Terasic Cyclone V SoC Development Kit with HSMC Connector (DE10-Standard)
Board Image
Block Diagram
Overview
The DE10-Standard Development Kit presents a robust hardware design platform built around the Intel® System-on-Chip (SoC) FPGA, which combines the latest dual-core Cortex-A9 embedded cores with industry-leading programmable logic for ultimate design flexibility. Users can now leverage the power of tremendous re-configurability paired with a high-performance, low-power processor system. Intel SoC integrates an ARM*-based hard processor system (HPS) consisting of processor, peripherals and memory interfaces tied seamlessly with the FPGA fabric using a high-bandwidth interconnect backbone. The DE10-Standard development board includes hardware such as high-speed DDR3 memory, video and audio capabilities, Ethernet networking, and much more.
Development Kit Hardware Contents
- 110K LEs; 925MHz; A Dual-Core ARMCortex-A9MPCore Processor;
- 6 FPGA PPLs and 3 HPS PLLs; 3.125G Transceivers; MicroSD Card Socket
- On-Board USB Blaster II; 64GB DDR3 SDRAM on FPGA; 1GB DDR3 SDRAM on HPS
- One HSMC Connector; One LTC Connector; 24-bit VGA DAC; 128X64 dots LCD Module with Backlight
- G-Sensor; 10/100/1000 Ethernet on HPS; Temperature Sensor on FPGA;
Development Kit Software Contents
- Linus BSP (Board Support Package)
- DE10-Standard Panel
- DE10-Standard System Builder
- DE10-Standard OpenCL BSP
- OpenCV application
Support Document
| File Name | Description | Version |
|---|---|---|
| doc-us-dsnbk-42-5505271707235-de10-standard-user-manual-sm.pdf | DE10-Standard User Manual | 1.0 |
Board Quality Metrics
| Basic |
|
|---|---|
| Latest version of Quartus supported | 16.1 |
| Required Collateral Available | |
| User Guide | Y |
| Board Schematics | Y |
| Reliability / Quality Assurance | |
Defects per Million Opportunities (DPMO) | N/A |
| Parts per Million (PPM) | N/A |
| Board Policy | |
| Return Material Authorization (RMA) Policy | If you want to make a return, please write an email to us within 7 days after you’ve received the product. The product must be unopened. (If the package is damaged upon receipt, please take photos and inform us immediately.) For more details, please visit: RMA.Terasic.com |
| Compliance | |
| RoHS Compliant | Y |
| CE Compliant | N. N/A |
| Conflict Mineral Policy Compliant |
Y |
| Test Plan Summary | |
|
Reference Designs from System CD for customers to access all the peripherals on board. |
|
| Additional Compliance | |
| ISO 9000 & 9001 |
|
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