Intel Agilex Device Family Pin Connection Guidelines

RSS

PCG-01023 | 2020.01.23

1. Intel Agilex Device Family Pin Connection Guidelines

1.1. Intel Agilex FPGA Core Pins

1.1.1. Clock and PLL Pins

Note: Intel^® recommends that you create an Intel^® Quartus^® Prime design, enter your device I/O assignments, and compile the design. The Intel^® Quartus^® Prime software will check your pin connections according to I/O assignment and placement rules. The rules differ from one device to another based on device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.

Table 1. Clock and PLL Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`CLK_[T,B]_2[A,B,C,D]_[0:1][p,n]` `CLK_[T,B]_3[A,B,C,D]_[0:1][p,n]`	I/O, Clock Input	Dedicated high speed clock input pins that can be used for data inputs or outputs. Differential input OCT Rd, single-ended input OCT Rt, and single-ended output OCT Rs are supported on these pins. When you do not use these pins as dedicated clock pins, you can use them as regular I/O pins. Supported I/O standards: 1.2V True Differential Signaling Maximum clock frequency is 400MHz. Edge rate is 250ps at 20–80%. These pins have an internal 10-kΩ pull up.	Tie the unused pins to GND. If the pins are not connected, use the Intel^® Quartus^® Prime software programmable options to internally bias these pins. These pins can be reserved as inputs tristate with weak internal pull-up resistor enabled, or as outputs driving GND.
`PLL_[2][A,B,C,D]_[T,B]_FB[0:1]` `PLL_[3][A,B,C,D]_[T,B]_FB[0:1]`	I/O, Clock	Dual-purpose I/O pins that can be used as single-ended inputs, single-ended outputs, or external feedback input pins. For more information about the supported pins, refer to the device pin-out file. Supported I/O standards: 1.2V True Differential Signaling Maximum clock frequency is 400MHz. Edge rate is 250ps at 20–80%. These pins have an internal 10-kΩ pull up.	Tie the unused pins to GND. If the pins are not connected, use the Intel^® Quartus^® Prime software programmable options to internally bias these pins. These pins can be reserved as inputs tristate with weak internal pull-up resistor enabled, or as outputs driving GND.
`PLL_[2][A,B,C,D]_[T,B]_CLKOUT[0:1][p,n]` `PLL_[3][A,B,C,D]_[T,B]_CLKOUT[0:1][p,n]`	I/O, Clock	I/O pins that can be used as two single-ended clock output pins or one differential clock output pair. For more information about the supported pins, refer to the device pin-out file. Supported I/O standards: 1.2V True Differential Signaling Maximum clock frequency is 400MHz. Edge rate is 250ps at 20–80%. These pins have an internal 10-kΩ pull up.	Tie the unused pins to GND. If the pins are not connected, use the Intel^® Quartus^® Prime software programmable options to internally bias these pins. These pins can be reserved as inputs tristate with weak internal pull-up resistor enabled, or as outputs driving GND.

1.1.2. Dedicated Configuration/JTAG Pins

Table 2. Dedicated Configuration/JTAG Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`TCK`	Input	Dedicated JTAG test clock input pin located in the Secure Device Manager (SDM) bank. This pin can also be used to access the HPS JTAG chain. For more information, refer to the HPS JTAG Pins. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-down resistor. JTAG clock speed is 33 MHz for JTAG split mode. In the JTAG split mode, the SDM JTAG mode is independent of the HPS JTAG. JTAG clock speed is 22 MHz for JTAG daisy-chain mode. In the JTAG daisy-chain mode, the HPS DAP TAP is daisy chained with the SDM mTAP.	Connect this pin through a 1-kΩ pull-down resistor to GND. If the JTAG interface is not used, connect this pin through a 1-kΩ pull-down resistor to GND.
`TMS`	Input	Dedicated JTAG test mode select input pin located in the SDM bank. This pin can also be used to access the HPS JTAG chain. For more information, refer to the HPS JTAG Pins. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-up resistor.	Connect this pin to a 1-kΩ – 10-kΩ pull-up resistor to the VCCIO_SDM supply. If the JTAG interface is not used, connect the TMS pin to the VCCIO_SDM supply using a 1-kΩ resistor.
`TDO`	Output	Dedicated JTAG test data output pin located in the SDM bank. This pin can also be used to access the HPS JTAG chain. For more information, refer to the HPS JTAG Pins. This pin support the 1.8-V single-ended I/O standard.	If the JTAG interface is not used, leave the TDO pin unconnected.
`TDI`	Input	Dedicated JTAG test data input pin located in the SDM bank. This pin can also be used to access the HPS JTAG chain. For more information, refer to the HPS JTAG Pins. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-up resistor.	Connect this pin to a 1-kΩ – 10-kΩ pull-up resistor to the VCCIO_SDM supply. If the JTAG interface is not used, connect the TDI pin to the VCCIO_SDM supply using a 1-kΩ resistor.
`nSTATUS`	Output	Configuration status pin. This pin is used to report configuration status after the configuration source has been selected. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-up resistor. The drive strength is 8 mA.	When you are using the Avalon^® -ST configuration scheme, connect this pin to the configuration host. For other configuration schemes, you can use this pin to monitor the configuration status. This pin must be pulled up through a 10-kΩ resistor to VCCIO_SDM for all configuration schemes.
`nCONFIG`	Input	By default, this pin indicates configuration status. This pin can also be configured as a GPIO pin. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-up resistor. The drive strength is 8 mA.	When you use the Avalon^® -ST configuration scheme, connect this pin directly to the configuration host. When you use other configuration schemes, pull this pin to VCCIO_SDM through an external 10-KΩ pull-up resistor. When you use other configuration schemes, this pin can be used to restart configuration by driving it low and then high again.
`OSC_CLK_1`	Input	Reference clock source for SDM PLL. This pin is used as the clock for device configuration and transceiver calibration. This pin support the 1.8-V single-ended I/O standard. This pin has an internal 20-kΩ pull-down resistor.	You must provide an external clock source to this pin if you are using transceivers. If you choose to use the external clock source for configuration and/or instantiate any transceivers in your design, you must provide a 25-MHz, 100-MHz, or 125-MHz free-running clock source to this pin and enable it in the Intel^® Quartus^® Prime software when you compile your design. If you are using the internal oscillator for configuration and do not instantiate any transceivers in your design, leave this pin unconnected.

1.1.3. Optional/Dual-Purpose Configuration Pins

Table 3. Optional/Dual-Purpose Configuration Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`AVST_DATA[31:0]`	I/O, Input	Dual-purpose configuration data input pins. Use AVST_DATA[15:0] pins for Avalon^® Streaming Interface ( Avalon^® -ST) x16 mode, AVST_DATA [31:0] pins for Avalon^® -ST x32 mode, or as regular I/O pins. This pin support the 1.2-V I/O standard. This pin has a 10-kΩ internal pull-up resistor.	If these pins are not used as the dual-purpose pins and they are not used as I/O pins, leave these pins unconnected.
`AVST_READY(3A bank)`	I/O, Input	Dual-purpose Avalon^® -ST interface data ready input pin. This pin is used for the Avalon^® -ST x16 and x32 configuration schemes. This pin cannot be used as a user I/O pin if you are using the AVST x16 or AVST x32 configuration scheme. This pin supports the 1.2V LVCMOS I/O standard. This pin has a 10-kΩ internal pull-up resistor.	Connect this pin to the ready signal output of the external configuration controller when configuring using the Avalon^® -ST x16 or x32 interface.
`AVST_CLK(3A bank)`	I/O, Input	Dual-purpose Avalon^® -ST interface clock input pin. This pin is used for the Avalon^® -ST x16 and x32 configuration schemes. This pin can also be used as a user I/O pin after configuration. This pin supports the 1.2V LVCMOS I/O standard. This pin has a 10-kΩ internal pull-up resistor.	Connect this pin to the clock signal of the external configuration controller when configuring using the Avalon^® -ST x16 or x32 interface. Connect unused pins as defined in the Intel^® Quartus^® Prime software.
`AVST_VALID(3A bank)`	I/O, Input	Dual-purpose configuration data valid pin. This pin is used for the Avalon^® -ST x16 and x32 configuration schemes. This pin can also be used as a user I/O pin after configuration. This pin supports the 1.2V LVCMOS I/O standard. This pin has a 10-kΩ internal pull-up resistor.	Connect this pin to the data valid signal of the external configuration controller when configuring using the Avalon^® -ST x16 or x32 interface. Connect unused pins as defined in the Intel^® Quartus^® Prime software.

1.1.4. Differential I/O Pins

Table 4. Differential I/O Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`DIFF_RX[2][A,B,C,D][1:24][p,n]` `DIFF_RX[3][A,B,C,D][1:24][p,n]`	I/O, RX channel	These are differential receiver channels on GPIO banks. If these pins are not used as RX differential signals, these pins are available as user I/O pins. Supported I/O standards: 1.5-V I/O standard for differential input 1.2-V I/O standard for single-ended voltage referenced and non-voltage referenced I/O 1.2-V I/O standard for differential voltage referenced I/O These pins have an internal 10-kΩ pull-up resistor.	Connect unused pins as defined in the Intel^® Quartus^® Prime software.
`DIFF_TX[2][A,B,C,D][1:24][p,n]` `DIFF_TX[3][A,B,C,D][1:24][p,n]`	I/O, TX channel	These are differential transmitter channels on GPIO banks. If these pins are not used as TX differential signals, these pins are available as user I/O pins. Supported I/O standards: 1.5-V I/O standard for differential output 1.2-V I/O standard for single-ended voltage referenced and non-voltage referenced I/O 1.2-V I/O standard for differential voltage referenced I/O These pins have an internal 10-kΩ pull-up resistor.	Connect unused pins as defined in the Intel^® Quartus^® Prime software.

