Arria V Device Datasheet

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AV-51002 | 2019.04.26

Arria V GX, GT, SX, and ST Device Datasheet

This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing for Arria^® V devices.

Arria^® V devices are offered in commercial and industrial grades. Commercial devices are offered in –C4 (fastest), –C5, and –C6 speed grades. Industrial grade devices are offered in the –I3 and –I5 speed grades.

Electrical Characteristics

The following sections describe the operating conditions and power consumption of Arria^® V devices.

Operating Conditions

Arria^® V devices are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of the Arria^® V devices, you must consider the operating requirements described in this section.

Absolute Maximum Ratings

This section defines the maximum operating conditions for Arria^® V devices. The values are based on experiments conducted with the devices and theoretical modeling of breakdown and damage mechanisms.

The functional operation of the device is not implied for these conditions.

CAUTION:

Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device.

Table 1. Absolute Maximum Ratings for Arria^® V Devices
Symbol	Description	Minimum	Maximum	Unit
V_CC	Core voltage power supply	–0.50	1.43	V
V_CCP	Periphery circuitry, PCI Express* ( PCIe* ) hard IP block, and transceiver physical coding sublayer (PCS) power supply	–0.50	1.43	V
V_CCPGM	Configuration pins power supply	–0.50	3.90	V
V_{CC_AUX}	Auxiliary supply	–0.50	3.25	V
V_CCBAT	Battery back-up power supply for design security volatile key register	–0.50	3.90	V
V_CCPD	I/O pre-driver power supply	–0.50	3.90	V
V_CCIO	I/O power supply	–0.50	3.90	V
V_{CCD_FPLL}	Phase-locked loop (PLL) digital power supply	–0.50	1.80	V
V_{CCA_FPLL}	PLL analog power supply	–0.50	3.25	V
V_{CCA_GXB}	Transceiver high voltage power	–0.50	3.25	V
V_{CCH_GXB}	Transmitter output buffer power	–0.50	1.80	V
V_{CCR_GXB}	Receiver power	–0.50	1.50	V
V_{CCT_GXB}	Transmitter power	–0.50	1.50	V
V_{CCL_GXB}	Transceiver clock network power	–0.50	1.50	V
V_I	DC input voltage	–0.50	3.80	V
V_{CC_HPS}	HPS core voltage and periphery circuitry power supply	–0.50	1.43	V
V_{CCPD_HPS}	HPS I/O pre-driver power supply	–0.50	3.90	V
V_{CCIO_HPS}	HPS I/O power supply	–0.50	3.90	V
V_{CCRSTCLK_HPS}	HPS reset and clock input pins power supply	–0.50	3.90	V
V_{CCPLL_HPS}	HPS PLL analog power supply	–0.50	3.25	V
V_{CC_AUX_SHARED}	HPS auxiliary power supply	–0.50	3.25	V
I_OUT	DC output current per pin	–25	40	mA
T_J	Operating junction temperature	–55	125	°C
T_STG	Storage temperature (no bias)	–65	150	°C

Maximum Allowed Overshoot and Undershoot Voltage

During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input currents less than 100 mA and periods shorter than 20 ns.

The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal is equivalent to 100% duty cycle.

For example, a signal that overshoots to 4.00 V can only be at 4.00 V for ~15% over the lifetime of the device; for a device lifetime of 10 years, this amounts to 1.5 years.

Table 2. Maximum Allowed Overshoot During Transitions for Arria^® V DevicesThis table lists the maximum allowed input overshoot voltage and the duration of the overshoot voltage as a percentage of device lifetime.
Symbol	Description	Condition (V)	Overshoot Duration as % of High Time	Unit
Vi (AC)	AC input voltage	3.8	100	%
		3.85	68	%
		3.9	45	%
		3.95	28	%
		4	15	%
		4.05	13	%
		4.1	11	%
		4.15	9	%
		4.2	8	%
		4.25	7	%
		4.3	5.4	%
		4.35	3.2	%
		4.4	1.9	%
		4.45	1.1	%
		4.5	0.6	%
		4.55	0.4	%
		4.6	0.2	%

For an overshoot of 3.8 V, the percentage of high time for the overshoot can be as high as 100% over a 10-year period. Percentage of high time is calculated as ([delta T]/T) × 100. This 10-year period assumes that the device is always turned on with 100% I/O toggle rate and 50% duty cycle signal.

Figure 1. Arria^® V Devices Overshoot Duration

Recommended Operating Conditions

This section lists the functional operation limits for the AC and DC parameters for Arria^® V devices.

Recommended Operating Conditions

Table 3. Recommended Operating Conditions for Arria^® V DevicesThis table lists the steady-state voltage values expected from Arria^® V devices. Power supply ramps must all be strictly monotonic, without plateaus.
Symbol	Description	Condition	Minimum ¹	Typical	Maximum¹	Unit
V_CC	Core voltage power supply	–C4, –I5, –C5, –C6	1.07	1.1	1.13	V
V_CC	Core voltage power supply	–I3	1.12	1.15	1.18	V
V_CCP	Periphery circuitry, PCIe* hard IP block, and transceiver PCS power supply	–C4, –I5, –C5, –C6	1.07	1.1	1.13	V
V_CCP		–I3	1.12	1.15	1.18	V
V_CCPGM	Configuration pins power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
		1.8 V	1.71	1.8	1.89	V
V_{CC_AUX}	Auxiliary supply	—	2.375	2.5	2.625	V
V_CCBAT ²	Battery back-up power supply (For design security volatile key register)	—	1.2	—	3.0	V
V_CCPD ³	I/O pre-driver power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
V_CCIO	I/O buffers power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
		1.8 V	1.71	1.8	1.89	V
		1.5 V	1.425	1.5	1.575	V
		1.35 V	1.283	1.35	1.418	V
		1.25 V	1.19	1.25	1.31	V
		1.2 V	1.14	1.2	1.26	V
V_{CCD_FPLL}	PLL digital voltage regulator power supply	—	1.425	1.5	1.575	V
V_{CCA_FPLL}	PLL analog voltage regulator power supply	—	2.375	2.5	2.625	V
V_I	DC input voltage	—	–0.5	—	3.6	V
V_O	Output voltage	—	0	—	V_CCIO	V
T_J	Operating junction temperature	Commercial	0	—	85	°C
T_J	Operating junction temperature	Industrial	–40	—	100	°C
t_RAMP ⁴	Power supply ramp time	Standard POR	200 µs	—	100 ms	—
t_RAMP ⁴	Power supply ramp time	Fast POR	200 µs	—	4 ms	—

¹ The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.

² If you do not use the design security feature in Arria^® V devices, connect V_CCBAT to a 1.5-V, 2.5-V, or 3.0-V power supply. Arria^® V power-on reset (POR) circuitry monitors V_CCBAT. Arria^® V devices do not exit POR if V_CCBAT is not powered up.

³ V_CCPD must be 2.5 V when V_CCIO is 2.5, 1.8, 1.5, 1.35, 1.25, or 1.2 V. V_CCPD must be 3.0 V when V_CCIO is 3.0 V. V_CCPD must be 3.3 V when V_CCIO is 3.3 V.

⁴ This is also applicable to HPS power supply. For HPS power supply, refer to t_RAMP specifications for standard POR when HPS_PORSEL = 0 and t_RAMP specifications for fast POR when HPS_PORSEL = 1.

Transceiver Power Supply Operating Conditions

Table 4. Transceiver Power Supply Operating Conditions for Arria^® V Devices
Symbol	Description	Minimum ⁵	Typical	Maximum⁵	Unit
V_{CCA_GXBL}	Transceiver high voltage power (left side)	2.375	2.500	2.625	V
V_{CCA_GXBR}	Transceiver high voltage power (right side)	2.375	2.500	2.625	V
V_{CCR_GXBL}	GX and SX speed grades—receiver power (left side)	1.08/1.12	1.1/1.15 ⁶	1.14/1.18	V
V_{CCR_GXBR}	GX and SX speed grades—receiver power (right side)	1.08/1.12	1.1/1.15 ⁶	1.14/1.18	V
V_{CCR_GXBL}	GT and ST speed grades—receiver power (left side)	1.17	1.20	1.23	V
V_{CCR_GXBR}	GT and ST speed grades—receiver power (right side)	1.17	1.20	1.23	V
V_{CCT_GXBL}	GX and SX speed grades—transmitter power (left side)	1.08/1.12	1.1/1.15⁶	1.14/1.18	V
V_{CCT_GXBR}	GX and SX speed grades—transmitter power (right side)	1.08/1.12	1.1/1.15⁶	1.14/1.18	V
V_{CCT_GXBL}	GT and ST speed grades—transmitter power (left side)	1.17	1.20	1.23	V
V_{CCT_GXBR}	GT and ST speed grades—transmitter power (right side)	1.17	1.20	1.23	V
V_{CCH_GXBL}	Transmitter output buffer power (left side)	1.425	1.500	1.575	V
V_{CCH_GXBR}	Transmitter output buffer power (right side)	1.425	1.500	1.575	V
V_{CCL_GXBL}	GX and SX speed grades—clock network power (left side)	1.08/1.12	1.1/1.15⁶	1.14/1.18	V
V_{CCL_GXBR}	GX and SX speed grades—clock network power (right side)	1.08/1.12	1.1/1.15⁶	1.14/1.18	V
V_{CCL_GXBL}	GT and ST speed grades—clock network power (left side)	1.17	1.20	1.23	V
V_{CCL_GXBR}	GT and ST speed grades—clock network power (right side)	1.17	1.20	1.23	V

⁵ The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.

⁶ For data rate <=3.2 Gbps, connect V_{CCR_GXBL/R}, V_{CCT_GXBL/R}, or V_{CCL_GXBL/R} to either 1.1-V or 1.15-V power supply. For data rate >3.2 Gbps, connect V_{CCR_GXBL/R}, V_{CCT_GXBL/R}, or V_{CCL_GXBL/R} to a 1.15-V power supply. For details, refer to the Arria^® V GT, GX, ST, and SX Device Family Pin Connection Guidelines.

HPS Power Supply Operating Conditions

Table 5. HPS Power Supply Operating Conditions for Arria^® V SX and ST DevicesThis table lists the steady-state voltage and current values expected from Arria^® V system-on-a-chip (SoC) devices with Arm* -based hard processor system (HPS). Power supply ramps must all be strictly monotonic, without plateaus. Refer to Recommended Operating Conditions for Arria^® V Devices table for the steady-state voltage values expected from the FPGA portion of the Arria^® V SoC devices.
Symbol	Description	Condition	Minimum ⁷	Typical	Maximum⁷	Unit
V_{CC_HPS}	HPS core voltage and periphery circuitry power supply	–C4, –I5, –C5, –C6	1.07	1.1	1.13	V
V_{CC_HPS}	HPS core voltage and periphery circuitry power supply	–I3	1.12	1.15	1.18	V
V_{CCPD_HPS} ⁸	HPS I/O pre-driver power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
V_{CCIO_HPS}	HPS I/O buffers power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
		1.8 V	1.71	1.8	1.89	V
		1.5 V	1.425	1.5	1.575	V
		1.35 V ⁹	1.283	1.35	1.418	V
		1.2 V	1.14	1.2	1.26	V
V_{CCRSTCLK_HPS}	HPS reset and clock input pins power supply	3.3 V	3.135	3.3	3.465	V
		3.0 V	2.85	3.0	3.15	V
		2.5 V	2.375	2.5	2.625	V
		1.8 V	1.71	1.8	1.89	V
V_{CCPLL_HPS}	HPS PLL analog voltage regulator power supply	—	2.375	2.5	2.625	V
V_{CC_AUX_SHARED}	HPS auxiliary power supply	—	2.375	2.5	2.625	V

⁷ The power supply value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.

⁸ V_{CCPD_HPS} must be 2.5 V when V_{CCIO_HPS} is 2.5, 1.8, 1.5, or 1.2 V. V_{CCPD_HPS} must be 3.0 V when V_{CCIO_HPS} is 3.0 V. V_{CCPD_HPS} must be 3.3 V when V_{CCIO_HPS} is 3.3 V.

⁹ V_{CCIO_HPS} 1.35 V is supported for HPS row I/O bank only.

DC Characteristics

Supply Current and Power Consumption

Intel offers two ways to estimate power for your design—the Excel-based Early Power Estimator (EPE) and the Intel^® Quartus^® Prime Power Analyzer feature.

Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides a magnitude estimate of the device power because these currents vary greatly with the resources you use.

The Intel^® Quartus^® Prime Power Analyzer provides better quality estimates based on the specifics of the design after you complete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated signal activities that, when combined with detailed circuit models, yields very accurate power estimates.

I/O Pin Leakage Current

Table 6. I/O Pin Leakage Current for Arria^® V Devices
Symbol	Description	Condition	Min	Typ	Max	Unit
I_I	Input pin	V_I = 0 V to V_CCIOMAX	–30	—	30	µA
I_OZ	Tri-stated I/O pin	V_O = 0 V to V_CCIOMAX	–30	—	30	µA

Bus Hold Specifications

Table 7. Bus Hold Parameters for Arria^® V DevicesThe bus-hold trip points are based on calculated input voltages from the JEDEC* standard.
Parameter	Symbol	Condition	V_CCIO (V)												Unit
			1.2		1.5		1.8		2.5		3.0		3.3
			Min	Max	Min	Max	Min	Max	Min	Max	Min	Max	Min	Max
Bus-hold, low, sustaining current	I_SUSL	V_IN > V_IL (max)	8	—	12	—	30	—	50	—	70	—	70	—	µA
Bus-hold, high, sustaining current	I_SUSH	V_IN < V_IH (min)	–8	—	–12	—	–30	—	–50	—	–70	—	–70	—	µA
Bus-hold, low, overdrive current	I_ODL	0 V < V_IN < V_CCIO	—	125	—	175	—	200	—	300	—	500	—	500	µA
Bus-hold, high, overdrive current	I_ODH	0 V <V_IN <V_CCIO	—	–125	—	–175	—	–200	—	–300	—	–500	—	–500	µA
Bus-hold trip point	V_TRIP	—	0.3	0.9	0.375	1.125	0.68	1.07	0.7	1.7	0.8	2	0.8	2	V

OCT Calibration Accuracy Specifications

If you enable on-chip termination (OCT) calibration, calibration is automatically performed at power up for I/Os connected to the calibration block.

