Power Analyzer Operating Conditions Report
Reports the operating conditions used during power analysis performed using
the Power Analyzer.
The report contains the following
information:
- Device power characteristics shows the device power characteristics as specified in the Operating Settings and Conditions page.
- Voltages shows the voltages used during power estimation.
- Auto computed junction temperature shows the user-entered or auto-computed temperatures used during power estimation.
Note: If you implemented
a cooling solution that does not include a heat sink, the report can contain the
following categories under Auto computed junction
temperature:
- Auto computed junction temperature
- Ambient temperature
- Board temperature
- Junction-to-case thermal resistance
- Case-to-heat sink thermal resistance
- Heat sink-to-ambient thermal resistance
- Junction-to-board thermal resistance
If you implemented a cooling solution that includes a heat sink, the report can contain the following categories:
- Auto computed junction temperature
- Ambient temperature
- Junction-to-case thermal resistance
- Case-to-ambient thermal resistance
- Board model used shows the model of board in the design if the device family supports board modeling.