The Automotive-Grade Device Handbook
1. Overview
1.1. Intel Automotive-Grade Devices
1.2. Intel Automotive Qualifications
The automotive grade devices are designed and developed per a quality management system (QMS) that is registered to ISO 9001:2015. The scope of the ISO 9001:2015 registration includes design, development, and provision of semiconductor components, intellectual properties, and software tools. All the foundry, assembly, and test sites that manufacture the automotive devices are operating a QMS that is registered to IATF 16949 in addition to ISO 9001:2015.
Some Intel® devices comply with the following Functional Safety (FuSa) standards:
- ISO 26262
- IEC 61508
For more information about FuSa, contact your Intel® sales representative.
Intel provides certified Automotive Functional Safety Data Package (AFSDP) for devices that comply with ISO 26262. AFSDP delivers the framework, methodology, tools, and IP to assist you in building a safe system with cost and time savings. AFSDP typically saves you 12-18 man-months in certifying your safety critical applications at system level.
AFSDP includes:
- Support for some Intel® FPGAs (automotive-grade Cyclone® V, Cyclone® V SoC, and Intel® MAX® 10)
- Support for the Intel® Quartus® Prime software version 14.1 and the Intel® Quartus® Prime Standard Edition software version 17.0.2
- FMEDA tool
- Diagnostic and standard intellectual property (IP)
- Safety manual
- Certificate
1.3. Supported Device Families
Category | Product Family | Quartus Software Support 1 | Description |
---|---|---|---|
IC, FPGA | Intel® Cyclone® 10 LP | Version 17.1 and later | Low-cost, low-power, feature-rich FPGAs |
IC, FPGA | Intel® MAX® 10 | Version 15.1.2 and later | Low-cost, instant-on, small form factor programmable logic device, integrated analog module |
IC, SoC | Cyclone® V SoC | Version 12.1 and later | Low-cost, low-power, user-customizable ARM-based SoC devices |
IC, FPGA | Cyclone® V | Version 11.1 and later | Low-cost, low-power, feature-rich 28 nm FPGAs |
IC, FPGA | Cyclone® IV | Version 9.1 SP2 and later | Low-cost, low-power, feature-rich 60 nm FPGAs (1.2 V) |
IC, CPLD | MAX® V | Version 11.0 and later | High-density, low-power glue logic CPLDs (1.8 V) |
IC, CPLD | MAX® II | Version 7.2 SP1 and later | High-density, low-power glue logic CPLDs (3.3 V, 2.5 V) |
IC, power | Intel® Enpirion® | — | Integrated inductor, combination of small footprint, low noise performance, and high efficiency |
Volume Production Support for Legacy Device Families | |||
Category | Product Family | Quartus Software Support 2 | Description |
IC, FPGA | Cyclone® III | Version 8.0 to 13.1 | Low-cost, feature-rich 65 nm FPGAs |
IC, FPGA | Cyclone® II | Version 7.2 SP1 to 13.0 | Low-cost, feature-rich 90 nm FPGAs |
IC, FPGA | Cyclone® | Version 7.2 SP1 to 13.0 | Low-cost, glue logic 130 nm FPGAs |
IC, CPLD | MAX® 7000AE | Version 7.2 SP1 to 13.0 | High-performance, glue logic CPLDs (5-V I/O compatible) |
2. Supported Automotive-Grade Devices
2.1. Intel Cyclone 10 LP Devices
2.1.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
10CL006YE144A7G | 10CL006 | 144-pin EQFP | –40°C to 125°C | –7 |
10CL006YU256A7G | 10CL006 | 256-pin UBGA | –40°C to 125°C | –7 |
10CL010YE144A7G | 10CL010 | 144-pin EQFP | –40°C to 125°C | –7 |
10CL010YM164A7G | 10CL010 | 164-pin MBGA | –40°C to 125°C | –7 |
10CL010YU256A7G | 10CL010 | 256-pin UBGA | –40°C to 125°C | –7 |
10CL016YE144A7G | 10CL016 | 144-pin EQFP | –40°C to 125°C | –7 |
10CL016YM164A7G | 10CL016 | 164-pin MBGA | –40°C to 125°C | –7 |
10CL016YU256A7G | 10CL016 | 256-pin UBGA | –40°C to 125°C | –7 |
10CL025YE144A7G | 10CL025 | 144-pin EQFP | –40°C to 125°C | –7 |
10CL025YU256A7G | 10CL025 | 256-pin UBGA | –40°C to 125°C | –7 |
10CL025YU484A7G | 10CL025 | 484-pin UBGA | –40°C to 125°C | –7 |
10CL040YU484A7G | 10CL040 | 484-pin UBGA | –40°C to 125°C | –7 |
10CL055YU484A7G | 10CL055 | 484-pin UBGA | –40°C to 125°C | –7 |