Table 8. OCT Calibration Accuracy Specifications for Arria^® V DevicesCalibration accuracy for the calibrated on-chip series termination (R_S OCT) and on-chip parallel termination (R_T OCT) are applicable at the moment of calibration. When process, voltage, and temperature (PVT) conditions change after calibration, the tolerance may change.
Symbol	Description	Condition (V)	Calibration Accuracy			Unit
Symbol	Description	Condition (V)	–I3, –C4	–I5, –C5	–C6	Unit
25-Ω R_S	Internal series termination with calibration (25-Ω setting)	V_CCIO = 3.0, 2.5, 1.8, 1.5, 1.2	±15	±15	±15	%
50-Ω R_S	Internal series termination with calibration (50-Ω setting)	V_CCIO = 3.0, 2.5, 1.8, 1.5, 1.2	±15	±15	±15	%
34-Ω and 40-Ω R_S	Internal series termination with calibration (34-Ω and 40-Ω setting)	V_CCIO = 1.5, 1.35, 1.25, 1.2	±15	±15	±15	%
48-Ω, 60-Ω, and 80-Ω R_S	Internal series termination with calibration (48-Ω, 60-Ω, and 80-Ω setting)	V_CCIO = 1.2	±15	±15	±15	%
50-Ω R_T	Internal parallel termination with calibration (50-Ω setting)	V_CCIO = 2.5, 1.8, 1.5, 1.2	–10 to +40	–10 to +40	–10 to +40	%
20-Ω, 30-Ω, 40-Ω,60-Ω, and 120-Ω R_T	Internal parallel termination with calibration (20-Ω, 30-Ω, 40-Ω, 60-Ω, and 120-Ω setting)	V_CCIO = 1.5, 1.35, 1.25	–10 to +40	–10 to +40	–10 to +40	%
60-Ω and 120-Ω R_T	Internal parallel termination with calibration (60-Ω and 120-Ω setting)	V_CCIO = 1.2	–10 to +40	–10 to +40	–10 to +40	%
25-Ω R_{S_left_shift}	Internal left shift series termination with calibration (25-Ω R_{S_left_shift} setting)	V_CCIO = 3.0, 2.5, 1.8, 1.5, 1.2	±15	±15	±15	%

OCT Without Calibration Resistance Tolerance Specifications

Table 9. OCT Without Calibration Resistance Tolerance Specifications for Arria^® V DevicesThis table lists the Arria^® V OCT without calibration resistance tolerance to PVT changes.
Symbol	Description	Condition (V)	Resistance Tolerance			Unit
Symbol	Description	Condition (V)	–I3, –C4	–I5, –C5	–C6	Unit
25-Ω R_S	Internal series termination without calibration (25-Ω setting)	V_CCIO = 3.0, 2.5	±30	±40	±40	%
25-Ω R_S	Internal series termination without calibration (25-Ω setting)	V_CCIO = 1.8, 1.5	±30	±40	±40	%
25-Ω R_S	Internal series termination without calibration (25-Ω setting)	V_CCIO = 1.2	±35	±50	±50	%
50-Ω R_S	Internal series termination without calibration (50-Ω setting)	V_CCIO = 3.0, 2.5	±30	±40	±40	%
50-Ω R_S	Internal series termination without calibration (50-Ω setting)	V_CCIO = 1.8, 1.5	±30	±40	±40	%
50-Ω R_S	Internal series termination without calibration (50-Ω setting)	V_CCIO = 1.2	±35	±50	±50	%
100-Ω R_D	Internal differential termination (100-Ω setting)	V_CCIO = 2.5	±25	±40	±40	%

Figure 2. Equation for OCT Variation Without Recalibration

The definitions for the equation are as follows:

The R_OCT value calculated shows the range of OCT resistance with the variation of temperature and V_CCIO.
R_SCAL is the OCT resistance value at power-up.
ΔT is the variation of temperature with respect to the temperature at power up.
ΔV is the variation of voltage with respect to the V_CCIO at power up.
dR/dT is the percentage change of R_SCAL with temperature.
dR/dV is the percentage change of R_SCAL with voltage.

OCT Variation after Power-Up Calibration

Table 10. OCT Variation after Power-Up Calibration for Arria^® V DevicesThis table lists OCT variation with temperature and voltage after power-up calibration. The OCT variation is valid for a V_CCIO range of ±5% and a temperature range of 0°C to 85°C.
Symbol	Description	V_CCIO (V)	Value	Unit
dR/dV	OCT variation with voltage without recalibration	3.0	0.100	%/mV
		2.5	0.100
		1.8	0.100
		1.5	0.100
		1.35	0.150
		1.25	0.150
		1.2	0.150
dR/dT	OCT variation with temperature without recalibration	3.0	0.189	%/°C
		2.5	0.208
		1.8	0.266
		1.5	0.273
		1.35	0.200
		1.25	0.200
		1.2	0.317

Pin Capacitance

Table 11. Pin Capacitance for Arria^® V Devices
Symbol	Description	Maximum	Unit
C_IOTB	Input capacitance on top/bottom I/O pins	6	pF
C_IOLR	Input capacitance on left/right I/O pins	6	pF
C_OUTFB	Input capacitance on dual-purpose clock output/feedback pins	6	pF
C_IOVREF	Input capacitance on V_REF pins	48	pF

Hot Socketing

Table 12. Hot Socketing Specifications for Arria^® V Devices
Symbol	Description	Maximum	Unit
I_{IOPIN (DC)}	DC current per I/O pin	300	μA
I_{IOPIN (AC)}	AC current per I/O pin	8¹⁰	mA
I_{XCVR-TX (DC)}	DC current per transceiver transmitter (TX) pin	100	mA
I_{XCVR-RX (DC)}	DC current per transceiver receiver (RX) pin	50	mA

¹⁰ The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |I_IOPIN| = C dv/dt, in which C is the I/O pin capacitance and dv/dt is the slew rate.

Internal Weak Pull-Up Resistor

All I/O pins, except configuration, test, and JTAG pins, have an option to enable weak pull-up.

Table 13. Internal Weak Pull-Up Resistor Values for Arria^® V Devices
Symbol	Description	Condition (V)¹¹	Value¹²	Unit
R_PU	Value of the I/O pin pull-up resistor before and during configuration, as well as user mode if you have enabled the programmable pull-up resistor option.	V_CCIO = 3.3 ±5%	25	kΩ
		V_CCIO = 3.0 ±5%	25	kΩ
		V_CCIO = 2.5 ±5%	25	kΩ
		V_CCIO = 1.8 ±5%	25	kΩ
		V_CCIO = 1.5 ±5%	25	kΩ
		V_CCIO = 1.35 ±5%	25	kΩ
		V_CCIO = 1.25 ±5%	25	kΩ
		V_CCIO = 1.2 ±5%	25	kΩ

¹¹ Pin pull-up resistance values may be lower if an external source drives the pin higher than V_CCIO.

¹² Valid with ±10% tolerances to cover changes over PVT.

I/O Standard Specifications

Tables in this section list the input voltage (V_IH and V_IL), output voltage (V_OH and V_OL), and current drive characteristics (I_OH and I_OL) for various I/O standards supported by Arria^® V devices.

You must perform timing closure analysis to determine the maximum achievable frequency for general purpose I/O standards.

Single-Ended I/O Standards

Table 14. Single-Ended I/O Standards for Arria^® V Devices
I/O Standard	V_CCIO (V)			V_IL (V)		V_IH (V)		V_OL (V)	V_OH (V)	I_OL ¹³ (mA)	I_OH ¹³ (mA)
I/O Standard	Min	Typ	Max	Min	Max	Min	Max	Max	Min	I_OL ¹³ (mA)	I_OH ¹³ (mA)
3.3-V LVTTL	3.135	3.3	3.465	–0.3	0.8	1.7	3.6	0.45	2.4	4	–4
3.3-V LVCMOS	3.135	3.3	3.465	–0.3	0.8	1.7	3.6	0.2	V_CCIO – 0.2	2	–2
3.0-V LVTTL	2.85	3	3.15	–0.3	0.8	1.7	3.6	0.4	2.4	2	–2
3.0-V LVCMOS	2.85	3	3.15	–0.3	0.8	1.7	3.6	0.2	V_CCIO – 0.2	0.1	–0.1
3.0-V PCI*	2.85	3	3.15	—	0.3 × V_CCIO	0.5 × V_CCIO	V_CCIO + 0.3	0.1 × V_CCIO	0.9 × V_CCIO	1.5	–0.5
3.0-V PCI* -X	2.85	3	3.15	—	0.35 × V_CCIO	0.5 × V_CCIO	V_CCIO + 0.3	0.1 × V_CCIO	0.9 × V_CCIO	1.5	–0.5
2.5 V	2.375	2.5	2.625	–0.3	0.7	1.7	3.6	0.4	2	1	–1
1.8 V	1.71	1.8	1.89	–0.3	0.35 × V_CCIO	0.65 × V_CCIO	V_CCIO + 0.3	0.45	V_CCIO – 0.45	2	–2
1.5 V	1.425	1.5	1.575	–0.3	0.35 × V_CCIO	0.65 × V_CCIO	V_CCIO + 0.3	0.25 × V_CCIO	0.75 × V_CCIO	2	–2
1.2 V	1.14	1.2	1.26	–0.3	0.35 × V_CCIO	0.65 × V_CCIO	V_CCIO + 0.3	0.25 × V_CCIO	0.75 × V_CCIO	2	–2

¹³ To meet the I_OL and I_OH specifications, you must set the current strength settings accordingly. For example, to meet the 3.3-V LVTTL specification (4 mA), you should set the current strength settings to 4 mA. Setting at lower current strength may not meet the I_OL and I_OH specifications in the datasheet.

Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications

Table 15. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications for Arria^® V Devices
I/O Standard	V_CCIO (V)			V_REF (V)			V_TT (V)
I/O Standard	Min	Typ	Max	Min	Typ	Max	Min	Typ	Max
SSTL-2 Class I, II	2.375	2.5	2.625	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO	V_REF – 0.04	V_REF	V_REF + 0.04
SSTL-18 Class I, II	1.71	1.8	1.89	0.833	0.9	0.969	V_REF – 0.04	V_REF	V_REF + 0.04
SSTL-15 Class I, II	1.425	1.5	1.575	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO
SSTL-135 Class I, II	1.283	1.35	1.418	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO
SSTL-125 Class I, II	1.19	1.25	1.26	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO
HSTL-18 Class I, II	1.71	1.8	1.89	0.85	0.9	0.95	—	V_CCIO/2	—
HSTL-15 Class I, II	1.425	1.5	1.575	0.68	0.75	0.9	—	V_CCIO/2	—
HSTL-12 Class I, II	1.14	1.2	1.26	0.47 × V_CCIO	0.5 × V_CCIO	0.53 × V_CCIO	—	V_CCIO/2	—
HSUL-12	1.14	1.2	1.3	0.49 × V_CCIO	0.5 × V_CCIO	0.51 × V_CCIO	—	—	—

Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications

Table 16. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications for Arria^® V Devices
I/O Standard	V_IL(DC) (V)		V_IH(DC) (V)		V_IL(AC) (V)	V_IH(AC) (V)	V_OL (V)	V_OH (V)	I_OL ¹⁴ (mA)	I_OH ¹⁴ (mA)
I/O Standard	Min	Max	Min	Max	Max	Min	Max	Min	I_OL ¹⁴ (mA)	I_OH ¹⁴ (mA)
SSTL-2 Class I	–0.3	V_REF – 0.15	V_REF + 0.15	V_CCIO + 0.3	V_REF – 0.31	V_REF + 0.31	V_TT – 0.608	V_TT + 0.608	8.1	–8.1
SSTL-2 Class II	–0.3	V_REF – 0.15	V_REF + 0.15	V_CCIO + 0.3	V_REF – 0.31	V_REF + 0.31	V_TT – 0.81	V_TT + 0.81	16.2	–16.2
SSTL-18 Class I	–0.3	V_REF – 0.125	V_REF + 0.125	V_CCIO + 0.3	V_REF – 0.25	V_REF + 0.25	V_TT – 0.603	V_TT + 0.603	6.7	–6.7
SSTL-18 Class II	–0.3	V_REF – 0.125	V_REF + 0.125	V_CCIO + 0.3	V_REF – 0.25	V_REF + 0.25	0.28	V_CCIO – 0.28	13.4	–13.4
SSTL-15 Class I	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.175	V_REF + 0.175	0.2 × V_CCIO	0.8 × V_CCIO	8	–8
SSTL-15 Class II	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.175	V_REF + 0.175	0.2 × V_CCIO	0.8 × V_CCIO	16	–16
SSTL-135	—	V_REF – 0.09	V_REF + 0.09	—	V_REF – 0.16	V_REF + 0.16	0.2 × V_CCIO	0.8 × V_CCIO	—	—
SSTL-125	—	V_REF – 0.85	V_REF + 0.85	—	V_REF – 0.15	V_REF + 0.15	0.2 × V_CCIO	0.8 × V_CCIO	—	—
HSTL-18 Class I	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.2	V_REF + 0.2	0.4	V_CCIO – 0.4	8	–8
HSTL-18 Class II	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.2	V_REF + 0.2	0.4	V_CCIO – 0.4	16	–16
HSTL-15 Class I	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.2	V_REF + 0.2	0.4	V_CCIO – 0.4	8	–8
HSTL-15 Class II	—	V_REF – 0.1	V_REF + 0.1	—	V_REF – 0.2	V_REF + 0.2	0.4	V_CCIO – 0.4	16	–16
HSTL-12 Class I	–0.15	V_REF – 0.08	V_REF + 0.08	V_CCIO + 0.15	V_REF – 0.15	V_REF + 0.15	0.25 × V_CCIO	0.75 × V_CCIO	8	–8
HSTL-12 Class II	–0.15	V_REF – 0.08	V_REF + 0.08	V_CCIO+ 0.15	V_REF – 0.15	V_REF + 0.15	0.25 × V_CCIO	0.75 × V_CCIO	16	–16
HSUL-12	—	V_REF – 0.13	V_REF + 0.13	—	V_REF – 0.22	V_REF + 0.22	0.1 × V_CCIO	0.9 × V_CCIO	—	—

¹⁴ To meet the I_OL and I_OH specifications, you must set the current strength settings accordingly. For example, to meet the SSTL15CI specification (8 mA), you should set the current strength settings to 8 mA. Setting at lower current strength may not meet the I_OL and I_OH specifications in the datasheet.

