology: DSP, Embedded Design, General Purpose, Interface Protocols
MAX Series:Intel® MAX® 10: Intel® MAX® 10 DA
Board Feature:General User IO: Dip Rocker Switch, LED, Push Button
The MAX10 System on Module is a board level solution for applications which require an FPGA. It is suitable for both development work on a bench top or embedding into products for production. The Zephyr/Falcon Nano MAX10-SoM provides all the functionality of the Intel 10M08DAF256I7G and has built in clocks, power supplies, USB, WiFi and connectors. It can save system and design engineers months of development time. To better meet the needs for specific applications and bring down costs for production quantities, standard configuration options available for the MAX10-SoM are:
- 2k, 8k and 50k logic elements,
- USB, Bluetooth, Ethernet and/or Audio,
- USB Blaster,
- LEDs and switches, and
- 40 pin header, HSMC and/or FMC connectors.
Custom configurations of hardware and software are available through Zephyr Engineering and Falcon Nano.
With a temperature rating of -40 to 185°F (-40 to +85°C), specific applications include: industrial IoT, cubesats, automotive (Grade 3 & 4), drones, etc.
Customer to contact manufacturer with claim of defect in materials or workmanship within 90 days after the date of the product was purchased, as stated on the sales invoice. RMA # shall be provided for product return to manufacturer, transportation prepaid by the Customer. Manufacturer shall determine whether to repair, replace or refund.
N. CE Mark shall be obtained when marketing effort expands to Europe or North America, or customer has need.
Conflict Mineral Policy Compliant
Test Plan Summary
A burn-in/test for 100% functionality performed on each unit shipped. Process is completely automated using a MAX10-SoM programmed to perform the test.
\nTest will be fully automated, including actuators to push and pull the dip switches. WiFi and USB communication between device under test and the testing module.
ISO 9000 & 9001; FCC (Federal Communications Commission)
Design Solutions Network Members provide products and/or services that are sold or licensed by the Member and not Intel® or its affiliates. Intel® and its affiliates hereby disclaim any express or implied warranty of any kind including warranties of merchantability, noninfringement of intellectual property, or fitness for any particular purpose with respect to any such products and/or services.