1.1.5. External Memory Interface Pins

Table 5. External Memory Interface Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`DQS[0:63]`	I/O, bidirectional	Optional data strobe signal for use in external memory interfacing. These pins drive to the dedicated DQS phase shift circuitry. Supported I/O standards: POD 1.2-V I/O standard SSTL 1.2-V I/O standard	Connect unused pins as defined in the Intel^® Quartus^® Prime software.
`DQSn[0:63]`	I/O, bidirectional	Optional complementary data strobe signal for use in external memory interfacing. These pins drive to the dedicated DQS phase shift circuitry. Supported I/O standards: POD 1.2-V I/O standard SSTL 1.2-V I/O standard	Connect unused pins as defined in the Intel^® Quartus^® Prime software.
`DQ[0:63]`	I/O, bidirectional	Optional data signal for use in external memory interfacing. The order of the DQ bits within a designated DQ bus is not important. However, if you plan on migrating to a different memory interface that has a different DQ bus width, you need to reevaluate your pin assignments. Analyze the available DQ pins across all pertinent DQS columns in the device pin-out file. Supported I/O standards: POD 1.2-V I/O standard SSTL 1.2-V I/O standard	Connect unused pins as defined in the Intel^® Quartus^® Prime software.

1.1.6. Voltage Sensor and Voltage Reference Pins

Table 6. Voltage Sensor and Voltage Reference Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`VREFP_ADC`	Input	Dedicated precision analog voltage reference.	Tie these pins to GND for the Intel^® Agilex™ ES device.
`VREFN_ADC`	Input	Dedicated precision analog voltage reference.	Tie these pins to GND for the Intel^® Agilex™ ES device.
`VSIGP_[0,1]`	Input	Analog differential inputs pins used with the voltage sensor inside the FPGA to monitor external analog voltages.	Tie these pins to GND for the Intel^® Agilex™ ES device.
`VSIGN_[0,1]`	Input		Tie these pins to GND for the Intel^® Agilex™ ES device.

1.1.7. Remote Temperature Sensing Diode Pins

Table 7. Remote Temperature Sensing Diode Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`TEMPDIODE0[A,C][p,n]`	Input	These pins connect to the internal temperature sensing diodes in the FPGA core and corner areas of the FPGA.	Connect these pins to an external temperature sensing device to allow sensing of the FPGA's temperature. If you do not use the temperature sensing diode with an external temperature sensing device, leave these pins unconnected. For more information about the locations and channel numbers of the temperature sensors, refer to the Intel^® Agilex™ Sensor Monitoring System chapter in the Intel^® Agilex™ Power Management User Guide.
`TEMPDIODE[1,4][p,n]`	Input	These pins connect to the internal temperature sensing diodes in the E-tile and P-tile transceivers.	Connect these pins to an external temperature sensing device to allow sensing of the E-tile and P-tile temperature. If you do not use the temperature sensing diode with an external temperature sensing device, leave these pins unconnected. For more information about the locations and channel numbers of the temperature sensors, refer to the Intel^® Agilex™ Sensor Monitoring System chapter in the Intel^® Agilex™ Power Management User Guide.

1.1.8. Reference Pins

Table 8. Reference Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`RZQ_[T,B]_2[A,B,C,D]` `RZQ_[T,B]_3[A,B,C,D]`	I/O, bidirectional	Reference pins for I/O banks. The RZQ pins share the same VCCIO_PIO with the I/O bank where they are located. Connect the external precision resistor to the designated pin within the bank. If not required, this pin is a regular I/O pin. These pins support 1.2-V I/O standard. These pins have an internal 10-kΩ pull-up resistor.	When using OCT, tie these pins to GND through a 240-Ω resistor, depending on the desired OCT impedance. When you do not use these pins as dedicated input for the external precision resistor or as I/O pins, leave these pins unconnected.

1.1.9. No Connect and DNU Pins

Table 9. No Connect and DNU Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
DNU	Do Not Use	Do Not Use (DNU).	Do not connect to power, GND, or any other signal. These pins must be left floating. There are some exceptions for the following pins of the Intel^® Agilex™ ES devices: DNU50 (pin BN48), DNU51 (pin BV57), and DNU52 (pin BU54) must be pulled to GND with the 0Ω resistor. DNU17 (pin AT19) and DNU18 (pin AP17) must be pulled up via a 10kΩ to VCCCLK_GXE.
NC	No Connect	Do not drive signals into these pins.	When designing for device migration, you have the option to connect these pins to either power, GND, or a signal trace depending on the pin assignment of the devices selected for migration. However, if device migration is not a concern, leave these pins floating.

1.1.10. Power Supply Pins

Note: Intel^® recommends you to generate a .pin file from the Intel^® Quartus^® Prime Fitter to verify power pin assignment. Intel^® also recommends using this .pin file to determine if it is safe to power down or ground certain power supplies for your specific design. This step will inform you to make the appropriate design choices for unused power supplies for your design.

Table 10. Power Supply Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`VCCP`	Power	VCCP supplies power to the periphery.	VCC and VCCP must operate at the same voltage level, should share the same power plane on the board, and be sourced from the same regulator. For details about the recommended operating conditions, refer to the Electrical Characteristics section in the Intel^® Agilex™ Device Data Sheet. Use the Intel^® FPGA Power and Thermal Calculator and the Intel^® Quartus^® Prime Power Analyzer to determine the current requirements for VCCP and other power supplies. Decoupling for these pins depends on the decoupling requirements of the specific board.
`VCC`	Power	VCC supplies power to the core.	VCC and VCCP must operate at the same voltage level, should share the same power plane on the board, and be sourced from the same regulator. For details about the recommended operating conditions, refer to the Electrical Characteristics section in the Intel^® Agilex™ Device Data Sheet. Use the Intel^® FPGA Power and Thermal Calculator and the Intel^® Quartus^® Prime Power Analyzer to determine the current requirements for VCC and other power supplies. Decoupling for these pins depends on the decoupling requirements of the specific board.
`VCCPT`	Power	Power supply for the IOPLL, programmable power technology, and I/O pre-drivers.	Connect VCCPT to a 1.8V low noise switching regulator. You have the option to source the following from the same regulator as VCCPT: VCCPLL_SDM, VCCPLL_HPS, and VCCADC with proper isolation filtering For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide. For the power rail sharing, refer to the Power Supply Sharing Guidelines for Intel^® Agilex™ Devices.
`VCCR_CORE`	Power	Transceiver core power supply. For use in Intel^® Agilex™ production devices only (placed here for migration purposes).	For Intel^® Agilex™ production devices, tie this pin to a 1.2-V supply. You have the option to source VCCR_CORE from the same regulator as VCCIO_PIO only when you are using the DDR4 I/O standard. For Intel^® Agilex™ ES devices, the VCCR_CORE pin is a no connect (NC).
`VCCH`	Power	Analog Interface Bridge (AIB) and digital transceiver power supply.	Connect all VCCH pins to a 0.9V low noise switching power supply. For more details, refer to the Intel^® Agilex™ Device Data Sheet.
`VCCH_SDM`	Power	VCCH voltage rail sense.	Connect this pin to the VCCH voltage rail.
`VCCA_PLL`	Power	I/O clock network power supply.	For Intel^® Agilex™ ES devices, connect VCCA_PLL to a 1.8V low noise switching regulator. You have the option to source VCCA_PLL from the same regulator as VCCPT with proper isolation filtering. For Intel^® Agilex™ ES devices, the VCCA_PLL rail must reside in Group 2 power rails. For Intel^® Agilex™ production devices, connect VCCA_PLL to a 1.2V low noise switching regulator. You have the option to source VCCA_PLL from the same regulator as VCCIO_PIO with proper isolation filtering. For Intel^® Agilex™ production devices, the VCCA_PLL rail must reside in Group 3 power rails.
`VCCIO_PIO[2][A,B,C,D]` `VCCIO_PIO[3][A,B,C,D]`	Power	These are the supply voltage pins for the I/O banks. Each bank can support a different voltage level. Supported VCCIO standards include the following: 1.2-V LVCMOS SSTL12/Diff SSTL12 HSTL12/ Diff HSTL12 HSUL12/ Diff HSUL12 POD12/ Diff POD12 True Differential Signaling	Connect these pins to a 1.2-V or 1.5-V supplies, depending on the I/O standard required by the specific bank. You have the option to power down unused I/O banks by connecting their VCCIO_PIO pin to GND. During the power-up sequence only, a transient current whose magnitude is less than the VCCIO_PIO operating static current may be observed as the VCCIO_PIO transistors become operational. This is the expected behavior and will neither cause any functional failure nor reliability concerns to the device if the power-up or power-down sequence is followed. For more details, refer to the Intel^® Agilex™ Sensor Monitoring System chapter in the Intel^® Agilex™ Power Management User Guide. For the power rail sharing, refer to the Power Supply Sharing Guidelines for Intel^® Agilex™ Devices.
`VCCIO_PIO_SDM`	Power	VCCIO_PIO voltage rail sense line.	Connect these pins to bank VCCIO_PIO 3A.
`VCCIO_SDM`	Power	Configuration pins power supply.	Connect these pins to a 1.8-V power supply. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide. For the power rail sharing, refer to the Power Supply Sharing Guidelines for Intel^® Agilex™ Devices.
`VCCPLLDIG_SDM`	Power	SDM block PLL power pins.	VCCPLLDIG_SDM must be sourced from the same regulator as VCCL_SDM with proper isolation filtering.
`VCCL_SDM`	Power	SDM power supply.	Connect these pins to a 0.8-V power supply.
`VCCBAT`	Power	Battery back-up power supply for device security Advanced Encryption Standard, Battery-backed RAM (AES BBRAM) key register.	When using the device security AES BBRAM key, connect this pin to a non-volatile battery power source in the range of 1.0V – 1.8V. When not using the AES BBRAM key, tie this pin to the 1.8-V VCCPT. Provide a minimum decoupling of 47nF for the VCCBAT power rail near the VCCBAT pin. For the power rail sharing, refer to the Power Supply Sharing Guidelines for Intel^® Agilex™ Devices.
`VCCPLL_SDM`	Power	VCCPLL_SDM supplies analog power to the SDM block PLLs.	With proper isolation filtering, you have the option to source VCCPLL_SDM from the same regulator as VCCPT. Decoupling for these pins depends on the design decoupling requirements of the specific board.
`GND`	Ground	Device ground pins.	Connect all GND pins to the board ground plane.
`VREFB[2][AN0,BN0,CN0,DN0]` `VREFB[3][AN0,BN0,CN0,DN0]`	Power	Input reference voltage for each I/O bank. If a bank uses a voltage-referenced I/O standard, then use these pins as voltage-reference pins for the bank.	If VREF pins are not used, connect them to GND.
`VCCLSENSE`	Output	Differential sense line to external regulator.	VCCLSENSE and GNDSENSE are differential remote sense pins for the VCC power. Connect your regulators’ differential remote sense lines to the respective VCCLSENSE and GNDSENSE pins. This compensates for the DC IR drop associated with the PCB and device package from the VCC power. Route these connections as differential pair traces and keep them isolated from any other noise source. You must connect the VCCLSENSE and GNDSENSE lines to the regulator’s remote sense inputs.
`GNDSENSE`	Output	Differential sense line to external regulator.
`VCCADC`	Power	ADC power pin for the voltage sensors.	You must supply a low noise 1.8-V power supply to this pin if you are using the internal voltage sensors of the Intel^® Agilex™ device. When you are using the voltage sensors, tie this pin to VCCPT with proper isolation filtering. Tie this pin to VCCA_PLL.
`VCCFUSEWR_SDM`	Power	The required power supply to program (write) the optional, one-time programmable eFuses. These eFuses are an integral part of the Intel^® Agilex™ security architecture. For more information, refer to the Intel^® Agilex™ Configuration User Guide.	This voltage rail can be set anywhere between 1.4V and 2.4V.