Differential SSTL I/O Standards

Table 17. Differential SSTL I/O Standards for Arria^® V Devices
I/O Standard	V_CCIO (V)			V_SWING(DC) (V)		V_X(AC) (V)			V_SWING(AC) (V)
I/O Standard	Min	Typ	Max	Min	Max	Min	Typ	Max	Min	Max
SSTL-2 Class I, II	2.375	2.5	2.625	0.3	V_CCIO + 0.6	V_CCIO/2 – 0.2	—	V_CCIO/2 + 0.2	0.62	V_CCIO + 0.6
SSTL-18 Class I, II	1.71	1.8	1.89	0.25	V_CCIO + 0.6	V_CCIO/2 – 0.175	—	V_CCIO/2 + 0.175	0.5	V_CCIO + 0.6
SSTL-15 Class I, II	1.425	1.5	1.575	0.2	¹⁵	V_CCIO/2 – 0.15	—	V_CCIO/2 + 0.15	2(V_IH(AC) – V_REF)	2(V_IL(AC) – V_REF)
SSTL-135	1.283	1.35	1.45	0.18	¹⁵	V_CCIO/2 – 0.15	V_CCIO/2	V_CCIO/2 + 0.15	2(V_IH(AC) – V_REF)	2(V_IL(AC) – V_REF)
SSTL-125	1.19	1.25	1.31	0.18	¹⁵	V_CCIO/2 – 0.15	V_CCIO/2	V_CCIO/2 + 0.15	2(V_IH(AC) – V_REF)	2(V_IL(AC) – V_REF)

¹⁵ The maximum value for V_SWING(DC) is not defined. However, each single-ended signal needs to be within the respective single-ended limits (V_IH(DC) and V_IL(DC)).

Differential HSTL and HSUL I/O Standards

Table 18. Differential HSTL and HSUL I/O Standards for Arria^® V Devices
I/O Standard	V_CCIO (V)			V_DIF(DC) (V)		V_X(AC) (V)			V_CM(DC) (V)			V_DIF(AC) (V)
I/O Standard	Min	Typ	Max	Min	Max	Min	Typ	Max	Min	Typ	Max	Min	Max
HSTL-18 Class I, II	1.71	1.8	1.89	0.2	—	0.78	—	1.12	0.78	—	1.12	0.4	—
HSTL-15 Class I, II	1.425	1.5	1.575	0.2	—	0.68	—	0.9	0.68	—	0.9	0.4	—
HSTL-12 Class I, II	1.14	1.2	1.26	0.16	V_CCIO + 0.3	—	0.5 × V_CCIO	—	0.4 × V_CCIO	0.5 × V_CCIO	0.6 × V_CCIO	0.3	V_CCIO + 0.48
HSUL-12	1.14	1.2	1.3	0.26	0.26	0.5 × V_CCIO – 0.12	0.5 × V_CCIO	0.5 × V_CCIO + 0.12	0.4 × V_CCIO	0.5 × V_CCIO	0.6 × V_CCIO	0.44	0.44

Differential I/O Standard Specifications

Table 19. **Differential I/O Standard Specifications for Arria^® V Devices** Differential inputs are powered by V_CCPD which requires 2.5 V.
I/O Standard	V_CCIO (V)			V_ID (mV)¹⁶			V_ICM(DC) (V)			V_OD (V) ¹⁷			V_OCM (V)¹⁷ ¹⁸
I/O Standard	Min	Typ	Max	Min	Condition	Max	Min	Condition	Max	Min	Typ	Max	Min	Typ	Max
PCML	Transmitter, receiver, and input reference clock pins of high-speed transceivers use the PCML I/O standard. For transmitter, receiver, and reference clock I/O pin specifications, refer to Transceiver Specifications for Arria^® V GX and SX Devices and Transceiver Specifications for Arria^® V GT and ST Devices tables.
2.5 V LVDS¹⁹	2.375	2.5	2.625	100	V_CM = 1.25 V	—	0.05	D_MAX ≤ 1.25 Gbps	1.80	0.247	—	0.6	1.125	1.25	1.375
2.5 V LVDS¹⁹	2.375	2.5	2.625	100	V_CM = 1.25 V	—	1.05	D_MAX > 1.25 Gbps	1.55	0.247	—	0.6	1.125	1.25	1.375
RSDS (HIO)²⁰	2.375	2.5	2.625	100	V_CM = 1.25 V	—	0.25	—	1.45	0.1	0.2	0.6	0.5	1.2	1.4
Mini-LVDS (HIO)²¹	2.375	2.5	2.625	200	—	600	0.300	—	1.425	0.25	—	0.6	1	1.2	1.4
LVPECL²²	—	—	—	300	—	—	0.60	D_MAX ≤ 700 Mbps	1.80	—	—	—	—	—	—
LVPECL²²	—	—	—	300	—	—	1.00	D_MAX > 700 Mbps	1.60	—	—	—	—	—	—

¹⁶ The minimum V_ID value is applicable over the entire common mode range, V_CM.

¹⁷ R_L range: 90 ≤ R_L ≤ 110 Ω.

¹⁸ This applies to default pre-emphasis setting only.

¹⁹ For optimized LVDS receiver performance, the receiver voltage input range must be within 1.0 V to 1.6 V for data rates above 1.25 Gbps and 0 V to 1.85 V for data rates below 1.25 Gbps.

²⁰ For optimized RSDS receiver performance, the receiver voltage input range must be within 0.25 V to 1.45 V.

²¹ For optimized Mini-LVDS receiver performance, the receiver voltage input range must be within 0.3 V to 1.425 V.

²² For optimized LVPECL receiver performance, the receiver voltage input range must be within 0.85 V to 1.75 V for data rates above 700 Mbps and 0.45 V to 1.95 V for data rates below 700 Mbps.

Switching Characteristics

This section provides performance characteristics of Arria^® V core and periphery blocks.

Transceiver Performance Specifications

Transceiver Specifications for Arria V GX and SX Devices

Table 20. Reference Clock Specifications for Arria^® V GX and SX Devices
Symbol/Description	Condition	Transceiver Speed Grade 4			Transceiver Speed Grade 6			Unit
Symbol/Description	Condition	Min	Typ	Max	Min	Typ	Max	Unit
Supported I/O standards	1.2 V PCML, 1.4 V PCML,1.5 V PCML, 2.5 V PCML, Differential LVPECL²³, HCSL, and LVDS
Input frequency from `REFCLK` input pins	—	27	—	710	27	—	710	MHz
Rise time	Measure at ±60 mV of differential signal ²⁴	—	—	400	—	—	400	ps
Fall time	Measure at ±60 mV of differential signal²⁴	—	—	400	—	—	400	ps
Duty cycle	—	45	—	55	45	—	55	%
Peak-to-peak differential input voltage	—	200	—	300 ²⁵/2000	200	—	300²⁵/2000	mV
Spread-spectrum modulating clock frequency	PCIe*	30	—	33	30	—	33	kHz
Spread-spectrum downspread	PCIe*	—	0 to –0.5%	—	—	0 to –0.5%	—	—
On-chip termination resistors	—	—	100	—	—	100	—	Ω
V_ICM (AC coupled)	—	—	1.1/1.15 ²⁶	—	—	1.1/1.15²⁶	—	V
V_ICM (DC coupled)	HCSL I/O standard for the PCIe* reference clock	250	—	550	250	—	550	mV
Transmitter `REFCLK` phase noise²⁷	10 Hz	—	—	–50	—	—	–50	dBc/Hz
	100 Hz	—	—	–80	—	—	–80	dBc/Hz
	1 KHz	—	—	–110	—	—	–110	dBc/Hz
	10 KHz	—	—	–120	—	—	–120	dBc/Hz
	100 KHz	—	—	–120	—	—	–120	dBc/Hz
	≥1 MHz	—	—	–130	—	—	–130	dBc/Hz
R_REF	—	—	2000 ±1%	—	—	2000 ±1%	—	Ω

Table 21. Transceiver Clocks Specifications for Arria^® V GX and SX Devices
Symbol/Description	Condition	Transceiver Speed Grade 4			Transceiver Speed Grade 6			Unit
Symbol/Description	Condition	Min	Typ	Max	Min	Typ	Max	Unit
`fixedclk` clock frequency	PCIe* Receiver Detect	—	125	—	—	125	—	MHz
Transceiver Reconfiguration Controller Intel^® FPGA IP (`mgmt_clk_clk`) clock frequency	—	75	—	125	75	—	125	MHz

Table 22. Receiver Specifications for Arria^® V GX and SX Devices
Symbol/Description	Condition	Transceiver Speed Grade 4			Transceiver Speed Grade 6			Unit
Symbol/Description	Condition	Min	Typ	Max	Min	Typ	Max	Unit
Supported I/O standards	1.5 V PCML, 2.5 V PCML, LVPECL, and LVDS
Data rate²⁸	—	611	—	6553.6	611	—	3125	Mbps
Absolute V_MAX for a receiver pin²⁹	—	—	—	1.2	—	—	1.2	V
Absolute V_MIN for a receiver pin	—	–0.4	—	—	–0.4	—	—	V
Maximum peak-to-peak differential input voltage V_ID (diff p-p) before device configuration	—	—	—	1.6	—	—	1.6	V
Maximum peak-to-peak differential input voltage V_ID (diff p-p) after device configuration	—	—	—	2.2	—	—	2.2	V
Minimum differential eye opening at the receiver serial input pins³⁰	—	100	—	—	100	—	—	mV
V_ICM (AC coupled)	—	—	0.7/0.75/0.8 ³¹	—	—	0.7/0.75/0.8 ³¹	—	mV
V_ICM (DC coupled)	≤ 3.2Gbps ³²	670	700	730	670	700	730	mV
Differential on-chip termination resistors	85-Ω setting	—	85	—	—	85	—	Ω
	100-Ω setting	—	100	—	—	100	—	Ω
	120-Ω setting	—	120	—	—	120	—	Ω
	150-Ω setting	—	150	—	—	150	—	Ω
t_LTR ³³	—	—	—	10	—	—	10	µs
t_LTD ³⁴	—	4	—	—	4	—	—	µs
t_{LTD_manual} ³⁵	—	4	—	—	4	—	—	µs
t_{LTR_LTD_manual} ³⁶	—	15	—	—	15	—	—	µs
Programmable ppm detector³⁷	—	±62.5, 100, 125, 200, 250, 300, 500, and 1000						ppm
Run length	—	—	—	200	—	—	200	UI
Programmable equalization AC and DC gain	AC gain setting = 0 to 3³⁸ DC gain setting = 0 to 1	Refer to CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices and CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices diagrams.						dB

Table 23. Transmitter Specifications for Arria^® V GX and SX Devices
Symbol/Description	Condition	Transceiver Speed Grade 4			Transceiver Speed Grade 6			Unit
Symbol/Description	Condition	Min	Typ	Max	Min	Typ	Max	Unit
Supported I/O standards	1.5 V PCML
Data rate	—	611	—	6553.6	611	—	3125	Mbps
V_OCM (AC coupled)	—	—	650	—	—	650	—	mV
V_OCM (DC coupled)	≤ 3.2Gbps³²	670	700	730	670	700	730	mV
Differential on-chip termination resistors	85-Ω setting	—	85	—	—	85	—	Ω
	100-Ω setting	—	100	—	—	100	—	Ω
	120-Ω setting	—	120	—	—	120	—	Ω
	150-Ω setting	—	150	—	—	150	—	Ω
Intra-differential pair skew	TX V_CM = 0.65 V (AC coupled) and slew rate of 15 ps	—	—	15	—	—	15	ps
Intra-transceiver block transmitter channel-to-channel skew	×6 PMA bonded mode	—	—	180	—	—	180	ps
Inter-transceiver block transmitter channel-to-channel skew³⁹	×`N` PMA bonded mode	—	—	500	—	—	500	ps

Table 24. CMU PLL Specifications for Arria^® V GX and SX Devices
Symbol/Description	Transceiver Speed Grade 4		Transceiver Speed Grade 6		Unit
Symbol/Description	Min	Max	Min	Max	Unit
Supported data range	611	6553.6	611	3125	Mbps
fPLL supported data range	611	3125	611	3125	Mbps

Table 25. Transceiver-FPGA Fabric Interface Specifications for Arria^® V GX and SX Devices
Symbol/Description	Transceiver Speed Grade 4 and 6		Unit
Symbol/Description	Min	Max	Unit
Interface speed (single-width mode)	25	187.5	MHz
Interface speed (double-width mode)	25	163.84	MHz

²³ Differential LVPECL signal levels must comply to the minimum and maximum peak-to-peak differential input voltage specified in this table.

²⁴ REFCLK performance requires to meet transmitter REFCLK phase noise specification.

²⁵ The maximum peak-to peak differential input voltage of 300 mV is allowed for DC coupled link.

²⁶ For data rate ≤3.2 Gbps, connect V_{CCR_GXBL/R} to either 1.1-V or 1.15-V power supply. For data rate >3.2 Gbps, connect V_{CCR_GXBL/R} to a 1.15-V power supply. For details, refer to the Arria^® V GT, GX, ST, and SX Device Family Pin Connection Guidelines.

²⁷ The transmitter REFCLK phase jitter is 30 ps p-p at bit error rate (BER) 10^-12.

²⁸ To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.

²⁹ The device cannot tolerate prolonged operation at this absolute maximum.

³⁰ The differential eye opening specification at the receiver input pins assumes that you have disabled the Receiver Equalization feature. If you enable the Receiver Equalization feature, the receiver circuitry can tolerate a lower minimum eye opening, depending on the equalization level.

