VF360 3U OpenVPX Conduction-cooled FPGA & DSP Processing module

The VF360 is a 3U OpenVPX module that leverages on Intel® Stratix® V FPGA andTexas Instruments KeyStone Multicore DSP technology to provide an ultra-highbandwidth processing platform, ideally suited for computation and bandwidthintensive applications such as Radar, Networking, SIGINT, EW, SDR and Video.The onboard multicore DSP from Texas Instruments provides the flexibility toperform complex post processing functions more suited for the processordomain. High bandwidth communication between the DSP and FPGA is providedthrough both PCIe and Serial Rapid IO (SRIO) interfaces.The Stratix� V FPGA has two banks of dedicated DDR3 and QDRII+ memories foralgorithms with high bandwidth and/or large memory size requirements. Highspeedserial interfaces to the OpenVPX data plane and the FMC site creates abundant FPGA IO throughput.The VF360 acts as an FMC carrier to provide a modular solution that accommodatesa wide range of I/O requirements.The VF360 conforms to the OpenVPX standard and operates as a Payloadmodule with System Controller capability. Both air-cooled and conduction cooledversions are available. Further flexibility is provided through build options to cater for10 different FPGAs from Intel Stratix V GX and GS device families

• VF360 3U OpenVPX CC module with Stratix® V GXA3 FPGA & 4-core DSP Processor

• VF360 Board Support Package with Linux distribution (drivers), Sample application and Firmware Reference Design

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