1.1.11. Secure Device Manager (SDM) Pins

Table 11. SDM Pins—Preliminary
Pin Name	Pin Description	MSEL[2:0]	Pin Functions	Connection Guidelines
`RREF_SDM`	Reference resistor input for the PLLs of the SDM interface.	—	Input to read reference resistance	Connect a 2kΩ +/-1% resistor to GND.
`SDM_IO0`	This pin is pulled low internally by a 20-kΩ resistor when the device is powered up.	Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO1`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA2	Connect this pin to the data2 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_DATA1	Connect this pin to the data1 pin of the QSPI flash device when configuring from the QSPI flash device.
		3'b100	SDMMC_CFG_DATA1	Connect this pin to the data1 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO2`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA0	Connect this pin to the data0 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_CLK	Connect this pin to the clock input of the QSPI flash device when configuring from the QSPI flash device.
		3'b100	SDMMC_CFG_DATA0	Connect this pin to the data0 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO3`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA3	Connect this pin to the data3 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_DATA2	Connect this pin to the data2 pin of the QSPI flash device when configuring from the QSPI flash device.
		3'b100	SDMMC_CFG_DATA2	Connect this pin to the data2 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO4`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA1	Connect this pin to the data1 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_DATA0	Connect this pin to the data0 pin of the QSPI flash device when configuring from the QSPI flash device.
		3'b100	SDMMC_CFG_CMD	Connect this pin to the command input of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO5`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin will function as MSEL[0] during power up and reset to determine the configuration scheme. Once the pin completes the MSEL function, it will then function according to the configuration scheme you have selected. For more information, refer to the Intel^® Agilex™ Configuration User Guide.	—	MSEL[0]	This pin needs to be pulled-up to VCCIO_SDM or pulled-down to GND through a 4.7-kΩ resistor depending on your configuration scheme.
		3'b001 or 3'b011	AS_nCSO0	Connect this pin to the nCS input of the first QSPI flash device when configuring from QSPI flash devices.
		3'b100	SDMMC_CFG_CCLK	Connect this pin to the clock input of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO6`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA4	Connect this pin to the data4 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_DATA3	Connect this pin to the data3 pin of the QSPI flash device when configuring from the QSPI flash device.
		3'b100	SDMMC_CFG_DATA3	Connect this pin to the data3 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO7`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin will function as MSEL[1] during power up to determine the configuration scheme. Once the pin completes the MSEL function, it will then function according to the configuration scheme you have selected. For more information, refer to the Intel^® Agilex™ Configuration User Guide.	—	MSEL[1]	This pin needs to be pulled-up to VCCIO_SDM or pulled-down to GND through a 4.7-kΩ resistor depending on your configuration scheme.
		3'b001 or 3'b011	AS_nCSO2	Connect this pin to the nCS input of the third QSPI flash device when you use cascaded QSPI flash devices for HPS application.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO8`	This pin is pulled low internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_READY	Connect this pin to the ready signal output of the external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b001 or 3'b011	AS_nCSO3	Connect this pin to the nCS input of the fourth QSPI flash device when you use cascaded QSPI flash devices for HPS application. Connect with a 1-kΩ pull-up resistor to VCCIO_SDM.
		3'b100	SDMMC_CFG_DATA4	Connect this pin to the data4 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO9`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin will function as MSEL[2] during power up to determine the configuration scheme. Once the pin completes the MSEL function, it will then function according to the configuration scheme you have selected. For more information, refer to the Intel^® Agilex™ Configuration User Guide.	—	MSEL[2]	This pin needs to be pulled-up to VCCIO_SDM or pulled-down to GND through a 4.7-kΩ resistor depending on your configuration scheme.
		3'b001 or 3'b011	AS_nCSO1	Connect this pin to the nCS input of the second QSPI flash device when you use cascaded QSPI flash devices for HPS application.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO10`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA7	Connect this pin to the data7 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b100	SDMMC_CFG_DATA7	Connect this pin to the data7 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO11`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_VALID	Connect this pin to the data valid pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
`SDM_IO11`		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO12`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up.	—	Any MSEL setting	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO13`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA5	Connect this pin to the data5 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b100	SDMMC_CFG_DATA5	Connect this pin to the data5 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO14`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_CLK	Connect this pin to the clock output of an external configuration controller when configuring using the Avalon-ST x8 interface.
`SDM_IO14`		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO15`	This pin is pulled high internally by a 20-kΩ resistor when the device is powered up. This pin functions differently depending on the configuration scheme used by setting the MSEL pins.	3'b110	AVSTx8_DATA6	Connect this pin to the data6 pin of an external configuration controller when configuring using the Avalon-ST x8 interface.
		3'b100	SDMMC_CFG_DATA6	Connect this pin to the data6 pin of the SD/MMC card flash device when configuring from the SD/MMC flash.
		Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.
`SDM_IO16`	This pin is pulled low internally by a 20-kΩ resistor when the device is powered up.	Any valid MSEL setting	Optional signals	The connection guidelines for this pin has dependency on signal assignments. For more information, refer to the Secure Device Manager (SDM) Optional Signal Pins.

1.1.12. Secure Device Manager (SDM) Optional Signal Pins

Table 12. SDM Optional Signal Pins—Preliminary
Signal Name	Signal Description	Connection Guidelines	Configuration Schemes
Signal Name	Signal Description	Connection Guidelines	ASx4	AVSTx8	AVSTx16	AVSTx32
PWRMGT_SCL	PMBus Power Management Clock. This pin is used as the clock pin for the PMBus interface.	This pin requires a pull-up resistor to the 1.8V VCCIO_SDM supply. Intel^® recommends a pull-up value of 5.1-kΩ to 10-kΩ depending on the loading of this pin. Use the voltage level translators when interfacing to the PMBus interfaces requiring voltages other than 1.8V. Connect this pin to the PMBus clock pin of your regulator. When a –V device is used, you must enable the SmartVID connection between the device and the VCC voltage regulator to allow the FPGA to directly control its core voltage requirements. You can do this by connecting the PWRMGT_SCL and PWRMGT_SDA signals to the VCC voltage regulator for the PMBus master mode and the PWRMGT_SCL, PWRMGT_SDA, and PWRMGT_ALERT signals to the external master controller for the PMBus slave mode.	SDM_IO0 SDM_IO14	SDM_IO0	SDM_IO0 SDM_IO14	SDM_IO0 SDM_IO14
PWRMGT_SDA	PMBus Power Management Serial Data. This pin is used as the data pin for the PMBus interface.	This pin requires a pull-up resistor to the 1.8V VCCIO_SDM supply. Intel^® recommends a pull-up value of 5.1-kΩ to 10-kΩ depending on the loading of this pin. Use the voltage level translators when interfacing to the PMBus interfaces requiring voltages other than 1.8V. Connect this pin to the PMBus data pin of your regulator. When a –V device is used, you must enable the SmartVID connection between the device and the VCC voltage regulator to allow the FPGA to directly control its core voltage requirements. You can do this by connecting the PWRMGT_SCL and PWRMGT_SDA signals to the VCC voltage regulator for the PMBus master mode and the PWRMGT_SCL, PWRMGT_SDA, and PWRMGT_ALERT signals to the external master controller for the PMBus slave mode.	SDM_IO11 SDM_IO12 SDM_IO16	SDM_IO12 SDM_IO16	SDM_IO11 SDM_IO12 SDM_IO16	SDM_IO11 SDM_IO12 SDM_IO16
PWRMGT_ALERT	PMBus Power Management Alert. This pin is used as the ALERT function for the PMBus interface when the Intel^® Agilex™ –V device is the PMBus slave.	This pin requires a pull-up resistor to the 1.8V VCCIO_SDM supply. Intel^® recommends a pull-up value of 5.1-kΩ to 10-kΩ depending on the loading of this pin. Use the voltage level translators when interfacing to the PMBus interfaces requiring voltages other than 1.8V. Connect this pin to the PMBus ALERT pin of the external master controller. When using the SmartVID feature with the Intel^® Agilex™ –V device as a PMBus slave, you must connect the PWRMGT_ALERT signal along with the PWRMGT_SCL and PWRMGT_SDA signals to the PMBus master device to complete the SmartVID power management interface. The PMBus master device reads the VID codes from the Intel^® Agilex™ slave and programs the voltage regulator to output the correct VID voltage.	SDM_IO0 SDM_IO12	SDM_IO0 SDM_IO9 SDM_IO12	SDM_IO0 SDM_IO9 SDM_IO12	SDM_IO0 SDM_IO12
CONF_DONE	The CONF_DONE pin indicates all configuration data has been received.	By default, Intel^® recommends using the SDM_IO16 pin to implement the CONF_DONE function. If SDM_IO16 is unavailable, the CONF_DONE function can also be implemented using any unused SDM_IO pins. Except for SDM_IO0 and SDM_IO16, other SDM_IO pins are required to connect to an external 4.7-kΩ pull-down resistor for the CONF_DONE signal. Connect the CONF_DONE pin to the external configuration controller when configuring using the Avalon^® -ST (AVST) interface. You have an option to monitor this signal with an external component if you are using the active serial (AS) x4 configuration scheme.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO12 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO6 SDM_IO7 SDM_IO8 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO8 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16
INIT_DONE	The INIT_DONE pin indicates the device has enter user mode upon completion of configuration. When used for this purpose, this pin must be enabled by the Intel^® Quartus^® Prime software. When the INIT_DONE function is enabled, this pin will drive high when configuration is completed and the device goes into user mode.	Intel^® recommends you to use SDM_IO0 or SDM_IO16 to implement the INIT_DONE function when available as it has an internal weak pull-down for the correct function of INIT_DONE during power up. If SDM_IO0 and SDM_IO16 are unavailable, SDM_IO5 can also be used for the INIT_DONE function when the configuration mode is set to Avalon^® –ST x8 or Avalon^® –ST x32 (AVST x8 or AVST x32) as these modes require an external 4.7–kΩ pull-down resistor. If SDM_IO0, SDM_IO5, and SDM_IO16 are unavailable, the INIT_DONE function can also be implemented using any unused SDM_IO pins provided that an external 4.7–kΩ pull-down resistor is provided for the INIT_DONE signal.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO12 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO6 SDM_IO7 SDM_IO8 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO8 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16
CvP_CONFDONE	The CvP_CONFDONE pin indicates the device has received the complete bitstream during configuration via protocol (CvP) core image configuration. When used for this purpose, enable this pin using the Intel^® Quartus^® Prime software.	Connect this output pin to an external logic device that monitors the CvP operation. The VCCIO_SDM power supply must meet the input voltage specification of the receiving side.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO7 SDM_IO9 SDM_IO12 SDM_IO16	—	—
SEU_ERROR	The SEU_ERROR pin drives high to indicate there is an SEU error message inside the SEU error queue. This pin stays high whenever the error message queue contains one or more error messages. The SEU_ERROR signal goes low only when the SEU error message queue is empty. When used for this purpose, enable this pin using the Intel^® Quartus^® Prime software.	Connect this output pin to an external logic device that monitors the SEU event.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO7 SDM_IO9 SDM_IO12 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16
HPS_COLD_nRESET	This is an active low, bidirectional pin. By default, this pin acts as an input pin to the SDM. When asserted externally for at least 5ms, this pin will generate interrupt to the SDM. The SDM will then initiate a cold reset procedure to the HPS and its peripherals. If the cold reset is generated from internal sources (for example, the HPS EL3 software), the SDM will switch this pin to output and drive a pulse to indicate reset. Once the cold reset procedure is complete, this pin will be switched back to input.	Connect this pin through a 1–10-kΩ pull up to the VCCIO_SDM supply. Do not connect this pin to the reset input of any connected quad serial peripheral interface (quad SPI) devices.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO7 SDM_IO9 SDM_IO12 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16
Direct to Factory Image	Direct to factory input pin. When using the remote system upgrade feature, this optional pin allows you to choose between factory or application image. Driving logic high into this pin will instruct the device to load factory image, while driving logic low into this pin will instruct the device to load the application image.	Connect this input pin to an external logic device that manages the remote system upgrade of the device. By default, the external logic should provide logic low to this pin so that the application image will be the default image of the device, and only switch to factory image if required.	SDM_IO0 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO5 SDM_IO7 SDM_IO9 SDM_IO12 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16	SDM_IO0 SDM_IO1 SDM_IO2 SDM_IO3 SDM_IO4 SDM_IO5 SDM_IO6 SDM_IO7 SDM_IO9 SDM_IO10 SDM_IO11 SDM_IO12 SDM_IO13 SDM_IO14 SDM_IO15 SDM_IO16