³¹ The AC coupled V_ICM = 700 mV for Arria V GX and SX in PCIe* mode only. The AC coupled V_ICM = 750 mV for Arria V GT and ST in PCIe* mode only.

³² For standard protocol compliance, use AC coupling.

³³ t_LTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset.

³⁴ t_LTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.

³⁵ t_{LTD_manual} is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high when the CDR is functioning in the manual mode.

³⁶ t_{LTR_LTD_manual} is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes high when the CDR is functioning in the manual mode.

³⁷ The rate match FIFO supports only up to ±300 parts per million (ppm).

³⁸ The Intel^® Quartus^® Prime software allows AC gain setting = 3 for design with data rate between 611 Mbps and 1.25 Gbps only.

³⁹ This specification is only applicable to channels on one side of the device across two transceiver banks.

Transceiver Specifications for Arria V GT and ST Devices

Table 26. Reference Clock Specifications for Arria^® V GT and ST Devices
Symbol/Description	Condition	Transceiver Speed Grade 3			Unit
Symbol/Description	Condition	Min	Typ	Max	Unit
Supported I/O standards	1.2 V PCML, 1.4 VPCML, 1.5 V PCML, 2.5 V PCML, Differential LVPECL⁴⁰, HCSL, and LVDS
Input frequency from `REFCLK` input pins	—	27	—	710	MHz
Rise time	Measure at ±60 mV of differential signal ⁴¹	—	—	400	ps
Fall time	Measure at ±60 mV of differential signal⁴¹	—	—	400	ps
Duty cycle	—	45	—	55	%
Peak-to-peak differential input voltage	—	200	—	300⁴²/2000	mV
Spread-spectrum modulating clock frequency	PCIe*	30	—	33	kHz
Spread-spectrum downspread	PCIe*	—	0 to –0.5%	—	—
On-chip termination resistors	—	—	100	—	Ω
V_ICM (AC coupled)	—	—	1.2	—	V
V_ICM (DC coupled)	HCSL I/O standard for the PCIe* reference clock	250	—	550	mV
Transmitter `REFCLK` phase noise⁴³	10 Hz	—	—	–50	dBc/Hz
	100 Hz	—	—	–80	dBc/Hz
	1 KHz	—	—	–110	dBc/Hz
	10 KHz	—	—	–120	dBc/Hz
	100 KHz	—	—	–120	dBc/Hz
	≥ 1 MHz	—	—	–130	dBc/Hz
R_REF	—	—	2000 ±1%	—	Ω

Table 27. Transceiver Clocks Specifications for Arria^® V GT and ST Devices
Symbol/Description	Condition	Transceiver Speed Grade 3			Unit
Symbol/Description	Condition	Min	Typ	Max	Unit
`fixedclk` clock frequency	PCIe* Receiver Detect	—	125	—	MHz
Transceiver Reconfiguration Controller Intel^® FPGA IP (`mgmt_clk_clk`) clock frequency	—	75	—	125	MHz

Table 28. Receiver Specifications for Arria^® V GT and ST Devices
Symbol/Description	Condition	Transceiver Speed Grade 3			Unit
Symbol/Description	Condition	Min	Typ	Max	Unit
Supported I/O Standards	1.5 V PCML, 2.5 V PCML, LVPECL, and LVDS
Data rate (6-Gbps transceiver) ⁴⁴	—	611	—	6553.6	Mbps
Data rate (10-Gbps transceiver)⁴⁴	—	0.611	—	10.3125	Gbps
Absolute V_MAX for a receiver pin⁴⁵	—	—	—	1.2	V
Absolute V_MIN for a receiver pin	—	–0.4	—	—	V
Maximum peak-to-peak differential input voltage V_ID (diff p-p) before device configuration	—	—	—	1.6	V
Maximum peak-to-peak differential input voltage V_ID (diff p-p) after device configuration	—	—	—	2.2	V
Minimum differential eye opening at the receiver serial input pins⁴⁶	—	100	—	—	mV
V_ICM (AC coupled)	—	—	750⁴⁷/800	—	mV
V_ICM (DC coupled)	≤ 3.2Gbps ⁴⁸	670	700	730	mV
Differential on-chip termination resistors	85-Ω setting	85			Ω
	100-Ω setting	100			Ω
	120-Ω setting	120			Ω
	150-Ω setting	150			Ω
t_LTR ⁴⁹	—	—	—	10	µs
t_LTD ⁵⁰	—	4	—	—	µs
t_{LTD_manual} ⁵¹	—	4	—	—	µs
t_{LTR_LTD_manual} ⁵²	—	15	—	—	µs
Programmable ppm detector⁵³	—	±62.5, 100, 125, 200, 250, 300, 500, and 1000			ppm
Run length	—	—	—	200	UI
Programmable equalization AC and DC gain	AC gain setting = 0 to 3⁵⁴ DC gain setting = 0 to 1	Refer to CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices and CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices diagrams.

Table 29. Transmitter Specifications for Arria^® V GT and ST Devices
Symbol/Description	Condition	Transceiver Speed Grade 3			Unit
Symbol/Description	Condition	Min	Typ	Max	Unit
Supported I/O standards	1.5 V PCML
Data rate (6-Gbps transceiver)	—	611	—	6553.6	Mbps
Data rate (10-Gbps transceiver)	—	0.611	—	10.3125	Gbps
V_OCM (AC coupled)	—	—	650	—	mV
V_OCM (DC coupled)	≤ 3.2 Gbps⁴⁸	670	700	730	mV
Differential on-chip termination resistors	85-Ω setting	—	85	—	Ω
	100-Ω setting	—	100	—	Ω
	120-Ω setting	—	120	—	Ω
	150-Ω setting	—	150	—	Ω
Intra-differential pair skew	TX V_CM = 0.65 V (AC coupled) and slew rate of 15 ps	—	—	15	ps
Intra-transceiver block transmitter channel-to-channel skew	×6 PMA bonded mode	—	—	180	ps
Inter-transceiver block transmitter channel-to-channel skew⁵⁵	×`N` PMA bonded mode	—	—	500	ps

Table 30. CMU PLL Specifications for Arria^® V GT and ST Devices
Symbol/Description	Transceiver Speed Grade 3		Unit
Symbol/Description	Min	Max	Unit
Supported data range	0.611	10.3125	Gbps
fPLL supported data range	611	3125	Mbps

Table 31. Transceiver-FPGA Fabric Interface Specifications for Arria^® V GT and ST Devices
Symbol/Description	Transceiver Speed Grade 3		Unit
Symbol/Description	Min	Max	Unit
Interface speed (PMA direct mode)	50	153.6⁵⁶, 161⁵⁷	MHz
Interface speed (single-width mode)	25	187.5	MHz
Interface speed (double-width mode)	25	163.84	MHz

⁴⁰ Differential LVPECL signal levels must comply to the minimum and maximum peak-to-peak differential input voltage specified in this table.

⁴¹ REFCLK performance requires to meet transmitter REFCLK phase noise specification.

⁴² The maximum peak-to peak differential input voltage of 300 mV is allowed for DC coupled link.

⁴³ The transmitter REFCLK phase jitter is 30 ps p-p (5 ps RMS) with bit error rate (BER) 10^-12, equivalent to 14 sigma.

⁴⁴ To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.

⁴⁵ The device cannot tolerate prolonged operation at this absolute maximum.

⁴⁶ The differential eye opening specification at the receiver input pins assumes that you have disabled the Receiver Equalization feature. If you enable the Receiver Equalization feature, the receiver circuitry can tolerate a lower minimum eye opening, depending on the equalization level.

⁴⁷ The AC coupled V_ICM is 750 mV for PCIe* mode only.

⁴⁸ For standard protocol compliance, use AC coupling.

⁴⁹ t_LTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset.

⁵⁰ t_LTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high.

⁵¹ t_{LTD_manual} is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high when the CDR is functioning in the manual mode.

⁵² t_{LTR_LTD_manual} is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes high when the CDR is functioning in the manual mode.

⁵³ The rate match FIFO supports only up to ±300 ppm.

⁵⁴ The Intel^® Quartus^® Prime software allows AC gain setting = 3 for design with data rate between 611 Mbps and 1.25 Gbps only.

⁵⁵ This specification is only applicable to channels on one side of the device across two transceiver banks.

⁵⁶ The maximum frequency when core transceiver local routing is selected.

⁵⁷ The maximum frequency when core transceiver network routing (GCLK, RCLK, or PCLK) is selected.

CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain

Figure 3. Continuous Time-Linear Equalizer (CTLE) Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices

CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain

Figure 4. CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain for Arria^® V GX, GT, SX, and ST Devices

Typical TX VOD Setting for Arria V Transceiver Channels with termination of 100 Ω

Table 32. Typical TX V_OD Setting for Arria^® V Transceiver Channels with termination of 100 Ω
Symbol	V_OD Setting ⁵⁸	V_OD Value (mV)	V_OD Setting⁵⁸	V_OD Value (mV)
V_OD differential peak-to-peak typical	6 ⁵⁹	120	34	680
	7⁵⁹	140	35	700
	8⁵⁹	160	36	720
	9	180	37	740
	10	200	38	760
	11	220	39	780
	12	240	40	800
	13	260	41	820
	14	280	42	840
	15	300	43	860
	16	320	44	880
	17	340	45	900
	18	360	46	920
	19	380	47	940
	20	400	48	960
	21	420	49	980
	22	440	50	1000
	23	460	51	1020
	24	480	52	1040
	25	500	53	1060
	26	520	54	1080
	27	540	55	1100
	28	560	56	1120
	29	580	57	1140
	30	600	58	1160
	31	620	59	1180
	32	640	60	1200
	33	660

⁵⁸ Convert these values to their binary equivalent form if you are using the dynamic reconfiguration mode for PMA analog controls.

⁵⁹ Only valid for data rates ≤ 5 Gbps.

Transmitter Pre-Emphasis Levels

The following table lists the simulation data on the transmitter pre-emphasis levels in dB for the first post tap under the following conditions:

Low-frequency data pattern—five 1s and five 0s
Data rate—2.5 Gbps

The levels listed are a representation of possible pre-emphasis levels under the specified conditions only and the pre-emphasis levels may change with data pattern and data rate.

Arria^® V devices only support 1st post tap pre-emphasis with the following conditions:

The 1st post tap pre-emphasis settings must satisfy |B| + |C| ≤ 60 where |B| = V_OD setting with termination value, R_TERM = 100 Ω and |C| = 1st post tap pre-emphasis setting.
|B| – |C| > 5 for data rates < 5 Gbps and |B| – |C| > 8.25 for data rates > 5 Gbps.
(V_MAX/V_MIN – 1)% < 600%, where V_MAX = |B| + |C| and V_MIN = |B| – |C|.

Exception for PCIe* Gen2 design: V_OD setting = 43 and pre-emphasis setting = 19 are allowed for PCIe* Gen2 design with transmit de-emphasis –6dB setting (pipe_txdeemp = 1’b0) using Arria V Hard IP for PCI Express Intel^® FPGA IP and PHY for PCI Express (PIPE) Intel^® FPGA IP cores.

For example, when V_OD = 800 mV, the corresponding V_OD value setting is 40. The following conditions show that the 1st post tap pre-emphasis setting = 2 is valid:

|B| + |C| ≤ 60→ 40 + 2 = 42
|B| – |C| > 5→ 40 – 2 = 38
(V_MAX/V_MIN – 1)% < 600%→ (42/38 – 1)% = 10.52%

To predict the pre-emphasis level for your specific data rate and pattern, run simulations using the Arria^® V HSSI HSPICE models.

Table 33. **Transmitter Pre-Emphasis Levels for Arria^® V Devices**
Intel^® Quartus^® Prime 1st Post Tap Pre-Emphasis Setting	Intel^® Quartus^® Prime V_OD Setting							Unit
Intel^® Quartus^® Prime 1st Post Tap Pre-Emphasis Setting	10 (200 mV)	20 (400 mV)	30 (600 mV)	35 (700 mV)	40 (800 mV)	45 (900 mV)	50 (1000 mV)	Unit
0	0	0	0	0	0	0	0	dB
1	1.97	0.88	0.43	0.32	0.24	0.19	0.13	dB
2	3.58	1.67	0.95	0.76	0.61	0.5	0.41	dB
3	5.35	2.48	1.49	1.2	1	0.83	0.69	dB
4	7.27	3.31	2	1.63	1.36	1.14	0.96	dB
5	—	4.19	2.55	2.1	1.76	1.49	1.26	dB
6	—	5.08	3.11	2.56	2.17	1.83	1.56	dB
7	—	5.99	3.71	3.06	2.58	2.18	1.87	dB
8	—	6.92	4.22	3.47	2.93	2.48	2.11	dB
9	—	7.92	4.86	4	3.38	2.87	2.46	dB
10	—	9.04	5.46	4.51	3.79	3.23	2.77	dB
11	—	10.2	6.09	5.01	4.23	3.61	—	dB
12	—	11.56	6.74	5.51	4.68	3.97	—	dB
13	—	12.9	7.44	6.1	5.12	4.36	—	dB
14	—	14.44	8.12	6.64	5.57	4.76	—	dB
15	—	—	8.87	7.21	6.06	5.14	—	dB
16	—	—	9.56	7.73	6.49	—	—	dB
17	—	—	10.43	8.39	7.02	—	—	dB
18	—	—	11.23	9.03	7.52	—	—	dB
19	—	—	12.18	9.7	8.02	—	—	dB
20	—	—	13.17	10.34	8.59	—	—	dB
21	—	—	14.2	11.1	—	—	—	dB
22	—	—	15.38	11.87	—	—	—	dB
23	—	—	—	12.67	—	—	—	dB
24	—	—	—	13.48	—	—	—	dB
25	—	—	—	14.37	—	—	—	dB
26	—	—	—	—	—	—	—	dB
27	—	—	—	—	—	—	—	dB
28	—	—	—	—	—	—	—	dB
29	—	—	—	—	—	—	—	dB
30	—	—	—	—	—	—	—	dB
31	—	—	—	—	—	—	—	dB

Transceiver Compliance Specification

The following table lists the physical medium attachment (PMA) specification compliance of all supported protocol for Arria^® V GX, GT, SX, and ST devices. For more information about the protocol parameter details and compliance specifications, contact your Intel Sales Representative.

Table 34. Transceiver Compliance Specification for All Supported Protocol for Arria^® V GX, GT, SX, and ST Devices
Protocol	Sub-protocol	Data Rate (Mbps)
PCIe*	PCIe* Gen1	2,500
	PCIe* Gen2	5,000
	PCIe* Cable	2,500
XAUI	XAUI 2135	3,125
Serial RapidIO^® (SRIO)	SRIO 1250 SR	1,250
	SRIO 1250 LR	1,250
	SRIO 2500 SR	2,500
	SRIO 2500 LR	2,500
	SRIO 3125 SR	3,125
	SRIO 3125 LR	3,125
	SRIO 5000 SR	5,000
	SRIO 5000 MR	5,000
	SRIO 5000 LR	5,000
	SRIO_6250_SR	6,250
	SRIO_6250_MR	6,250
	SRIO_6250_LR	6,250
Common Public Radio Interface (CPRI)	CPRI E6LV	614.4
	CPRI E6HV	614.4
	CPRI E6LVII	614.4
	CPRI E12LV	1,228.8
	CPRI E12HV	1,228.8
	CPRI E12LVII	1,228.8
	CPRI E24LV	2,457.6
	CPRI E24LVII	2,457.6
	CPRI E30LV	3,072
	CPRI E30LVII	3,072
	CPRI E48LVII	4,915.2
	CPRI E60LVII	6,144
	CPRI E96LVIII⁶⁰	9,830.4
Gbps Ethernet (GbE)	GbE 1250	1,250
OBSAI	OBSAI 768	768
	OBSAI 1536	1,536
	OBSAI 3072	3,072
	OBSAI 6144	6,144
Serial digital interface (SDI)	SDI 270 SD	270
	SDI 1485 HD	1,485
	SDI 2970 3G	2,970
SONET	SONET 155	155.52
	SONET 622	622.08
	SONET 2488	2,488.32
Gigabit-capable passive optical network (GPON)	GPON 155	155.52
	GPON 622	622.08
	GPON 1244	1,244.16
	GPON 2488	2,488.32
QSGMII	QSGMII 5000	5,000

⁶⁰ You can achieve compliance with TX channel restriction of one HSSI channel per six-channel transceiver bank.

Core Performance Specifications

Clock Tree Specifications

Table 35. Clock Tree Specifications for Arria^® V Devices
Parameter	Performance			Unit
Parameter	–I3, –C4	–I5, –C5	–C6	Unit
Global clock and Regional clock	625	625	525	MHz
Peripheral clock	450	400	350	MHz

PLL Specifications

Table 36. PLL Specifications for Arria^® V DevicesThis table lists the Arria^® V PLL block specifications. Arria^® V PLL block does not include HPS PLL.
Symbol	Parameter	Condition	Min	Typ	Max	Unit
f_IN	Input clock frequency	–3 speed grade	5	—	800 ⁶¹	MHz
		–4 speed grade	5	—	800⁶¹	MHz
		–5 speed grade	5	—	750⁶¹	MHz
		–6 speed grade	5	—	625⁶¹	MHz
f_INPFD	Integer input clock frequency to the phase frequency detector (PFD)	—	5	—	325	MHz
f_FINPFD	Fractional input clock frequency to the PFD	—	50	—	160	MHz
f_VCO ⁶²	PLL voltage-controlled oscillator (VCO) operating range	–3 speed grade	600	—	1600	MHz
		–4 speed grade	600	—	1600	MHz
		–5 speed grade	600	—	1600	MHz
		–6 speed grade	600	—	1300	MHz
t_EINDUTY	Input clock or external feedback clock input duty cycle	—	40	—	60	%
f_OUT	Output frequency for internal global or regional clock	–3 speed grade	—	—	500 ⁶³	MHz
		–4 speed grade	—	—	500⁶³	MHz
		–5 speed grade	—	—	500⁶³	MHz
		–6 speed grade	—	—	400⁶³	MHz
f_{OUT_EXT}	Output frequency for external clock output	–3 speed grade	—	—	670⁶³	MHz
		–4 speed grade	—	—	670⁶³	MHz
		–5 speed grade	—	—	622⁶³	MHz
		–6 speed grade	—	—	500⁶³	MHz
t_OUTDUTY	Duty cycle for external clock output (when set to 50%)	—	45	50	55	%
t_FCOMP	External feedback clock compensation time	—	—	—	10	ns
t_DYCONFIGCLK	Dynamic configuration clock for `mgmt_clk` and `scanclk`	—	—	—	100	MHz
t_LOCK	Time required to lock from end-of-device configuration or deassertion of `areset`	—	—	—	1	ms
t_DLOCK	Time required to lock dynamically (after switchover or reconfiguring any non-post-scale counters/delays)	—	—	—	1	ms
f_CLBW	PLL closed-loop bandwidth	Low	—	0.3	—	MHz
		Medium	—	1.5	—	MHz
		High⁶⁴	—	4	—	MHz
t_{PLL_PSERR}	Accuracy of PLL phase shift	—	—	—	±50	ps
t_ARESET	Minimum pulse width on the `areset` signal	—	10	—	—	ns
t_INCCJ ⁶⁵ ⁶⁶	Input clock cycle-to-cycle jitter	F_REF ≥ 100 MHz	—	—	0.15	UI (p-p)
t_INCCJ ⁶⁵ ⁶⁶	Input clock cycle-to-cycle jitter	F_REF < 100 MHz	—	—	±750	ps (p-p)
t_{OUTPJ_DC} ⁶⁷	Period jitter for dedicated clock output in integer PLL	F_OUT ≥ 100 MHz	—	—	175	ps (p-p)
t_{OUTPJ_DC} ⁶⁷	Period jitter for dedicated clock output in integer PLL	F_OUT < 100 MHz	—	—	17.5	mUI (p-p)
t_{FOUTPJ_DC} ⁶⁷	Period jitter for dedicated clock output in fractional PLL	F_OUT ≥ 100 MHz	—	—	250 ⁶⁸, 175 ⁶⁹	ps (p-p)
t_{FOUTPJ_DC} ⁶⁷	Period jitter for dedicated clock output in fractional PLL	F_OUT < 100 MHz	—	—	25⁶⁸, 17.5⁶⁹	mUI (p-p)
t_{OUTCCJ_DC} ⁶⁷	Cycle-to-cycle jitter for dedicated clock output in integer PLL	F_OUT ≥ 100 MHz	—	—	175	ps (p-p)
t_{OUTCCJ_DC} ⁶⁷		F_OUT < 100 MHz	—	—	17.5	mUI (p-p)
t_{FOUTCCJ_DC} ⁶⁷	Cycle-to-cycle jitter for dedicated clock output in fractional PLL	F_OUT ≥ 100 MHz	—	—	250⁶⁸, 175⁶⁹	ps (p-p)
t_{FOUTCCJ_DC} ⁶⁷		F_OUT < 100 MHz	—	—	25⁶⁸, 17.5⁶⁹	mUI (p-p)
t_{OUTPJ_IO} ⁶⁷ ⁷⁰	Period jitter for clock output on a regular I/O in integer PLL	F_OUT ≥ 100 MHz	—	—	600	ps (p-p)
t_{OUTPJ_IO} ⁶⁷ ⁷⁰		F_OUT < 100 MHz	—	—	60	mUI (p-p)
t_{FOUTPJ_IO} ⁶⁷ ⁶⁸ ⁷⁰	Period jitter for clock output on a regular I/O in fractional PLL	F_OUT ≥ 100 MHz	—	—	600	ps (p-p)
t_{FOUTPJ_IO} ⁶⁷ ⁶⁸ ⁷⁰		F_OUT < 100 MHz	—	—	60	mUI (p-p)
t_{OUTCCJ_IO} ⁶⁷ ⁷⁰	Cycle-to-cycle jitter for clock output on a regular I/O in integer PLL	F_OUT ≥ 100 MHz	—	—	600	ps (p-p)
t_{OUTCCJ_IO} ⁶⁷ ⁷⁰		F_OUT < 100 MHz	—	—	60	mUI (p-p)
t_{FOUTCCJ_IO} ⁶⁷ ⁶⁸ ⁷⁰	Cycle-to-cycle jitter for clock output on a regular I/O in fractional PLL	F_OUT ≥ 100 MHz	—	—	600	ps (p-p)
t_{FOUTCCJ_IO} ⁶⁷ ⁶⁸ ⁷⁰		F_OUT < 100 MHz	—	—	60	mUI (p-p)
t_{CASC_OUTPJ_DC} ⁶⁷ ⁷¹	Period jitter for dedicated clock output in cascaded PLLs	F_OUT ≥ 100 MHz	—	—	175	ps (p-p)
t_{CASC_OUTPJ_DC} ⁶⁷ ⁷¹	Period jitter for dedicated clock output in cascaded PLLs	F_OUT < 100 MHz	—	—	17.5	mUI (p-p)
t_DRIFT	Frequency drift after `PFDENA` is disabled for a duration of 100 µs	—	—	—	±10	%
dK_BIT	Bit number of Delta Sigma Modulator (DSM)	—	8	24	32	bits
k_VALUE	Numerator of fraction	—	128	8388608	2147483648	—
f_RES	Resolution of VCO frequency	f_INPFD = 100 MHz	390625	5.96	0.023	Hz

⁶¹ This specification is limited in the Intel^® Quartus^® Prime software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O standard.

⁶² The VCO frequency reported by the Intel^® Quartus^® Prime software takes into consideration the VCO post divider value. Therefore, if the VCO post divider value is 2, the frequency reported can be lower than the f_VCO specification.

⁶³ This specification is limited by the lower of the two: I/O f_MAX or F_OUT of the PLL.

⁶⁴ High bandwidth PLL settings are not supported in external feedback mode.

⁶⁵ A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source with jitter < 120 ps.

⁶⁶ F_REF is f_IN/N, specification applies when N = 1.

⁶⁷ Peak-to-peak jitter with a probability level of 10^–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied. The external memory interface clock output jitter specifications use a different measurement method and are available in Memory Output Clock Jitter Specification for Arria^® V Devices table.

⁶⁸ This specification only covered fractional PLL for low bandwidth. The f_VCO for fractional value range 0.05–0.95 must be ≥ 1000 MHz.

⁶⁹ This specification only covered fractional PLL for low bandwidth. The f_VCO for fractional value range 0.20–0.80 must be ≥ 1200 MHz.

⁷⁰ External memory interface clock output jitter specifications use a different measurement method, which are available in Memory Output Clock Jitter Specification for Arria^® V Devices table.

⁷¹ The cascaded PLL specification is only applicable with the following conditions:

Upstream PLL: 0.59 MHz ≤ Upstream PLL BW < 1 MHz
Downstream PLL: Downstream PLL BW > 2 MHz

DSP Block Performance Specifications

Table 37. DSP Block Performance Specifications for Arria^® V Devices
Mode		Performance			Unit
Mode		–I3, –C4	–I5, –C5	–C6	Unit
Modes using One DSP Block	Independent 9 × 9 multiplication	370	310	220	MHz
	Independent 18 × 19 multiplication	370	310	220	MHz
	Independent 18 × 25 multiplication	370	310	220	MHz
	Independent 20 × 24 multiplication	370	310	220	MHz
	Independent 27 × 27 multiplication	310	250	200	MHz
	Two 18 × 19 multiplier adder mode	370	310	220	MHz
	18 × 18 multiplier added summed with 36-bit input	370	310	220	MHz
Modes using Two DSP Blocks	Complex 18 × 19 multiplication	370	310	220	MHz

Memory Block Performance Specifications

To achieve the maximum memory block performance, use a memory block clock that comes through global clock routing from an on-chip PLL and set to 50% output duty cycle. Use the Intel^® Quartus^® Prime software to report timing for the memory block clocking schemes.

When you use the error detection cyclical redundancy check (CRC) feature, there is no degradation in f_MAX.

Table 38. Memory Block Performance Specifications for Arria^® V Devices
Memory	Mode	Resources Used		Performance			Unit
Memory	Mode	ALUTs	Memory	–I3, –C4	–I5, –C5	–C6	Unit
MLAB	Single port, all supported widths	0	1	500	450	400	MHz
	Simple dual-port, all supported widths	0	1	500	450	400	MHz
	Simple dual-port with read and write at the same address	0	1	400	350	300	MHz
	ROM, all supported width	—	—	500	450	400	MHz
M10K Block	Single-port, all supported widths	0	1	400	350	285	MHz
	Simple dual-port, all supported widths	0	1	400	350	285	MHz
	Simple dual-port with the read-during-write option set to Old Data, all supported widths	0	1	315	275	240	MHz
	True dual port, all supported widths	0	1	400	350	285	MHz
	ROM, all supported widths	0	1	400	350	285	MHz

Internal Temperature Sensing Diode Specifications

Table 39. Internal Temperature Sensing Diode Specifications for Arria^® V Devices
Temperature Range	Accuracy	Offset Calibrated Option	Sampling Rate	Conversion Time⁷²	Resolution	Minimum Resolution with no Missing Codes
–40 to 100°C	±8°C	No	1 MHz	< 100 ms	8 bits	8 bits

⁷² For more details about the temperature sensing operations, refer to the Intel FPGA Temperature Sensor IP Core User Guide.

Periphery Performance

This section describes the periphery performance, high-speed I/O, and external memory interface.

Actual achievable frequency depends on design and system specific factors. Ensure proper timing closure in your design and perform HSPICE/IBIS simulations based on your specific design and system setup to determine the maximum achievable frequency in your system.

High-Speed I/O Specifications

Table 40. High-Speed I/O Specifications for Arria^® V Devices
When J = 3 to 10, use the serializer/deserializer (SERDES) block. When J = 1 or 2, bypass the SERDES block.

For LVDS applications, you must use the PLLs in integer PLL mode.

The Arria^® V devices support the following output standards using true LVDS output buffer types on all I/O banks.