1.2. Intel Agilex E-Tile Pins

1.2.1. E-Tile Pins

Table 13. E-Tile Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`VCCH_GXE(L1,R1)`	Power	Analog power, block level transmitter buffers for E-tile, specific to the left (L) side or right (R) side of the device.	Connect VCCH_GXE to a 1.1V low noise switching regulator. VCCH_GXE must be powered up even when the E-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCRT_GXE(L1,R1)`	Power	Analog power, used for the high-speed circuitry for the E-tile, specific to the left (L) side or right (R) side of the device.	VCCRT_GXE can be connected to a 0.9V low noise switching regulator. You must connect VCCRT_GXE to VCCH through an LC filter. For more information about the LC filter design, refer to the Intel^® Agilex™ Power Management User Guide. VCCRT_GXE must be powered up even when the E-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCRTPLL_GXE(L1,R1)`	Power	Analog power, used for the high-speed circuitry for the E-tile, specific to the left (L) side or right (R) side of the device.	You must source the VCCRTPLL_GXE from the VCCH with proper isolation filtering. Filtering may be optional if this voltage rail can meet the noise mask requirement. For more information about the noise mask requirements, refer to the Intel^® Agilex™ Power Management User Guide. VCCRTPLL_GXE must be powered up even when the E-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCCLK_GXE(L1,R1)`	Power	I/O power, specific to the E-tile reference clock buffers.	Connect VCCCLK_GXE to a 2.5V low noise switching regulator. VCCCLK_GXE must be powered up even when the E-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCC_HSSI_GXE(L1,R1)`	Power	Primary digital supply for all digital signals, specific to E-tile.	Connect VCC_HSSI_GXE to a 0.9V low noise switching regulator. This voltage rail must be shared with VCCH using proper isolation filtering. VCC_HSSI_GXE must be powered up even when the E-tile transceivers are not used.
`GXE(L8,R9)_RX_CH[0:23][p,n]`	Input	High speed differential serial inputs to receiver circuitry. Specific to the E-tile transceiver on the left (L) side or right (R) side of the device. Supported I/O standard: CML –56G PAM4 30G NRZ	No off-chip AC-coupling capacitor is required if the RX input common mode is between VCCRT_GXE and GND, and the RX input amplitude difference is <1200mVp-p. The absolute maximum input to E-Tile SerDes is VCCRT_GXE + 300mV to prevent forward biasing of the ESD diodes. When using external AC-coupling capacitors, the RX termination is to the VCCH_GXE supply. For more information about the external AC-coupling, refer to the E-Tile Transceiver PHY User Guide. Leave unused pins floating.
`GXE(L8,R9)_TX_CH[0:23][p,n]`	Output	High speed differential serial outputs from the transmitter circuitry. Specific to the E-tile transceiver on the left (L) side or right (R) side of the device. Supported I/O standard: CML –56G PAM4 30G NRZ	Leave all unused pins floating.
`REFCLK_GXE(L8,R9)_CH[0:8][p,n]`	Input	High speed differential reference clock connects to the E-tile transceiver of the left (L) side or right (R) side of the device. REFCLK_GXE is supplied to both RX and TX independently. REFCLK_GXE can be used as dedicated clock input pins for core clock generation by configuring transceiver channel (Native PHY IP core) in the PLL mode. Supported I/O standard: LVPECL	No off-chip AC-coupling capacitor is required. The default internal REFCLK inputs are 2.5V LVPECL with a 50Ω termination. Optional external termination is 2.5V LVPECL or 3.3V LVPECL. For more information about the external AC-coupling, refer to section 4.1 Reference Clock Pins section of the E-Tile Transceiver PHY User Guide. Tie each unused REFCLK pin to GND through a 1kΩ resistor. REFCLK[1] must always be bonded out on board and connected to a clock source in case dynamic reconfiguration of REFCLK is planned. For more details on how to use it, refer to section 7.12 in the E-Tile Transceiver PHY User Guide. Preservation of unused transceiver channels may need extra REFCLK_GXE to be bonded out on board based on use cases. For more details, refer to section 3.1.7 Unused Transceiver Channels in the E-Tile Transceiver PHY User Guide. The REFCLK_GXE should be available during the power on for successful configuration.
`IO_AUX_RREF(10,20)`	Input	Precision reference resistor for the AIB auxiliary channel.	Connect to a 2kΩ resistor (±1%) to GND.