True RSDS output standard with data rates of up to 360 Mbps

True mini-LVDS output standard with data rates of up to 400 Mbps
Symbol		Condition	–I3, –C4			–I5, –C5			–C6			Unit
Symbol		Condition	Min	Typ	Max	Min	Typ	Max	Min	Typ	Max	Unit
f_{HSCLK_in} (input clock frequency) True Differential I/O Standards		Clock boost factor W = 1 to 40 ⁷³	5	—	800	5	—	750	5	—	625	MHz
f_{HSCLK_in} (input clock frequency) Single-Ended I/O Standards⁷⁴		Clock boost factor W = 1 to 40⁷³	5	—	625	5	—	625	5	—	500	MHz
f_{HSCLK_in} (input clock frequency) Single-Ended I/O Standards⁷⁵		Clock boost factor W = 1 to 40⁷³	5	—	420	5	—	420	5	—	420	MHz
f_{HSCLK_OUT} (output clock frequency)		—	5	—	625 ⁷⁶	5	—	625⁷⁶	5	—	500⁷⁶	MHz
Transmitter	True Differential I/O Standards - f_HSDR (data rate)	SERDES factor J =3 to 10 ⁷⁷	⁷⁸	—	1250	⁷⁸	—	1250	⁷⁸	—	1050	Mbps
		SERDES factor J ≥ 8⁷⁷ ⁷⁹, LVDS TX with RX DPA	⁷⁸	—	1600	⁷⁸	—	1500	⁷⁸	—	1250	Mbps
		SERDES factor J = 1 to 2, Uses DDR Registers	⁷⁸	—	⁸⁰	⁷⁸	—	⁸⁰	⁷⁸	—	⁸⁰	Mbps
	Emulated Differential I/O Standards with Three External Output Resistor Network - f_HSDR (data rate) ⁸¹	SERDES factor J = 4 to 10 ⁸²	⁷⁸	—	945	⁷⁸	—	945	⁷⁸	—	945	Mbps
	Emulated Differential I/O Standards with One External Output Resistor Network - f_HSDR (data rate)⁸¹	SERDES factor J = 4 to 10⁸²	⁷⁸	—	200	⁷⁸	—	200	⁷⁸	—	200	Mbps
	t_{x Jitter} -True Differential I/O Standards	Total Jitter for Data Rate 600 Mbps – 1.25 Gbps	—	—	160	—	—	160	—	—	160	ps
	t_{x Jitter} -True Differential I/O Standards	Total Jitter for Data Rate < 600 Mbps	—	—	0.1	—	—	0.1	—	—	0.1	UI
	t_{x Jitter} -Emulated Differential I/O Standards with Three External Output Resistor Network	Total Jitter for Data Rate 600 Mbps – 1.25 Gbps	—	—	260	—	—	300	—	—	350	ps
		Total Jitter for Data Rate < 600 Mbps	—	—	0.16	—	—	0.18	—	—	0.21	UI
	t_{x Jitter} -Emulated Differential I/O Standards with One External Output Resistor Network	—	—	—	0.15	—	—	0.15	—	—	0.15	UI
	t_DUTY	TX output clock duty cycle for both True and Emulated Differential I/O Standards	45	50	55	45	50	55	45	50	55	%
	t_RISE and t_FALL	True Differential I/O Standards⁸³	—	—	160	—	—	180	—	—	200	ps
		Emulated Differential I/O Standards with Three External Output Resistor Network	—	—	250	—	—	250	—	—	300	ps
		Emulated Differential I/O Standards with One External Output Resistor Network	—	—	500	—	—	500	—	—	500	ps
	TCCS	True Differential I/O Standards	—	—	150	—	—	150	—	—	150	ps
	TCCS	Emulated Differential I/O Standards	—	—	300	—	—	300	—	—	300	ps
Receiver	True Differential I/O Standards - f_HSDRDPA (data rate)	SERDES factor J =3 to 10⁷⁷	150	—	1250	150	—	1250	150	—	1050	Mbps
	True Differential I/O Standards - f_HSDRDPA (data rate)	SERDES factor J ≥ 8 with DPA⁷⁷ ⁷⁹	150	—	1600	150	—	1500	150	—	1250	Mbps
	f_HSDR (data rate)	SERDES factor J = 3 to 10	⁷⁸	—	⁸⁴	⁷⁸	—	⁸⁴	⁷⁸	—	⁸⁴	Mbps
	f_HSDR (data rate)	SERDES factor J = 1 to 2, uses DDR registers	⁷⁸	—	⁸⁰	⁷⁸	—	⁸⁰	⁷⁸	—	⁸⁰	Mbps
DPA Mode	DPA run length	—	—	—	10000	—	—	10000	—	—	10000	UI
Soft-CDR Mode	Soft-CDR ppm tolerance	—	—	—	300	—	—	300	—	—	300	±ppm
Non-DPA Mode	Sampling Window	—	—	—	300	—	—	300	—	—	300	ps

⁷³ Clock boost factor (W) is the ratio between the input data rate and the input clock rate.

⁷⁴ This applies to DPA and soft-CDR modes only.

⁷⁵ This applies to non-DPA mode only.

⁷⁶ This is achieved by using the LVDS clock network.

⁷⁷ The F_max specification is based on the fast clock used for serial data. The interface F_max is also dependent on the parallel clock domain which is design dependent and requires timing analysis.

⁷⁸ The minimum specification depends on the clock source (for example, the PLL and clock pin) and the clock routing resource (global, regional, or local) that you use. The I/O differential buffer and input register do not have a minimum toggle rate.

⁷⁹ The V_CC and V_CCP must be on a separate power layer and a maximum load of 5 pF for chip-to-chip interface.

⁸⁰ The maximum ideal data rate is the SERDES factor (J) x the PLL maximum output frequency (f_OUT), provided you can close the design timing and the signal integrity simulation is clean.

⁸¹ You must calculate the leftover timing margin in the receiver by performing link timing closure analysis. You must consider the board skew margin, transmitter channel-to-channel skew, and receiver sampling margin to determine the leftover timing margin.

⁸² When using True LVDS RX channels for emulated LVDS TX channel, only serialization factors 1 and 2 are supported.

⁸³ This applies to default pre-emphasis and V_OD settings only.

⁸⁴ You can estimate the achievable maximum data rate for non-DPA mode by performing link timing closure analysis. You must consider the board skew margin, transmitter delay margin, and receiver sampling margin to determine the maximum data rate supported.

DPA Lock Time Specifications

Figure 5. Dynamic Phase Alignment (DPA) Lock Time Specifications with DPA PLL Calibration Enabled

Table 41. DPA Lock Time Specifications for Arria^® V DevicesThe specifications are applicable to both commercial and industrial grades. The DPA lock time is for one channel. One data transition is defined as a 0-to-1 or 1-to-0 transition.
Standard	Training Pattern	Number of Data Transitions in One Repetition of the Training Pattern	Number of Repetitions per 256 Data Transitions⁸⁵	Maximum Data Transition
SPI-4	00000000001111111111	2	128	640
Parallel Rapid I/O	00001111	2	128	640
Parallel Rapid I/O	10010000	4	64	640
Miscellaneous	10101010	8	32	640
Miscellaneous	01010101	8	32	640

⁸⁵ This is the number of repetitions for the stated training pattern to achieve the 256 data transitions.

LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications

Figure 6. LVDS Soft-Clock Data Recovery (CDR)/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Equal to 1.25 Gbps

Table 42. LVDS Soft-CDR/DPA Sinusoidal Jitter Mask Values for a Data Rate Equal to 1.25 Gbps
Jitter Frequency (Hz)		Sinusoidal Jitter (UI)
F1	10,000	25.000
F2	17,565	25.000
F3	1,493,000	0.350
F4	50,000,000	0.350

Figure 7. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specification for a Data Rate Less than 1.25 Gbps

DLL Frequency Range Specifications

Table 43. DLL Frequency Range Specifications for Arria^® V Devices
Parameter	–I3, –C4	–I5, –C5	–C6	Unit
DLL operating frequency range	200 – 667	200 – 667	200 – 667	MHz

DQS Logic Block Specifications

Table 44. DQS Phase Shift Error Specifications for DLL-Delayed Clock (t_{DQS_PSERR}) for Arria^® V DevicesThis error specification is the absolute maximum and minimum error.
Number of DQS Delay Buffer	–I3, –C4	–I5, –C5	–C6	Unit
2	40	80	80	ps

Memory Output Clock Jitter Specifications

Table 45. Memory Output Clock Jitter Specifications for Arria^® V Devices
The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC* DDR2/DDR3 SDRAM standard.

The memory output clock jitter is applicable when an input jitter of 30 ps (p-p) is applied with bit error rate (BER) 10^–12, equivalent to 14 sigma.

Intel recommends using the UniPHY IP cores with PHYCLK connections for better jitter performance.
Parameter	Clock Network	Symbol	–I3, –C4		–I5, –C5		–C6		Unit
Parameter	Clock Network	Symbol	Min	Max	Min	Max	Min	Max	Unit
Clock period jitter	PHYCLK	t_JIT(per)	–41	41	–50	50	–55	55	ps
Cycle-to-cycle period jitter	PHYCLK	t_JIT(cc)	63		90		94		ps

OCT Calibration Block Specifications

Table 46. OCT Calibration Block Specifications for Arria^® V Devices
Symbol	Description	Min	Typ	Max	Unit
`OCTUSRCLK`	Clock required by OCT calibration blocks	—	—	20	MHz
T_OCTCAL	Number of `OCTUSRCLK` clock cycles required for R_S OCT/R_T OCT calibration	—	1000	—	Cycles
T_OCTSHIFT	Number of `OCTUSRCLK` clock cycles required for `OCT` code to shift out	—	32	—	Cycles
T_{RS_RT}	Time required between the `dyn_term_ctrl` and `oe` signal transitions in a bidirectional I/O buffer to dynamically switch between R_S OCT and R_T OCT	—	2.5	—	ns

Figure 8. Timing Diagram for oe and dyn_term_ctrl Signals

Duty Cycle Distortion (DCD) Specifications

Table 47. Worst-Case DCD on Arria^® V I/O PinsThe output DCD cycle only applies to the I/O buffer. It does not cover the system DCD.
Symbol	–I3, –C4		–C5, –I5		–C6		Unit
Symbol	Min	Max	Min	Max	Min	Max	Unit
Output Duty Cycle	45	55	45	55	45	55	%

HPS Specifications

This section provides HPS specifications and timing for Arria^® V devices.

For HPS reset, the minimum reset pulse widths for the HPS cold and warm reset signals (HPS_nRST and HPS_nPOR) are six clock cycles of HPS_CLK1.

HPS Clock Performance

Table 48. HPS Clock Performance for Arria^® V Devices
Symbol/Description	–I3	–C4	–C5, –I5	–C6	Unit
mpu_base_clk (microprocessor unit clock)	1050	925	800	700	MHz
main_base_clk (L3/L4 interconnect clock)	400	400	400	350	MHz
h2f_user0_clk	100	100	100	100	MHz
h2f_user1_clk	100	100	100	100	MHz
h2f_user2_clk	200	200	200	160	MHz

HPS PLL Specifications

HPS PLL VCO Frequency Range

Table 49. HPS PLL VCO Frequency Range for Arria^® V Devices
Description	Speed Grade	Minimum	Maximum	Unit
VCO range	–C5, –I5, –C6	320	1,600	MHz
	–C4	320	1,850	MHz
	–I3	320	2,100	MHz

HPS PLL Input Clock Range

The HPS PLL input clock range is 10 – 50 MHz. This clock range applies to both HPS_CLK1 and HPS_CLK2 inputs.

HPS PLL Input Jitter

Use the following equation to determine the maximum input jitter (peak-to-peak) the HPS PLLs can tolerate. The divide value (N) is the value programmed into the denominator field of the VCO register for each PLL. The PLL input reference clock is divided by this value. The range of the denominator is 1 to 64.

Maximum input jitter = Input clock period × Divide value (N) × 0.02

Table 50. Examples of Maximum Input Jitter
Input Reference Clock Period	Divide Value (N)	Maximum Jitter	Unit
40 ns	1	0.8	ns
40 ns	2	1.6	ns
40 ns	4	3.2	ns

Quad SPI Flash Timing Characteristics

Table 51. Quad Serial Peripheral Interface (SPI) Flash Timing Requirements for Arria^® V Devices
Symbol	Description	Min	Typ	Max	Unit
F_clk	SCLK_OUT clock frequency (External clock)	—	—	108	MHz
T_{qspi_clk}	QSPI_CLK clock period (Internal reference clock)	2.32	—	—	ns
T_dutycycle	SCLK_OUT duty cycle	45	—	55	%
T_dssfrst	Output delay QSPI_SS valid before first clock edge	—	1/2 cycle of SCLK_OUT	—	ns
T_dsslst	Output delay QSPI_SS valid after last clock edge	–1	—	1	ns
T_dio	I/O data output delay	–1	—	1	ns
T_{din_start}	Input data valid start	—	—	(2 + R_delay) × T_{qspi_clk} – 7.52 ⁸⁶	ns
T_{din_end}	Input data valid end	(2 + R_delay) × T_{qspi_clk} – 1.21 ⁸⁶	—	—	ns

Figure 9. Quad SPI Flash Timing DiagramThis timing diagram illustrates clock polarity mode 0 and clock phase mode 0.

⁸⁶ R_delay is set by programming the register qspiregs.rddatacap. For the SoC EDS software version 13.1 and later, Intel provides automatic Quad SPI calibration in the preloader. For more information about R_delay, refer to the Quad SPI Flash Controller chapter in the Arria V Hard Processor System Technical Reference Manual.