1.3. Intel Agilex P-Tile Pins

1.3.1. P-Tile Pins

Table 14. P-Tile Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`VCCH_GXP[L1,R1]`	Power	Secondary high-voltage analog supply for transceivers, and on-die PLL specific to P-tile.	Connect VCCH_GXP to a 1.8V low noise switching regulator. This voltage rail can be shared with VCCPT using proper isolation filtering. To minimize regulator switching noise impact on channel jitter performance, keep the regulator switching frequency below 1MHz. VCCH_GXP must be powered up even when the P-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCRT_GXP[L1,R1]`	Power	Primary analog supply for the TX and RX channels, specific to P-tile.	Connect VCCRT_GXP to a 0.9V low noise switching regulator. This voltage rail can be shared with VCCH using proper isolation filtering. VCCRT_GXP must be powered up even when the P-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCCLK_GXP[L1,R1]`	Power	LVCMOS I/O buffer supply rail, specific to P-tile.	Connect VCCCLK_GXP to a 1.8V low noise switching regulator. This voltage rail can be shared with VCCPT using proper isolation filtering. VCCCLK_GXP must be powered up even when the P-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCCFUSE_GXP`	Power	Required power supply for the firmware to read internal settings for the one-time programmable eFuses.	Connect this voltage rail to a 0.9V power supply. This rail must be shared with VCC_HSSI_GXP. VCCFUSE_GXP must be powered up even when the P-tile transceivers are not used. For more details about the decoupling recommendations for this voltage rail, refer to the Intel^® Agilex™ Platform Design Guide.
`VCC_HSSI_GXP(L1,R1)`	Power	Primary digital supply for all digital signals, specific to P-tile.	Connect VCC_HSSI_GXP to a 0.9V low noise switching regulator. This voltage rail must be shared with VCCH. VCC_HSSI_GXP must be powered up even when the P-tile transceivers are not used.
`GXP[L10A,R11A]_RX_CH[19:0][p,n]`	Input	PCIe* Gen4-based receiver pins, specific to the P-tile transceivers on the left (L) side or right (R) side of the device. For PCIe* Gen4 mode, use the lower 16 bits [15:0]. These pins also support NRZ encoding up to 16Gbps.	When these pins are not used, they must be tied via a 1kΩ pull-down resistor to GND.
`GXP[L10A,R11A]_TX_CH[19:0][p,n]`	Output	PCIe* Gen4-based transmitter pins, specific to the P-tile transceivers on the left (L) side or right (R) side of the device. For PCIe* Gen4 mode, use the lower 16 bits [15:0]. These pins also support NRZ encoding up to 16Gbps.	Transmitter pins must be AC coupled. The capacitor value ranges from 176nF to 256nF per PCIe* Gen4 specification. When these pins are not used, they must be floating.
`REFCLK_GXP[L10A,R11A]_CH[0,2][p,n]`	Input	Standard PCIe* HCSL reference clock input pins, specific to the P-tile transceivers on the left (L) side or right (R) side of the device.	For HCSL I/O standard, it only supports DC coupling. In the PCIe* configuration, DC coupling is allowed on the REFCLK if the selected REFCLK I/O standard is the HCSL I/O standard. You must connect a 100MHz reference clock to both reference clock inputs for x16 and 4x4 modes. These reference clocks must be derived from the same clock source. A fan-out buffer can be used but must meet a ± 300ppm requirement. For 2x8 modes, you can connect both reference clock inputs to the same clock source or connect to two independent clock sources. If the P-tile is completely unused, tie both REFCLK inputs to GND. Unused reference clock pins must be tied to 1kΩ pull-down resistor to GND.
`IO_AUX_RREF[10,20]_P`	Input	Reference resistor for the Embedded Multi-Die-Interconnect Bridge (EMIB) of the P-tile transceivers.	Connect each IO_AUX_RREF to a 2.8kΩ resistor (±1%) to GND. In the PCB layout, the trace from this pin to the resistor needs to be routed such that it avoids any aggressor signals.
`U[10,20]_P_IO_RESREF_0`	Input	Transceiver reference resistor connection for PMA circuitry to provide termination for calibration.	Connect each pin to a 169Ω 1% (100 ppm/°C) precision resistor to GND. Place this resistor very close to the IO_RESREF pin. Avoid routing any noisy signals next to this reference resistor or its traces. Tie resistor to GND plane through a via placed very close to the reference resistor. External reference resistor parasitic capacitance load must be less than 14pF. Maximum parasitic capacitance includes external loading of PHY count, package trace, and PCB trace. Each PHY connected to the IO_RESREF pin adds an additional 1.5pF of loading.
`I_PIN_PERST_N_P`	Input	PCI Express* ( PCIe* ) Platform reset pin.	In a PCI Express* ( PCIe* ) adapter card implementation, connect the PCIe* nPERST signal from the PCIe* edge connector to each P-tile transceiver bank I_PIN_PERST_N input. Use a level translator to fan out and change the 3.3V open-drain nPERST signal from the PCIe* connector to the 1.8V I_PIN_PERST_N input of each P-tile transceiver that is used on the board. Provide a 1.8V pull-up resistor to the I_PIN_PERST_N input as the nPERST signal from the PCIe* connector is an open-drain signal. You must pull up the 3.3V PCIe* nPERST signal on the adapter card. If the tile is unused, tie to GND. In cases where two independent clock sources are used for 2x8 bifurcation mode, ensure I_PIN_PERST_N be de-asserted high after both reference clocks are stable.

1.4. Intel Agilex Hard Processor System (HPS) Pins

1.4.1. HPS Supply Pins

Table 15. HPS Supply Pins—Preliminary
Pin Name	Pin Functions	Pin Description	Connection Guidelines
`VCCL_HPS`	Power	VCCL_HPS supplies power to the HPS core.	The VCCL_HPS power supply voltage could vary from 0.685V to 0.85V with VID or have fixed voltage of 0.9V for voltage boost. VCCL_HPS can be shared with VCC if they are at the same VID voltage level.
`VCCIO_HPS`	Power	The HPS dedicated I/Os support 1.8V voltage level.	Connect these pins to 1.8V power supply. You have the option to source VCCIO_HPS pins from the same regulator as VCCIO_SDM.
`VCCPLL_HPS`	Power	VCCPLL_HPS supplies analog power to the HPS PLLs.	Connect these pins to a 1.8V. You have the option to share VCCPLL_HPS with the same regulator as VCCIO_SDM.
`VCCPLLDIG_HPS`	Power	Digital power supply of the PLL in HPS.	Connect this to the VCCL_HPS with proper isolation filtering.

1.4.2. HPS Oscillator Clock Input Pin

Table 16. HPS Oscillator Clock Input Pin—PreliminaryYou must provide one input clock source to the HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`HPS_OSC_CLK`	Clock input pin that drives the main PLL. Connect a single-ended clock source to this pin. The I/O standard of the clock source must be compatible with VCCIO_HPS.	Input	Select one of the 48 HPS dedicated I/O.

1.4.3. HPS JTAG Pins

Table 17. HPS JTAG Pins—PreliminaryYou have the option to connect HPS JTAG pins to the HPS Dedicated I/O using the following assignments.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`JTAG_TCK`	HPS JTAG test clock input pin. Connect this pin through a 1-kΩ – 10-kΩ pull-down resistor to `GND`. Do not drive voltage higher than the VCCIO_HPS supply. You can use the FPGA dedicated JTAG pins as an option to access the HPS JTAG.	Input	HPS_IOB_9
`JTAG_TMS`	HPS JTAG test mode select input pin. Connect this pin to a 1-kΩ – 10-kΩ pull-up resistor to the VCCIO_HPS supply. Do not drive voltage higher than the VCCIO_HPS supply. You can use the FPGA dedicated JTAG pins as an option to access the HPS JTAG.	Input	HPS_IOB_10
`JTAG_TDO`	HPS JTAG test data output pin. You can use the FPGA dedicated JTAG pins as an option to access the HPS JTAG.	Output	HPS_IOB_11
`JTAG_TDI`	HPS JTAG test data input pin. Connect this pin to a 1-kΩ – 10-kΩ pull-up resistor to the VCCIO_HPS supply. Do not drive voltage higher than the VCCIO_HPS supply. You can use the FPGA dedicated JTAG pins as an option to access the HPS JTAG.	Input	HPS_IOB_12

1.4.4. HPS GPIO Pins

Table 18. HPS GPIO Pins—PreliminaryThere are two GPIO controllers (GPIO0 and GPIO1) for the Intel^® Agilex™ HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`GPIO0_IO[0..23]`	General purpose input output. Ensure that the I/O standard used is compatible with VCCIO_HPS.	I/O	HPS_IOA_[1..24] HPS_IOB_[1..24]
`GPIO1_IO[0..23]`		I/O	HPS_IOA_[1..24] HPS_IOB_[1..24]

1.4.5. HPS SDMMC Pins

Table 19. HPS SDMMC Pins—Preliminary Intel^® recommends adding a 1-kΩ to 10-kΩ pull-up resistor to every SDMMC data signal that is used.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the groups)
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2
`SDMMC_CCLK`	SDMMC clock out	Output	HPS_IOA_1	HPS_IOB_15
`SDMMC_CMD`	SDMMC command line. Pull this pin high on the board with a weak pull-up resistor. For example, a 10-kΩ to VCCIO_HPS.	I/O	HPS_IOA_2	HPS_IOB_14
`SDMMC_DATA0`	SDMMC Data 0	I/O	HPS_IOA_3	HPS_IOB_13
`SDMMC_DATA1`	SDMMC Data 1	I/O	HPS_IOA_4	HPS_IOB_16
`SDMMC_DATA2`	SDMMC Data 2	I/O	HPS_IOA_5	HPS_IOB_17
`SDMMC_DATA3`	SDMMC Data 3 When using SD card, there is an existing 50-kΩ pull-up on SDMMC Data Bit 3 which can be disabled in the HPS software by using the SET_CLR_CARD_DETECT (ACMD42) command. This is not applicable to the eMMC flash.	I/O	HPS_IOA_6	HPS_IOB_18
`SDMMC_DATA4`	SDMMC Data 4	I/O	HPS_IOA_7	HPS_IOB_19
`SDMMC_DATA5`	SDMMC Data 5	I/O	HPS_IOA_8	HPS_IOB_20
`SDMMC_DATA6`	SDMMC Data 6	I/O	HPS_IOA_9	HPS_IOB_21
`SDMMC_DATA7`	SDMMC Data 7	I/O	HPS_IOA_10	HPS_IOB_22
`SDMMC_PWR_EN`	SDMMC Power Enable	Output	HPS_IOA_11	HPS_IOB_23

1.4.6. HPS NAND Pins

Table 20. HPS NAND Pins—Preliminary
HPS Pin Functions	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the groups)
HPS Pin Functions	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2
`NAND_ADQ0`	NAND Data Bit 0	I/O	HPS_IOA_1	HPS_IOB_1
`NAND_ADQ1`	NAND Data Bit 1	I/O	HPS_IOA_2	HPS_IOB_2
`NAND_WE_N`	NAND Write Enable. This is an active-low signal.	Output	HPS_IOA_3	HPS_IOB_3
`NAND_RE_N`	NAND Read Enable. This is an active-low signal.	Output	HPS_IOA_4	HPS_IOB_4
`NAND_WP_N`	NAND Write Protect	Output	HPS_IOA_5	HPS_IOB_5
`NAND_ADQ2`	NAND Data Bit 2	I/O	HPS_IOA_6	HPS_IOB_6
`NAND_ADQ3`	NAND Data Bit 3	I/O	HPS_IOA_7	HPS_IOB_7
`NAND_CLE`	NAND Command Latch Enable	Output	HPS_IOA_8	HPS_IOB_8
`NAND_ADQ4`	NAND Data Bit 4	I/O	HPS_IOA_9	HPS_IOB_9
`NAND_ADQ5`	NAND Data Bit 5	I/O	HPS_IOA_10	HPS_IOB_10
`NAND_ADQ6`	NAND Data Bit 6	I/O	HPS_IOA_11	HPS_IOB_11
`NAND_ADQ7`	NAND Data Bit 7	I/O	HPS_IOA_12	HPS_IOB_12
`NAND_ALE`	NAND Address Latch Enable	Output	HPS_IOA_13	HPS_IOB_13
`NAND_RB`	NAND Ready/Busy. Connect this pin through a 1-kΩ to 10-kΩ pull-up resistor to VCCIO_HPS.	Input	HPS_IOA_14	HPS_IOB_14
`NAND_CE_N`	NAND Chip Enable. This is an active-low signal.	Output	HPS_IOA_15	HPS_IOB_15
`NAND_ADQ8`	NAND Data Bit 8	I/O	HPS_IOA_17	HPS_IOB_17
`NAND_ADQ9`	NAND Data Bit 9	I/O	HPS_IOA_18	HPS_IOB_18
`NAND_ADQ10`	NAND Data Bit 10	I/O	HPS_IOA_19	HPS_IOB_19
`NAND_ADQ11`	NAND Data Bit 11	I/O	HPS_IOA_20	HPS_IOB_20
`NAND_ADQ12`	NAND Data Bit 12	I/O	HPS_IOA_21	HPS_IOB_21
`NAND_ADQ13`	NAND Data Bit 13	I/O	HPS_IOA_22	HPS_IOB_22
`NAND_ADQ14`	NAND Data Bit 14	I/O	HPS_IOA_23	HPS_IOB_23
`NAND_ADQ15`	NAND Data Bit 15	I/O	HPS_IOA_24	HPS_IOB_24