SPI Timing Characteristics

Table 52. SPI Master Timing Requirements for Arria V DevicesThe setup and hold times can be used for Texas Instruments SSP mode and National Semiconductor Microwire mode.
Symbol	Description	Min	Max	Unit
T_clk	CLK clock period	16.67	—	ns
T_su	SPI Master-in slave-out (MISO) setup time	8.35 ⁸⁷	—	ns
T_h	SPI MISO hold time	1	—	ns
T_dutycycle	SPI_CLK duty cycle	45	55	%
T_dssfrst	Output delay SPI_SS valid before first clock edge	8	—	ns
T_dsslst	Output delay SPI_SS valid after last clock edge	8	—	ns
T_dio	Master-out slave-in (MOSI) output delay	–1	1	ns

Figure 10. SPI Master Timing Diagram

Table 53. SPI Slave Timing Requirements for Arria V DevicesThe setup and hold times can be used for Texas Instruments SSP mode and National Semiconductor Microwire mode.
Symbol	Description	Min	Max	Unit
T_clk	CLK clock period	20	—	ns
T_s	MOSI Setup time	5	—	ns
T_h	MOSI Hold time	5	—	ns
T_suss	Setup time SPI_SS valid before first clock edge	8	—	ns
T_hss	Hold time SPI_SS valid after last clock edge	8	—	ns
T_d	MISO output delay	—	6	ns

Figure 11. SPI Slave Timing Diagram

⁸⁷ This value is based on rx_sample_dly = 1 and spi_m_clk = 120 MHz. spi_m_clk is the internal clock that is used by SPI Master to derive it’s SCLK_OUT. These timings are based on rx_sample_dly of 1. This delay can be adjusted as needed to accommodate slower response times from the slave. Note that a delay of 0 is not allowed. The setup time can be used as a reference starting point. It is very crucial to do a calibration to get the correct rx_sample_dly value because each SPI slave device may have different output delay and each application board may have different path delay. For more information about rx_sample_delay, refer to the SPI Controller chapter in the Hard Processor System Technical Reference Manual.

SD/MMC Timing Characteristics

Table 54. Secure Digital (SD)/MultiMediaCard (MMC) Timing Requirements for Arria^® V Devices
After power up or cold reset, the Boot ROM uses `drvsel` = 3 and `smplsel` = 0 to execute the code. At the same time, the SD/MMC controller enters the Identification Phase followed by the Data Phase. During this time, the value of interface output clock `SDMMC_CLK_OUT` changes from a maximum of 400 kHz (Identification Phase) up to a maximum of 12.5 MHz (Data Phase), depending on the internal reference clock `SDMMC_CLK` and the `CSEL` setting. The value of `SDMMC_CLK` is based on the external oscillator frequency and has a maximum value of 50 MHz.

After the Boot ROM code exits and control is passed to the preloader, software can adjust the value of `drvsel` and `smplsel` via the system manager. `drvsel` can be set from 1 to 7 and `smplsel` can be set from 0 to 7. While the preloader is executing, the values for `SDMMC_CLK` and `SDMMC_CLK_OUT` increase to a maximum of 200 MHz and 50 MHz respectively.
Symbol	Description	Min	Max	Unit
T_{sdmmc_clk} (internal reference clock)	SDMMC_CLK clock period (Identification mode)	20	—	ns
	SDMMC_CLK clock period (Default speed mode)	5	—	ns
	SDMMC_CLK clock period (High speed mode)	5	—	ns
T_{sdmmc_clk_out} (interface output clock)	SDMMC_CLK_OUT clock period (Identification mode)	2500	—	ns
	SDMMC_CLK_OUT clock period (Default speed mode)	40	—	ns
	SDMMC_CLK_OUT clock period (High speed mode)	20	—	ns
T_dutycycle	SDMMC_CLK_OUT duty cycle	45	55	%
T_d	SDMMC_CMD/SDMMC_D output delay	(T_{sdmmc_clk} × `drvsel`)/2 – 1.23 ⁸⁸	(T_{sdmmc_clk} × `drvsel`)/2 + 1.69 ⁸⁸	ns
T_su	Input setup time	1.05 – (T_{sdmmc_clk} × `smplsel`)/2 ⁸⁹	—	ns
T_h	Input hold time	(T_{sdmmc_clk} × `smplsel`)/2 ⁸⁹	—	ns

Figure 12. SD/MMC Timing Diagram

⁸⁸ drvsel is the drive clock phase shift select value.

⁸⁹ smplsel is the sample clock phase shift select value.

USB Timing Characteristics

PHYs that support LPM mode may not function properly with the USB controller due to a timing issue. It is recommended that designers use the MicroChip USB3300 PHY device that has been proven to be successful on the development board.

Table 55. USB Timing Requirements for Arria^® V Devices
Symbol	Description	Min	Typ	Max	Unit
T_clk	USB CLK clock period	—	16.67	—	ns
T_d	CLK to USB_STP/USB_DATA[7:0] output delay	4.4	—	11	ns
T_su	Setup time for USB_DIR/USB_NXT/USB_DATA[7:0]	2	—	—	ns
T_h	Hold time for USB_DIR/USB_NXT/USB_DATA[7:0]	1	—	—	ns

Figure 13. USB Timing Diagram

Ethernet Media Access Controller (EMAC) Timing Characteristics

Table 56. Reduced Gigabit Media Independent Interface (RGMII) TX Timing Requirements for Arria^® V Devices
Symbol	Description	Min	Typ	Max	Unit
T_clk (1000Base-T)	TX_CLK clock period	—	8	—	ns
T_clk (100Base-T)	TX_CLK clock period	—	40	—	ns
T_clk (10Base-T)	TX_CLK clock period	—	400	—	ns
T_dutycycle	TX_CLK duty cycle	45	—	55	%
T_d	TX_CLK to TXD/TX_CTL output data delay	–0.85	—	0.15	ns

Figure 14. RGMII TX Timing Diagram

Table 57. RGMII RX Timing Requirements for Arria^® V Devices
Symbol	Description	Min	Typ	Unit
T_clk (1000Base-T)	RX_CLK clock period	—	8	ns
T_clk (100Base-T)	RX_CLK clock period	—	40	ns
T_clk (10Base-T)	RX_CLK clock period	—	400	ns
T_su	RX_D/RX_CTL setup time	1	—	ns
T_h	RX_D/RX_CTL hold time	1	—	ns

Figure 15. RGMII RX Timing Diagram

Table 58. Management Data Input/Output (MDIO) Timing Requirements for Arria^® V Devices
Symbol	Description	Min	Typ	Max	Unit
T_clk	MDC clock period	—	400	—	ns
T_d	MDC to MDIO output data delay	10	—	20	ns
T_s	Setup time for MDIO data	10	—	—	ns
T_h	Hold time for MDIO data	0	—	—	ns

Figure 16. MDIO Timing Diagram

I2C Timing Characteristics

Table 59. I²C Timing Requirements for Arria^® V Devices
Symbol	Description	Standard Mode		Fast Mode		Unit
Symbol	Description	Min	Max	Min	Max	Unit
T_clk	Serial clock (SCL) clock period	10	—	2.5	—	µs
T_clkhigh	SCL high time	4.7	—	0.6	—	µs
T_clklow	SCL low time	4	—	1.3	—	µs
T_s	Setup time for serial data line (SDA) data to SCL	0.25	—	0.1	—	µs
T_h	Hold time for SCL to SDA data	0	3.45	0	0.9	µs
T_d	SCL to SDA output data delay	—	0.2	—	0.2	µs
T_{su_start}	Setup time for a repeated start condition	4.7	—	0.6	—	µs
T_{hd_start}	Hold time for a repeated start condition	4	—	0.6	—	µs
T_{su_stop}	Setup time for a stop condition	4	—	0.6	—	µs

Figure 17. I²C Timing Diagram

NAND Timing Characteristics

Table 60. NAND ONFI 1.0 Timing Requirements for Arria^® V DevicesThe NAND controller supports Open NAND FLASH Interface (ONFI) 1.0 Mode 5 timing as well as legacy NAND devices. This table lists the requirements for ONFI 1.0 mode 5 timing. The HPS NAND controller can meet this timing by programming the `C4` output of the main HPS PLL and timing registers provided in the NAND controller.
Symbol	Description	Min	Max	Unit
T_wp ⁹⁰	Write enable pulse width	10	—	ns
T_wh ⁹⁰	Write enable hold time	7	—	ns
T_rp ⁹⁰	Read enable pulse width	10	—	ns
T_reh ⁹⁰	Read enable hold time	7	—	ns
T_clesu ⁹⁰	Command latch enable to write enable setup time	10	—	ns
T_cleh ⁹⁰	Command latch enable to write enable hold time	5	—	ns
T_cesu ⁹⁰	Chip enable to write enable setup time	15	—	ns
T_ceh ⁹⁰	Chip enable to write enable hold time	5	—	ns
T_alesu ⁹⁰	Address latch enable to write enable setup time	10	—	ns
T_aleh ⁹⁰	Address latch enable to write enable hold time	5	—	ns
T_dsu ⁹⁰	Data to write enable setup time	10	—	ns
T_dh ⁹⁰	Data to write enable hold time	5	—	ns
T_cea	Chip enable to data access time	—	25	ns
T_rea	Read enable to data access time	—	16	ns
T_rhz	Read enable to data high impedance	—	100	ns
T_rr	Ready to read enable low	20	—	ns

Figure 18. NAND Command Latch Timing Diagram

Figure 19. NAND Address Latch Timing Diagram

Figure 20. NAND Data Write Timing Diagram

Figure 21. NAND Data Read Timing Diagram

⁹⁰ Timing of the NAND interface is controlled through the NAND configuration registers.

Arm Trace Timing Characteristics

Table 61. Arm* Trace Timing Requirements for Arria^® V DevicesMost debugging tools have a mechanism to adjust the capture point of trace data.
Description	Min	Max	Unit
CLK clock period	12.5	—	ns
CLK maximum duty cycle	45	55	%
CLK to D0 –D7 output data delay	–1	1	ns

UART Interface

The maximum UART baud rate is 6.25 megasymbols per second.

GPIO Interface

The minimum detectable general-purpose I/O (GPIO) pulse width is 2 μs. The pulse width is based on a debounce clock frequency of 1 MHz.

HPS JTAG Timing Specifications

Table 62. HPS JTAG Timing Parameters and Values for Arria^® V Devices
Symbol	Description	Min	Max	Unit
t_JCP	TCK clock period	30	—	ns
t_JCH	TCK clock high time	14	—	ns
t_JCL	TCK clock low time	14	—	ns
t_{JPSU (TDI)}	TDI JTAG port setup time	2	—	ns
t_{JPSU (TMS)}	TMS JTAG port setup time	3	—	ns
t_JPH	JTAG port hold time	5	—	ns
t_JPCO	JTAG port clock to output	—	12 ⁹¹	ns
t_JPZX	JTAG port high impedance to valid output	—	14⁹¹	ns
t_JPXZ	JTAG port valid output to high impedance	—	14⁹¹	ns

⁹¹ A 1-ns adder is required for each V_{CCIO
_HPS} voltage step down from 3.0 V. For example, t_JPCO= 13 ns if V_{CCIO _HPS} of the TDO I/O bank = 2.5 V, or 14 ns if it equals 1.8 V.

Configuration Specifications

This section provides configuration specifications and timing for Arria^® V devices.

POR Specifications

Table 63. Fast and Standard POR Delay Specification for Arria^® V Devices
POR Delay	Minimum	Maximum	Unit
Fast	4	12⁹²	ms
Standard	100	300	ms

⁹² The maximum pulse width of the fast POR delay is 12 ms, providing enough time for the PCIe* hard IP to initialize after the POR trip.

FPGA JTAG Configuration Timing

Table 64. FPGA JTAG Timing Parameters and Values for Arria^® V Devices
Symbol	Description	Min	Max	Unit
t_JCP	TCK clock period	30, 167⁹³	—	ns
t_JCH	TCK clock high time	14	—	ns
t_JCL	TCK clock low time	14	—	ns
t_{JPSU (TDI)}	TDI JTAG port setup time	2	—	ns
t_{JPSU (TMS)}	TMS JTAG port setup time	3	—	ns
t_JPH	JTAG port hold time	5	—	ns
t_JPCO	JTAG port clock to output	—	12 ⁹⁴	ns
t_JPZX	JTAG port high impedance to valid output	—	14⁹⁴	ns
t_JPXZ	JTAG port valid output to high impedance	—	14⁹⁴	ns

⁹³ The minimum TCK clock period is 167 ns if V_CCBAT is within the range 1.2 V – 1.5 V when you perform the volatile key programming.

⁹⁴ A 1-ns adder is required for each VCCIO voltage step down from 3.0 V. For example, tJPCO= 13 ns if VCCIO of the TDO I/O bank = 2.5 V, or 14 ns if it equals 1.8 V.

FPP Configuration Timing

DCLK-to-DATA[] Ratio (r) for FPP Configuration

Fast passive parallel (FPP) configuration requires a different DCLK-to-DATA[] ratio when you turn on encryption or the compression feature.

Depending on the DCLK-to-DATA[] ratio, the host must send a DCLK frequency that is r times the DATA[] rate in byte per second (Bps) or word per second (Wps). For example, in FPP ×16 where the r is 2, the DCLK frequency must be 2 times the DATA[] rate in Wps.

Table 65. DCLK-to-DATA[] Ratio for Arria^® V Devices
Configuration Scheme	Encryption	Compression	DCLK-to-DATA[] Ratio (r)
FPP (8-bit wide)	Off	Off	1
	On	Off	1
	Off	On	2
	On	On	2
FPP (16-bit wide)	Off	Off	1
	On	Off	2
	Off	On	4
	On	On	4

FPP Configuration Timing when DCLK-to-DATA[] = 1

When you enable decompression or the design security feature, the DCLK-to-DATA[] ratio varies for FPP ×8 and FPP ×16. For the respective DCLK-to-DATA[] ratio, refer to the DCLK-to-DATA[] Ratio for Arria^® V Devices table.