1.4.7. HPS USB Pins

Table 21. HPS USB Pins—PreliminaryThere are two USB controllers (USB0 and USB1) for the Intel^® Agilex™ HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`USB0_CLK`	USB0 Clock	Input	HPS_IOA_1
`USB0_STP`	USB0 Stop Data	Output	HPS_IOA_2
`USB0_DIR`	USB0 Direction	Input	HPS_IOA_3
`USB0_DATA0`	USB0 Data Bit 0	I/O	HPS_IOA_4
`USB0_DATA1`	USB0 Data Bit 1	I/O	HPS_IOA_5
`USB0_NXT`	USB0 Next Data	Input	HPS_IOA_6
`USB0_DATA2`	USB0 Data Bit 2	I/O	HPS_IOA_7
`USB0_DATA3`	USB0 Data Bit 3	I/O	HPS_IOA_8
`USB0_DATA4`	USB0 Data Bit 4	I/O	HPS_IOA_9
`USB0_DATA5`	USB0 Data Bit 5	I/O	HPS_IOA_10
`USB0_DATA6`	USB0 Data Bit 6	I/O	HPS_IOA_11
`USB0_DATA7`	USB0 Data Bit 7	I/O	HPS_IOA_12
`USB1_CLK`	USB1 Clock	Input	HPS_IOA_13
`USB1_STP`	USB1 Stop Data	Output	HPS_IOA_14
`USB1_DIR`	USB1 Direction	Input	HPS_IOA_15
`USB1_DATA0`	USB1 Data Bit 0	I/O	HPS_IOA_16
`USB1_DATA1`	USB1 Data Bit 1	I/O	HPS_IOA_17
`USB1_NXT`	USB1 Next Data	Input	HPS_IOA_18
`USB1_DATA2`	USB1 Data Bit 2	I/O	HPS_IOA_19
`USB1_DATA3`	USB1 Data Bit 3	I/O	HPS_IOA_20
`USB1_DATA4`	USB1 Data Bit 4	I/O	HPS_IOA_21
`USB1_DATA5`	USB1 Data Bit 5	I/O	HPS_IOA_22
`USB1_DATA6`	USB1 Data Bit 6	I/O	HPS_IOA_23
`USB1_DATA7`	USB1 Data Bit 7	I/O	HPS_IOA_24

1.4.8. HPS EMAC Pins

Table 22. HPS EMAC Pins—PreliminaryThere are three EMAC controllers (EMAC0, EMAC1, and EMAC2) for the Intel^® Agilex™ HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`EMAC0_TX_CLK`	EMAC0 Transmit Clock	Output	HPS_IOA_13
`EMAC0_TX_CTL`	EMAC0 Transmit Control	Output	HPS_IOA_14
`EMAC0_RX_CLK`	EMAC0 Receive Clock	Input	HPS_IOA_15
`EMAC0_RX_CTL`	EMAC0 Receive Control	Input	HPS_IOA_16
`EMAC0_TXD0`	EMAC0 Transmit Data Bit 0	Output	HPS_IOA_17
`EMAC0_TXD1`	EMAC0 Transmit Data Bit 1	Output	HPS_IOA_18
`EMAC0_RXD0`	EMAC0 Receive Data Bit 0	Input	HPS_IOA_19
`EMAC0_RXD1`	EMAC0 Receive Data Bit 1	Input	HPS_IOA_20
`EMAC0_TXD2`	EMAC0 Transmit Data Bit 2	Output	HPS_IOA_21
`EMAC0_TXD3`	EMAC0 Transmit Data Bit 3	Output	HPS_IOA_22
`EMAC0_RXD2`	EMAC0 Receive Data Bit 2	Input	HPS_IOA_23
`EMAC0_RXD3`	EMAC0 Receive Data Bit 3	Input	HPS_IOA_24
`EMAC1_TX_CLK`	EMAC1 Transmit Clock	Output	HPS_IOB_1
`EMAC1_TX_CTL`	EMAC1 Transmit Control	Output	HPS_IOB_2
`EMAC1_RX_CLK`	EMAC1 Receive Clock	Input	HPS_IOB_3
`EMAC1_RX_CTL`	EMAC1 Receive Control.	Input	HPS_IOB_4
`EMAC1_TXD0`	EMAC1 Transmit Data Bit 0	Output	HPS_IOB_5
`EMAC1_TXD1`	EMAC1 Transmit Data Bit 1	Output	HPS_IOB_6
`EMAC1_RXD0`	EMAC1 Receive Data Bit 0	Input	HPS_IOB_7
`EMAC1_RXD1`	EMAC1 Receive Data Bit 1	Input	HPS_IOB_8
`EMAC1_TXD2`	EMAC1 Transmit Data Bit 2	Output	HPS_IOB_9
`EMAC1_TXD3`	EMAC1 Transmit Data Bit 3	Output	HPS_IOB_10
`EMAC1_RXD2`	EMAC1 Receive Data Bit 2	Input	HPS_IOB_11
`EMAC1_RXD3`	EMAC1 Receive Data Bit 3	Input	HPS_IOB_12
`EMAC2_TX_CLK`	EMAC2 Transmit Clock	Output	HPS_IOB_13
`EMAC2_TX_CTL`	EMAC2 Transmit Control	Output	HPS_IOB_14
`EMAC2_RX_CLK`	EMAC2 Receive Clock	Input	HPS_IOB_15
`EMAC2_RX_CTL`	EMAC2 Receive Control	Input	HPS_IOB_16
`EMAC2_TXD0`	EMAC2 Transmit Data Bit 0	Output	HPS_IOB_17
`EMAC2_TXD1`	EMAC2 Transmit Data Bit 1	Output	HPS_IOB_18
`EMAC2_RXD0`	EMAC2 Receive Data Bit 0	Input	HPS_IOB_19
`EMAC2_RXD1`	EMAC2 Receive Data Bit 1	Input	HPS_IOB_20
`EMAC2_TXD2`	EMAC2 Transmit Data Bit 2	Output	HPS_IOB_21
`EMAC2_TXD3`	EMAC2 Transmit Data Bit 3	Output	HPS_IOB_22
`EMAC2_RXD2`	EMAC2 Receive Data Bit 2	Input	HPS_IOB_23
`EMAC2_RXD3`	EMAC2 Receive Data Bit 3	Input	HPS_IOB_24

1.4.9. HPS I2C_EMAC and MDIO Pins

There are three sets of I2C_EMAC interfaces that can be used as I2C interfaces or as the MDIO pins for the EMACs. Please take note that the I2C_EMAC and MDIO modules must be used with the corresponding EMAC interfaces. For example, you can use either I2C_EMAC0_SDA and I2C_EMAC0_SCL or MDIO0_MDIO and MDIO0_MDC with EMAC0.

The I2C protocol requires pull-up resistors to VCCIO_HPS on both the serial data and serial clock signals for them to function correctly. The value of the pull-up resistor varies depending on your board loading, but it is typically 4.7-kΩ or lower.

Typically the MDIO pin requires an external pull-up resistor to VCCIO_HPS in the range of 1.0-kΩ to 4.7-kΩ.

Table 23. HPS I2C_EMAC and MDIO Pins—Preliminary
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the groups)
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2	Group 3
`I2C_EMAC2_SDA`	I2C EMAC2 Serial Data	I/O	HPS_IOA_7	HPS_IOB_9	HPS_IOB_21
`I2C_EMAC2_SCL`	I2C EMAC2 Serial Clock	I/O	HPS_IOA_8	HPS_IOB_10	HPS_IOB_22
`I2C_EMAC1_SDA`	I2C EMAC1 Serial Data	I/O	HPS_IOA_9	HPS_IOB_19	—
`I2C_EMAC1_SCL`	I2C EMAC1 Serial Clock	I/O	HPS_IOA_10	HPS_IOB_20	—
`I2C_EMAC0_SDA`	I2C EMAC0 Serial Data	I/O	HPS_IOA_11	HPS_IOB_11	HPS_IOB_23
`I2C_EMAC0_SCL`	I2C EMAC0 Serial Clock	I/O	HPS_IOA_12	HPS_IOB_12	HPS_IOB_24
`MDIO2_MDIO`	EMAC2 MDIO	I/O	HPS_IOA_7	HPS_IOB_9	—
`MDIO2_MDC`	EMAC2 MDC	Output	HPS_IOA_8	HPS_IOB_10	—
`MDIO1_MDIO`	EMAC1 MDIO	I/O	HPS_IOA_9	HPS_IOB_19	—
`MDIO1_MDC`	EMAC1 MDC	Output	HPS_IOA_10	HPS_IOB_20	—
`MDIO0_MDIO`	EMAC0 MDIO	I/O	HPS_IOA_11	HPS_IOB_11	HPS_IOB_23
`MDIO0_MDC`	EMAC0 MDC	Output	HPS_IOA_12	HPS_IOB_12	HPS_IOB_24

1.4.10. HPS I2C Pins

In addition to the three I2C_EMAC controllers, there are two additional I2C controllers (I2C0 and I2C1) for dedicated I2C usage in the Intel^® Agilex™ HPS.

Table 24. HPS I2C Pins—Preliminary
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the groups)
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2	Group 3	Group 4
`I2C0 _SDA`	I2C0 Serial Data	I/O	HPS_IOA_5	HPS_IOA_23	HPS_IOB_3	—
`I2C0 _SCL`	I2C0 Serial Clock	I/O	HPS_IOA_6	HPS_IOA_24	HPS_IOB_4	—
`I2C1 _SDA`	I2C1 Serial Data	I/O	HPS_IOA_3	HPS_IOA_21	HPS_IOB_7	HPS_IOB_13
`I2C1 _SCL`	I2C1 Serial Clock	I/O	HPS_IOA_4	HPS_IOA_22	HPS_IOB_8	HPS_IOB_14

1.4.11. HPS SPI Pins

Table 25. HPS SPI Pins—PreliminaryThere are two SPI Master (SPIM0 and SPIM1) and two SPI Slave (SPIS0 and SPIS1) controllers for the Intel^® Agilex™ HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the group)
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2	Group 3
`SPIM0_CLK`	SPIM0 Clock	Output	HPS_IOA_5	HPS_IOB_21	HPS_IOB_21
`SPIM0_MOSI`	SPIM0 Master Out Slave In	Output	HPS_IOA_6	HPS_IOB_22	HPS_IOB_22
`SPIM0_MISO`	SPIM0 Master In Slave Out	Input	HPS_IOA_7	HPS_IOB_19	HPS_IOB_23
`SPIM0_SS0_N`	SPIM0 Slave Select 0 This is an active-low signal.	Output	HPS_IOA_8	HPS_IOB_20	HPS_IOB_24
`SPIM0_SS1_N`	SPIM0 Slave Select 1 This is an active-low signal.	Output	HPS_IOA_1	HPS_IOB_18	HPS_IOB_18
`SPIM1_CLK`	SPIM1 Clock	Output	HPS_IOA_9	HPS_IOA_21	HPS_IOB_1
`SPIM1_MOSI`	SPIM1 Master Out Slave In	Output	HPS_IOA_10	HPS_IOA_22	HPS_IOB_2
`SPIM1_MISO`	SPIM1 Master In Slave Out	Input	HPS_IOA_11	HPS_IOA_23	HPS_IOB_3
`SPIM1_SS0_N`	SPIM1 Slave Select 0 This is an active-low signal.	Output	HPS_IOA_12	HPS_IOA_24	HPS_IOB_4
`SPIM1_SS1_N`	SPIM1 Slave Select 1 This is an active-low signal.	Output	HPS_IOA_2	HPS_IOA_20	HPS_IOB_5
`SPIS0_CLK`	SPIS0 Clock	Input	HPS_IOA_1	HPS_IOA_21	HPS_IOB_9
`SPIS0_MOSI`	SPIS0 Master Out Slave In	Input	HPS_IOA_2	HPS_IOA_22	HPS_IOB_10
`SPIS0_MISO`	SPIS0 Master In Slave Out	Output	HPS_IOA_4	HPS_IOA_24	HPS_IOB_12
`SPIS0_SS0_N`	SPIS0 Slave Select 0 This is an active-low signal.	Input	HPS_IOA_3	HPS_IOA_23	HPS_IOB_11
`SPIS1_CLK`	SPIS1 Clock	Input	HPS_IOA_9	HPS_IOB_5	HPS_IOB_21
`SPIS1_MOSI`	SPIS1 Master Out Slave In	Input	HPS_IOA_10	HPS_IOB_6	HPS_IOB_22
`SPIS1_MISO`	SPIS1 Master In Slave Out	Output	HPS_IOA_12	HPS_IOB_8	HPS_IOB_24
`SPIS1_SS0_N`	SPIS1 Slave Select 0 This is an active-low signal.	Input	HPS_IOA_11	HPS_IOB_7	HPS_IOB_23

1.4.12. HPS UART Pins

Table 26. HPS UART Pins—PreliminaryThere are two UART (UART0 and UART1) controllers for the Intel^® Agilex™ HPS.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments (select from one of the groups)
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Group 1	Group 2	Group 3
`UART0_CTS_N`	UART0 Clear to Send This is an active-low signal.	Input	HPS_IOA_1	HPS_IOA_21	HPS_IOB_1
`UART0_RTS_N`	UART0 Request to Send This is an active-low signal.	Output	HPS_IOA_2	HPS_IOA_22	HPS_IOB_2
`UART0_TX`	UART0 Transmit	Output	HPS_IOA_3	HPS_IOA_23	HPS_IOB_3
`UART0_RX`	UART0 Receive	Input	HPS_IOA_4	HPS_IOA_24	HPS_IOB_4
`UART1_CTS_N`	UART1 Clear to Send This is an active-low signal.	Input	HPS_IOA_5	HPS_IOB_5	HPS_IOB_17
`UART1_RTS_N`	UART1 Request to Send This is an active-low signal.	Output	HPS_IOA_6	HPS_IOB_6	HPS_IOB_18
`UART1_TX`	UART1 Transmit	Output	HPS_IOA_7	HPS_IOB_7	HPS_IOB_15
`UART1_RX`	UART1 Receive	Input	HPS_IOA_8	HPS_IOB_8	HPS_IOB_16

1.4.13. HPS Trace Pins

Table 27. HPS Trace Pins—PreliminaryYou can select up to 16 trace output pins in the Intel^® Agilex™ HPS. These pins do not have to be located in the same quadrant.
HPS Pin Function	Pin Description and Connection Guidelines	Pin Type	Valid Assignments
`Trace_CLK`	Trace Clock	Output	HPS_IOA_20
`Trace_CLK`	Trace Clock	Output	HPS_IOB_20
`Trace_D0`	Trace Data 0	Output	HPS_IOA_21
`Trace_D0`	Trace Data 0	Output	HPS_IOB_21
`Trace_D1`	Trace Data 1	Output	HPS_IOA_22
`Trace_D1`	Trace Data 1	Output	HPS_IOB_22
`Trace_D2`	Trace Data 2	Output	HPS_IOA_23
`Trace_D2`	Trace Data 2	Output	HPS_IOB_23
`Trace_D3`	Trace Data 3	Output	HPS_IOA_24
`Trace_D3`	Trace Data 3	Output	HPS_IOB_24
`Trace_D4`	Trace Data 4	Output	HPS_IOA_19
			HPS_IOA_7
			HPS_IOB_19
			HPS_IOB_7
`Trace_D5`	Trace Data 5	Output	HPS_IOA_18
			HPS_IOA_6
			HPS_IOB_18
			HPS_IOB_6
`Trace_D6`	Trace Data 6	Output	HPS_IOA_17
			HPS_IOA_5
			HPS_IOB_17
			HPS_IOB_5
`Trace_D7`	Trace Data 7	Output	HPS_IOA_16
			HPS_IOA_4
			HPS_IOB_16
			HPS_IOB_4
`Trace_D8`	Trace Data 8	Output	HPS_IOA_15
			HPS_IOA_3
			HPS_IOB_15
			HPS_IOB_3
`Trace_D9`	Trace Data 9	Output	HPS_IOA_14
			HPS_IOA_2
			HPS_IOB_14
			HPS_IOB_2
`Trace_D10`	Trace Data 10	Output	HPS_IOA_13
			HPS_IOA_1
			HPS_IOB_13
			HPS_IOB_1
`Trace_D11`	Trace Data 11	Output	HPS_IOA_12
`Trace_D11`	Trace Data 11	Output	HPS_IOB_12
`Trace_D12`	Trace Data 12	Output	HPS_IOA_11
`Trace_D12`	Trace Data 12	Output	HPS_IOB_11
`Trace_D13`	Trace Data 13	Output	HPS_IOA_10
`Trace_D13`	Trace Data 13	Output	HPS_IOB_10
`Trace_D14`	Trace Data 14	Output	HPS_IOA_9
`Trace_D14`	Trace Data 14	Output	HPS_IOB_9
`Trace_D15`	Trace Data 15	Output	HPS_IOA_8
`Trace_D15`	Trace Data 15	Output	HPS_IOB_8

1.5. Intel Agilex Power Supply Sharing Guidelines

Intel^® Agilex™ devices have specific power-up and power-down sequence requirements. For more information, refer to the AN692: Power Sequencing Considerations for Intel^® Cyclone^® 10 GX, Intel^® Arria^® 10, and Intel^® Stratix^® 10 Devices and Intel^® Agilex™ Power Management User Guide.

1.5.1. Example 1— Intel Agilex

Table 28. Power Supply Sharing Guidelines for Intel^® Agilex™ Device—PreliminaryExample Requiring 9 Power Regulators
Power Pin Name	Regulator Group	Voltage Level (V)	Supply Tolerance	Power Source	Regulator Sharing	Notes
`VCC`	1	SmartVID¹, 0.8V	± 3%	Switcher ²	Share	Source VCC and VCCP from the same regulator, sharing the same voltage plane. You have the option to connect VCCL_HPS to the same regulator as VCC and VCCP when the power rails require the same voltage level. You may also connect the VCCPLLDIG_HPS power to the shared VCC, VCCP, and VCCL_HPS power planes with proper isolation filtering. When implementing a filtered supply topology, you must consider the IR drop across the filter. If you do not intend to utilize the HPS in the Intel^® Agilex™ device, you must still provide power to these power supply pins. Do not leave the VCCL_HPS and VCCPLLDIG_HPS power supply pins floating or connected to GND.
`VCCP`					Share
`VCCL_HPS`					Share
`VCCPLLDIG_HPS`					Filter
`VCCH`	2	0.9V	± 30mV	Switcher²	Share	Connect the VCCH to a dedicated 0.9V power supply. When implementing a filtered supply topology, you must consider the IR drop across the filter.
`VCC_HSSI_GXE`					Share
`VCCFUSE_GXP`					Share
`VCC_HSSI_GXP`					Share
`VCCH_SDM`					Share
`VCCRT_GXE`					LC Filter
`VCCRTPLL_GXE`					Filter
`VCCRT_GXP`					Filter
`VCCL_SDM`	3	0.8V	± 3%	Switcher²	Share	Connect the VCCL_SDM to a dedicated 0.8V power supply. When implementing a filtered supply topology, you must consider the IR drop across the filter.
`VCCPLLDIG_SDM`	3	0.8V	± 3%	Switcher²	Filter
`VCCH_GXE`	4	1.1V	± 3%	Switcher²	Isolate	Connect the VCCH_GXE to a dedicated 1.1V power supply.
`VCCCLK_GXE`	5	2.5V	± 5%	Switcher²	Isolate	Connect the VCCCLK_GXE to a dedicated 2.5V power supply.
`VCCPT`	6	1.8V	± 3%	Switcher²	Share	Connect VCCPT to a dedicated 1.8V power supply. Connect VCCADC, VCCPLL_SDM, VCCPLL_HPS, and VCCCLK_GXP to the same power plane with proper isolation filtering. Depending on the regulator capabilities, you have the option to share this supply with multiple Intel^® Agilex™ devices. If you do not intend to utilize the HPS in the Intel^® Agilex™ device, you must still provide power to the HPS power supply pins. When implementing a filtered supply topology, you must consider the IR drop across the filter.
`VCCADC`					Filter
`VCCPLL_SDM`					Filter
`VCCPLL_HPS`					Filter
`VCCCLK_GXP`					Filter
`VCCH_GXP`					Filter
`VCCR_CORE`	7	1.8V	± 5%	Switcher²	Share	Connect VCCR_CORE to 1.8V power supply. Connect VCCA_PLL to the VCCR_CORE supply with proper isolation filtering.
`VCCA_PLL`	7	1.8V	± 5%	Switcher²	Filter
`VCCIO_PIO` ³	8	1.2V	± 5%	Switcher²	Share	Connect VCCIO_PIO and VCCIO_PIO_SDM to dedicated 1.2V power supply.
`VCCIO_PIO_SDM`	8	1.2V	± 5%	Switcher²	Filter
`VCCIO_SDM`	9	1.8V	± 5%	Switcher²	Share	Connect VCCIO_SDM, VCCIO_HPS, and VCCBAT to dedicated 1.8V power supply.
`VCCIO_HPS`					Share
`VCCBAT`					Share
`VCCFUSEWR_SDM`	10	2.4V	± 50mV	Switcher²	Isolate	A 2.4V power supply is required on this pin if field-programming of the eFuses is required. If field-programming of the eFuses is not required, tie this pin to VCCPT or leave it unconnected (floating). Do not tie this pin to GND. If field-programming of the eFuses is required, Intel^® recommends using an adjustable regulator set to 2.4V output when programming the eFuses and 1.8V otherwise.