Table 66. FPP Timing Parameters When DCLK-to-DATA[] Ratio is 1 for Arria^® V Devices
Symbol	Parameter	Minimum	Maximum	Unit
t_CF2CD	`nCONFIG` low to `CONF_DONE` low	—	600	ns
t_CF2ST0	`nCONFIG` low to `nSTATUS` low	—	600	ns
t_CFG	`nCONFIG` low pulse width	2	—	µs
t_STATUS	`nSTATUS` low pulse width	268	1506⁹⁵	µs
t_CF2ST1	`nCONFIG` high to `nSTATUS` high	—	1506⁹⁶	µs
t_CF2CK ⁹⁷	`nCONFIG` high to first rising edge on `DCLK`	1506	—	µs
t_ST2CK ⁹⁷	`nSTATUS` high to first rising edge of `DCLK`	2	—	µs
t_DSU	`DATA[]` setup time before rising edge on `DCLK`	5.5	—	ns
t_DH	`DATA[]` hold time after rising edge on `DCLK`	0	—	ns
t_CH	`DCLK` high time	0.45 × 1/f_MAX	—	s
t_CL	`DCLK` low time	0.45 × 1/f_MAX	—	s
t_CLK	`DCLK` period	1/f_MAX	—	s
f_MAX	`DCLK` frequency (FPP ×8/ ×16)	—	125	MHz
t_CD2UM	`CONF_DONE` high to user mode⁹⁸	175	437	µs
t_CD2CU	`CONF_DONE` high to `CLKUSR` enabled	4× maximum `DCLK` period	—	—
t_CD2UMC	`CONF_DONE` high to user mode with `CLKUSR` option on	t_CD2CU + (T_init × `CLKUSR` period)	—	—
T_init	Number of clock cycles required for device initialization	8,576	—	Cycles

⁹⁵ You can obtain this value if you do not delay configuration by extending the nCONFIG or the nSTATUS low pulse width.

⁹⁶ You can obtain this value if you do not delay configuration by externally holding the nSTATUS low.

⁹⁷ If nSTATUS is monitored, follow the t_ST2CK specification. If nSTATUS is not monitored, follow the t_CF2CK specification.

⁹⁸ The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.

FPP Configuration Timing when DCLK-to-DATA[] >1

Table 67. FPP Timing Parameters When DCLK-to-DATA[] Ratio is >1 for Arria^® V Devices Use these timing parameters when you use the decompression and design security features.
Symbol	Parameter	Minimum	Maximum	Unit
t_CF2CD	`nCONFIG` low to `CONF_DONE` low	—	600	ns
t_CF2ST0	`nCONFIG` low to `nSTATUS` low	—	600	ns
t_CFG	`nCONFIG` low pulse width	2	—	µs
t_STATUS	`nSTATUS` low pulse width	268	1506⁹⁹	µs
t_CF2ST1	`nCONFIG` high to `nSTATUS` high	—	1506¹⁰⁰	µs
t_CF2CK ¹⁰¹	`nCONFIG` high to first rising edge on `DCLK`	1506	—	µs
t_ST2CK ¹⁰¹	`nSTATUS` high to first rising edge of `DCLK`	2	—	µs
t_DSU	`DATA[]` setup time before rising edge on `DCLK`	5.5	—	ns
t_DH	`DATA[]` hold time after rising edge on `DCLK`	`N` – 1/f_DCLK ¹⁰²	—	s
t_CH	`DCLK` high time	0.45 × 1/f_MAX	—	s
t_CL	`DCLK` low time	0.45 × 1/f_MAX	—	s
t_CLK	`DCLK` period	1/f_MAX	—	s
f_MAX	`DCLK` frequency (FPP ×8/ ×16)	—	125	MHz
t_R	Input rise time	—	40	ns
t_F	Input fall time	—	40	ns
t_CD2UM	`CONF_DONE` high to user mode¹⁰³	175	437	µs
t_CD2CU	`CONF_DONE` high to `CLKUSR` enabled	4 × maximum `DCLK` period	—	—
t_CD2UMC	`CONF_DONE` high to user mode with `CLKUSR` option on	t_CD2CU + (T_init × `CLKUSR` period)	—	—
T_init	Number of clock cycles required for device initialization	8,576	—	Cycles

⁹⁹ This value can be obtained if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.

¹⁰⁰ This value can be obtained if you do not delay configuration by externally holding nSTATUS low.

¹⁰¹ If nSTATUS is monitored, follow the t_ST2CK specification. If nSTATUS is not monitored, follow the t_CF2CK specification.

¹⁰² N is the DCLK-to-DATA[] ratio and f_DCLK is the DCLK frequency of the system.

¹⁰³ The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.

Active Serial (AS) Configuration Timing

Table 68. AS Timing Parameters for AS ×1 and ×4 Configurations in Arria^® V Devices
The minimum and maximum numbers apply to both the internal oscillator and `CLKUSR` when either one is used as the clock source for device configuration.

The t_CF2CD, t_CF2ST0, t_CFG, t_STATUS, and t_CF2ST1 timing parameters are identical to the timing parameters for passive serial (PS) mode listed in PS Timing Parameters for Arria^® V Devices table. You can obtain the t_CF2ST1 value if you do not delay configuration by externally holding `nSTATUS` low.
Symbol	Parameter	Condition	Minimum	Maximum	Unit
t_CO ¹⁰⁴	`DCLK` falling edge to the `AS_DATA0`/`ASDO` output	—	—	2	ns
t_SU ¹⁰⁵	Data setup time before the falling edge on `DCLK`	—	1.5	—	ns
t_DH ¹⁰⁵	Data hold time after the falling edge on `DCLK`	–3 speed grade	1.7	—	ns
		–4 speed grade	2.0	—	ns
		–5 speed grade	2.3	—	ns
		–6 speed grade	2.6	—	ns
t_CD2UM	`CONF_DONE` high to user mode	—	175	437	µs
t_CD2CU	`CONF_DONE` high to `CLKUSR` enabled	—	4 × maximum `DCLK` period	—	—
t_CD2UMC	`CONF_DONE` high to user mode with `CLKUSR` option on	—	t_CD2CU + (T_init × `CLKUSR` period)	—	—
T_init	Number of clock cycles required for device initialization	—	8,576	—	Cycles

¹⁰⁴ Load capacitance for DCLK = 6 pF and AS_DATA/ASDO = 8 pF. Intel recommends obtaining the t_CO for a given link (including receiver, transmission lines, connectors, termination resistors, and other components) through IBIS or HSPICE simulation.

¹⁰⁵ To evaluate the data setup (t_SU) and data hold time (t_DH) slack on your board in order to ensure you are meeting the t_SU and t_DH requirement, Intel recommends following the guideline in the "Evaluating Data Setup and Hold Timing Slack" chapter in AN822: Intel FPGA Configuration Device Migration Guideline.

DCLK Frequency Specification in the AS Configuration Scheme

Table 69. DCLK Frequency Specification in the AS Configuration SchemeThis table lists the internal clock frequency specification for the AS configuration scheme. The `DCLK` frequency specification applies when you use the internal oscillator as the configuration clock source. The AS multi-device configuration scheme does not support `DCLK` frequency of 100 MHz.
Parameter	Minimum	Typical	Maximum	Unit
`DCLK` frequency in AS configuration scheme	5.3	7.9	12.5	MHz
	10.6	15.7	25.0	MHz
	21.3	31.4	50.0	MHz
	42.6	62.9	100.0	MHz

Passive Serial (PS) Configuration Timing

Table 70. PS Timing Parameters for Arria^® V Devices
Symbol	Parameter	Minimum	Maximum	Unit
t_CF2CD	`nCONFIG` low to `CONF_DONE` low	—	600	ns
t_CF2ST0	`nCONFIG` low to `nSTATUS` low	—	600	ns
t_CFG	`nCONFIG` low pulse width	2	—	µs
t_STATUS	`nSTATUS` low pulse width	268	1506¹⁰⁶	µs
t_CF2ST1	`nCONFIG` high to `nSTATUS` high	—	1506¹⁰⁷	µs
t_CF2CK ¹⁰⁸	`nCONFIG` high to first rising edge on `DCLK`	1506	—	µs
t_ST2CK ¹⁰⁸	`nSTATUS` high to first rising edge of `DCLK`	2	—	µs
t_DSU	`DATA[]` setup time before rising edge on `DCLK`	5.5	—	ns
t_DH	`DATA[]` hold time after rising edge on `DCLK`	0	—	ns
t_CH	`DCLK` high time	0.45 × 1/f_MAX	—	s
t_CL	`DCLK` low time	0.45 × 1/f_MAX	—	s
t_CLK	`DCLK` period	1/f_MAX	—	s
f_MAX	`DCLK` frequency	—	125	MHz
t_CD2UM	`CONF_DONE` high to user mode¹⁰⁹	175	437	µs
t_CD2CU	`CONF_DONE` high to `CLKUSR` enabled	4 × maximum `DCLK` period	—	—
t_CD2UMC	`CONF_DONE` high to user mode with `CLKUSR` option on	t_CD2CU + (T_init × `CLKUSR` period)	—	—
T_init	Number of clock cycles required for device initialization	8,576	—	Cycles

¹⁰⁶ You can obtain this value if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.

¹⁰⁷ You can obtain this value if you do not delay configuration by externally holding nSTATUS low.

¹⁰⁸ If nSTATUS is monitored, follow the t_ST2CK specification. If nSTATUS is not monitored, follow the t_CF2CK specification.

¹⁰⁹ The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.

Initialization

Table 71. Initialization Clock Source Option and the Maximum Frequency for Arria^® V Devices
Initialization Clock Source	Configuration Scheme	Maximum Frequency (MHz)	Minimum Number of Clock Cycles
Internal Oscillator	AS, PS, and FPP	12.5	T_init
`CLKUSR` ¹¹⁰	PS and FPP	125
`CLKUSR` ¹¹⁰	AS	100
`DCLK`	PS and FPP	125

¹¹⁰ To enable CLKUSR as the initialization clock source, turn on the Enable user-supplied start-up clock (CLKUSR) option in the Intel^® Quartus^® Prime software from the General panel of the Device and Pin Options dialog box.

Configuration Files

Table 72. Uncompressed .rbf Sizes for Arria^® V Devices
Use this table to estimate the file size before design compilation. Different configuration file formats, such as a hexadecimal file (.hex) or tabular text file (.ttf) format, have different file sizes.

For the different types of configuration file and file sizes, refer to the Intel^® Quartus^® Prime software. However, for a specific version of the Intel^® Quartus^® Prime software, any design targeted for the same device has the same uncompressed configuration file size.

The IOCSR raw binary file (.rbf) size is specifically for the Configuration via Protocol (CvP) feature.
Variant	Member Code	Configuration .rbf Size (bits)	IOCSR .rbf Size (bits)
Arria^® V GX	A1	71,015,712	439,960
	A3	71,015,712	439,960
	A5	101,740,800	446,360
	A7	101,740,800	446,360
	B1	137,785,088	457,368
	B3	137,785,088	457,368
	B5	185,915,808	463,128
	B7	185,915,808	463,128
Arria^® V GT	C3	71,015,712	439,960
	C7	101,740,800	446,360
	D3	137,785,088	457,368
	D7	185,915,808	463,128
Arria^® V SX	B3	185,903,680	450,968
Arria^® V SX	B5	185,903,680	450,968
Arria^® V ST	D3	185,903,680	450,968
Arria^® V ST	D5	185,903,680	450,968

Minimum Configuration Time Estimation

Table 73. Minimum Configuration Time Estimation for Arria^® V DevicesThe estimated values are based on the configuration .rbf sizes in Uncompressed .rbf Sizes for Arria^® V Devices table.
Variant	Member Code	Active Serial¹¹¹			Fast Passive Parallel¹¹²
Variant	Member Code	Width	DCLK (MHz)	Minimum Configuration Time (ms)	Width	DCLK (MHz)	Minimum Configuration Time (ms)
Arria^® V GX	A1	4	100	178	16	125	36
	A3	4	100	178	16	125	36
	A5	4	100	255	16	125	51
	A7	4	100	255	16	125	51
	B1	4	100	344	16	125	69
	B3	4	100	344	16	125	69
	B5	4	100	465	16	125	93
	B7	4	100	465	16	125	93
Arria^® V GT	C3	4	100	178	16	125	36
	C7	4	100	255	16	125	51
	D3	4	100	344	16	125	69
	D7	4	100	465	16	125	93
Arria^® V SX	B3	4	100	465	16	125	93
Arria^® V SX	B5	4	100	465	16	125	93
Arria^® V ST	D3	4	100	465	16	125	93
Arria^® V ST	D5	4	100	465	16	125	93

¹¹¹ DCLK frequency of 100 MHz using external CLKUSR.

¹¹² Maximum FPGA FPP bandwidth may exceed bandwidth available from some external storage or control logic.

Remote System Upgrades

Table 74. Remote System Upgrade Circuitry Timing Specifications for Arria^® V Devices
Parameter	Minimum	Unit
t_{RU_nCONFIG} ¹¹³	250	ns
t_{RU_nRSTIMER} ¹¹⁴	250	ns

¹¹³ This is equivalent to strobing the reconfiguration input of the Remote Update Intel FPGA IP core high for the minimum timing specification.

¹¹⁴ This is equivalent to strobing the reset timer input of the Remote Update Intel FPGA IP core high for the minimum timing specification.

User Watchdog Internal Oscillator Frequency Specifications

Table 75. User Watchdog Internal Oscillator Frequency Specifications for Arria^® V Devices
Parameter	Minimum	Typical	Maximum	Unit
User watchdog internal oscillator frequency	5.3	7.9	12.5	MHz

I/O Timing

Intel offers two ways to determine I/O timing—the Excel-based I/O timing and the Intel^® Quartus^® Prime Timing Analyzer.

Excel-based I/O timing provides pin timing performance for each device density and speed grade. The data is typically used prior to designing the FPGA to get an estimate of the timing budget as part of the link timing analysis.

The Intel^® Quartus^® Prime Timing Analyzer provides a more accurate and precise I/O timing data based on the specifics of the design after you complete place-and-route.

Programmable IOE Delay

Table 76. I/O element (IOE) Programmable Delay for Arria^® V Devices
Parameter¹¹⁵	Available Settings	Minimum Offset¹¹⁶	Fast Model		Slow Model					Unit
Parameter¹¹⁵	Available Settings	Minimum Offset¹¹⁶	Industrial	Commercial	–C4	–C5	–C6	–I3	–I5	Unit
D1	32	0	0.508	0.517	0.870	1.063	1.063	0.872	1.057	ns
D3	8	0	1.763	1.795	2.999	3.496	3.571	3.031	3.643	ns
D4	32	0	0.508	0.518	0.869	1.063	1.063	1.063	1.057	ns
D5	32	0	0.508