Each board design requires its own power analysis to determine the required power regulators needed to satisfy the specific board design requirements. An example block diagram using the Intel^® Agilex™ device is provided in Figure 1.

The voltage level for each power rail is preliminary.

Figure 1. Example Power Supply Sharing Guidelines for Intel^® Agilex™ Device —Preliminary

¹ For the SmartVID voltage range, refer to the Intel^® Agilex™ Device Data Sheet.

² When using a switcher to supply these voltages, the switcher must be a low noise switcher as defined in note 4 of the Notes to Intel^® Agilex™ Pin Connection Guidelines.

³ The supported tolerance for the VCCIO_PIO power supply varies depending on the I/O standards. For more details, refer to the I/O standard specification in the Intel^® Agilex™ Device Data Sheet. Use the Intel^® FPGA Power and Thermal Calculator and the Intel^® Quartus^® Prime Power Analyzer tool to assist in determining the power required for your specific design.

1.6. Notes to Intel Agilex Device Family Pin Connection Guidelines

Intel^® provides these guidelines only as recommendations. It is the responsibility of the designer to apply simulation results to the design to verify proper device functionality.

Use the Intel^® FPGA Power and Thermal Calculator to determine the preliminary current requirements for VCC and other power supplies. Use the Intel^® Quartus^® Prime Power Analyzer for the most accurate current requirements for this and other power supplies.
Power pins should not share breakout vias from the BGA. Each ball on the BGA needs to have its own dedicated breakout via. VCC must not share breakout vias.
For AC-coupled links, the AC-coupling capacitor can be placed anywhere along the channel. PCI Express* ( PCIe* ) protocol requires the AC-coupling capacitor to be placed on the transmitter side of the interface that permits adapters to be plugged and unplugged.
Low Noise Switching Regulator—defined as a switching regulator circuit encapsulated in a thin surface mount package containing the switch controller, power FETs, inductor, and other support components. The switching frequency is usually between 800kHz and 1MHz and has fast transient response. The switching frequency range is not an Intel^® requirement.
There are no dedicated PR_REQUEST, PR_ERROR, and PR_DONE pins. If required, you can use user I/O pins for these functions.
The device orientation is die view (bottom of chip view).

1.7. Document Revision History for the Intel Agilex Device Family Pin Connection Guidelines

Document Version	Changes
2020.01.23	Changed the Early Power Estimator (EPE) tool name to Intel^® FPGA Power and Thermal Calculator. Updated the VCCPGM power supply to the VCCIO_SDM power supply in the connection guidelines of the `TMS` and `TDI` pins. Updated the pin description of the `TCK`, `TMS`, `TDI`, `nSTATUS`, `nCONFIG`, and `OSC_CLK_1` pins. Updated the pin description of the `AVST_DATA[31:0]` and `AVST_READY(3A bank)` pins. Updated the pin names from `SDM_MISSION_DATA[31:0]`, `SDM_MISSION_CLK`, and`SDM_MISSION_DATA_VALID` to `AVST_DATA[31:0]`, `AVST_CLK`, and `AVST_VALID`. Updated pin name `I_PIN_PERST_N_U[10,20]_P` to `I_PIN_PERST_N_P`. Updated the I/O standard naming from 1.5V True Differential Signaling to True Differential Signaling. Updated supported I/O standard from SSTL 1.2V to 1.2V LVCMOS for the `AVST_READY(3A bank)`, `AVST_CLK(3A bank)`, and `AVST_VALID(3A bank)` pins. Updated the pin description of the `DIFF_RX[2][A,B,C,D][1:24][p,n]`, `DIFF_RX[3][A,B,C,D][1:24][p,n]`, `DIFF_TX[2][A,B,C,D][1:24][p,n]`, and `DIFF_TX[3][A,B,C,D][1:24][p,n]` pins. Updated the resistor value from 2kΩ to 2.8kΩ for the `IO_AUX_RREF[10,20]_P` pins. Updated the pin description and connection guidelines of the `VCCBAT` pin. Updated the pin description and connection guidelines of the `VCCPT` pin. Updated the pin description and connection guidelines of the `VCCR_CORE` pin. Updated the pin description of the `VCCA_PLL` pin. Updated the connection guidelines of the `DNU` pins. Updated the connection guidelines of the `VCCIO_SDM` pin. Updated the pin function of the `RREF_SDM` pin. Updated the pin description and connection guidelines of the `REFCLK_GXE(L8,R9)_CH[0:8][p,n]` pins. Updated the connection guidelines of the `GXP[L10A,R11A]_RX_CH[19:0][p,n]` pins. Updated the connection guidelines of the `GXP[L10A,R11A]_TX_CH[19:0][p,n]` pins. Updated the connection guidelines of the `REFCLK_GXP[L10A,R11A]_CH[0,2][p,n]` pins. Updated the resistor value from 200Ω to 169Ω of the `U[10,20]_P_IORESREF_0` pins. Updated the connection guidelines of the `I_PIN_PERST_P` pins. Updated the connection guidelines of the `VCCL_HPS` pin. Updated Table: Power Supply Sharing Guidelines for Intel^® Agilex™ Device. Updated Figure: Example Power Supply Sharing Guidelines for Intel^® Agilex™ Device. Added SDM_IO8 to AVST x16 and x32 for the `CONF_DONE` and `INIT_DONE` pins. Added reference to the External Memory Interface Pin Information for Intel^® Agilex™ Devices in the External Memory Interface Pins section. Added reference to the E-Tile Transceiver PHY User Guide in the E-Tile Pins section.
2019.06.10	Initial release.

Document Version

Changes

2020.01.23

Changed the Early Power Estimator (EPE) tool name to Intel^® FPGA Power and Thermal Calculator.
Updated the VCCPGM power supply to the VCCIO_SDM power supply in the connection guidelines of the TMS and TDI pins.
Updated the pin description of the TCK, TMS, TDI, nSTATUS, nCONFIG, and OSC_CLK_1 pins.
Updated the pin description of the AVST_DATA[31:0] and AVST_READY(3A bank) pins.
Updated the pin names from SDM_MISSION_DATA[31:0], SDM_MISSION_CLK, andSDM_MISSION_DATA_VALID to AVST_DATA[31:0], AVST_CLK, and AVST_VALID.
Updated pin name I_PIN_PERST_N_U[10,20]_P to I_PIN_PERST_N_P.
Updated the I/O standard naming from 1.5V True Differential Signaling to True Differential Signaling.
Updated supported I/O standard from SSTL 1.2V to 1.2V LVCMOS for the AVST_READY(3A bank), AVST_CLK(3A bank), and AVST_VALID(3A bank) pins.
Updated the pin description of the DIFF_RX[2][A,B,C,D][1:24][p,n], DIFF_RX[3][A,B,C,D][1:24][p,n], DIFF_TX[2][A,B,C,D][1:24][p,n], and DIFF_TX[3][A,B,C,D][1:24][p,n] pins.
Updated the resistor value from 2kΩ to 2.8kΩ for the IO_AUX_RREF[10,20]_P pins.
Updated the pin description and connection guidelines of the VCCBAT pin.
Updated the pin description and connection guidelines of the VCCPT pin.
Updated the pin description and connection guidelines of the VCCR_CORE pin.
Updated the pin description of the VCCA_PLL pin.
Updated the connection guidelines of the DNU pins.
Updated the connection guidelines of the VCCIO_SDM pin.
Updated the pin function of the RREF_SDM pin.
Updated the pin description and connection guidelines of the REFCLK_GXE(L8,R9)_CH[0:8][p,n] pins.
Updated the connection guidelines of the GXP[L10A,R11A]_RX_CH[19:0][p,n] pins.
Updated the connection guidelines of the GXP[L10A,R11A]_TX_CH[19:0][p,n] pins.
Updated the connection guidelines of the REFCLK_GXP[L10A,R11A]_CH[0,2][p,n] pins.
Updated the resistor value from 200Ω to 169Ω of the U[10,20]_P_IORESREF_0 pins.
Updated the connection guidelines of the I_PIN_PERST_P pins.
Updated the connection guidelines of the VCCL_HPS pin.
Updated Table: Power Supply Sharing Guidelines for Intel^® Agilex™ Device.
Updated Figure: Example Power Supply Sharing Guidelines for Intel^® Agilex™ Device.
Added SDM_IO8 to AVST x16 and x32 for the CONF_DONE and INIT_DONE pins.
Added reference to the External Memory Interface Pin Information for Intel^® Agilex™ Devices in the External Memory Interface Pins section.
Added reference to the E-Tile Transceiver PHY User Guide in the E-Tile Pins section.

2019.06.10

Initial release.