10CL080YU484A7G | 10CL080 | 484-pin UBGA | –40°C to 125°C | –7 |
2.1.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | ||||||
---|---|---|---|---|---|---|---|---|---|
10CL006 | 10CL010 | 10CL016 | 10CL025 | 10CL040 | 10CL055 | 10CL080 | |||
(6K LEs) | (10K LEs) | (16K LEs) | (25K LEs) | (40K LEs) | (55K LEs) | (80K LEs) | |||
GPIO / LVDS | |||||||||
MBGA-164 | 0.5 | 8 × 8 | — | 71 / 22 | 71 / 22 | — | — | — | — |
UBGA-256 | 0.8 | 14 × 14 | 176 / 65 | 176 / 65 | 162 / 53 | 150 / 52 | — | — | — |
UBGA-484 | 0.8 | 19 × 19 | — | — | — | 325 / 124 | 325 / 124 | 321 / 132 | 289 / 110 |
EQFP-144 | 0.5 | 22 × 22 | 88 / 22 | 88 / 22 | 78 / 19 | 76 / 18 | — | — | — |
2.1.3. Device Ordering Codes
2.2. Intel Enpirion Devices
2.2.1. Supported Automotive-Grade Devices
Device Ordering Code | Maximum Output Current | Package | Ambient Operating Temperature Range | Junction Temperature Range |
---|---|---|---|---|
EP5358HUA | 600 mA | 16-pin QFN | –40°C to 105°C | –40°C to 125°C |
EP5358LUA | 600 mA | 16-pin QFN | –40°C to 105°C | –40°C to 125°C |
EN6310QA | 1 A | 30-pin QFN | –40°C to 105°C | –40°C to 125°C |
EP53A8HQA | 1 A | 16-pin QFN | –40°C to 105°C | –40°C to 125°C |
EP53A8LQA | 1 A | 16-pin QFN | –40°C to 105°C | –40°C to 125°C |
EN6337QA | 3 A | 38-pin QFN | –40°C to 105°C | –40°C to 125°C |
EN6347QA | 4 A | 38-pin QFN | –40°C to 105°C | –40°C to 125°C |
EN6360QA | 8 A | 68-pin QFN | –40°C to 105°C | –40°C to 125°C |
EN63A0QA | 12 A | 76-pin QFN | –40°C to 105°C | –40°C to 125°C |
2.3. Intel MAX 10 Devices
2.3.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
10M02SCE144A7G | 10M02SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M02SCU169A7G | 10M02SC | 169-pin UBGA | –40°C to 125°C | –7 |
10M02DCU324A7G | 10M02DC | 324-pin UBGA | –40°C to 125°C | –7 |
10M04SAE144A7G | 10M04SA | 144-pin EQFP | –40°C to 125°C | –7 |
10M04SAU169A7G | 10M04SA | 169-pin UBGA | –40°C to 125°C | –7 |
10M04SCE144A7G | 10M04SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M04SCU169A7G | 10M04SC | 169-pin UBGA | –40°C to 125°C | –7 |
10M04DAF256A7G | 10M04DA | 256-pin FBGA | –40°C to 125°C | –7 |
10M04DCF256A7G | 10M04DC | 256-pin FBGA | –40°C to 125°C | –7 |
10M04DCU324A7G | 10M04DC | 324-pin UBGA | –40°C to 125°C | –7 |
10M08SAE144A7G | 10M08SA | 144-pin EQFP | –40°C to 125°C | –7 |
10M08SAU169A7G | 10M08SA | 169-pin UBGA | –40°C to 125°C | –7 |
10M08SCE144A7G | 10M08SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M08SCU169A7G | 10M08SC | 169-pin UBGA | –40°C to 125°C | –7 |
10M08DAF256A7G | 10M08DA | 256-pin FBGA | –40°C to 125°C | –7 |
10M08DCF256A7G | 10M08DC | 256-pin FBGA | –40°C to 125°C | –7 |
10M08DCU324A7G | 10M08DC | 324-pin UBGA | –40°C to 125°C | –7 |
10M16SAE144A7G | 10M16SA | 144-pin EQFP | –40°C to 125°C | –7 |
10M16SAU169A7G | 10M16SA | 169-pin UBGA | –40°C to 125°C | –7 |
10M16SCE144A7G | 10M16SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M16SCU169A7G | 10M16SC | 169-pin UBGA | –40°C to 125°C | –7 |
10M16DAF256A7G | 10M16DA | 256-pin FBGA | –40°C to 125°C | –7 |
10M16DAF484A7G | 10M16DA | 484-pin FBGA | –40°C to 125°C | –7 |
10M16DCF256A7G | 10M16DC | 256-pin FBGA | –40°C to 125°C | –7 |
10M16DCU324A7G | 10M16DC | 324-pin UBGA | –40°C to 125°C | –7 |
10M16DCF484A7G | 10M16DC | 484-pin FBGA | –40°C to 125°C | –7 |
10M25SAE144A7G | 10M25SA | 144-pin EQFP | –40°C to 125°C | –7 |
10M25SCE144A7G | 10M25SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M25DAF256A7G | 10M25DA | 256-pin FBGA | –40°C to 125°C | –7 |
10M25DAF484A7G | 10M25DA | 484-pin FBGA | –40°C to 125°C | –7 |
10M25DCF256A7G | 10M25DC | 256-pin FBGA | –40°C to 125°C | –7 |
10M25DCF484A7G | 10M25DC | 484-pin FBGA | –40°C to 125°C | –7 |
10M40SCE144A7G | 10M40SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M40DCF256A7G | 10M40DC | 256-pin FBGA | –40°C to 125°C | –7 |
10M50SCE144A7G | 10M50SC | 144-pin EQFP | –40°C to 125°C | –7 |
10M50DCF256A7G | 10M50DC | 256-pin FBGA | –40°C to 125°C | –7 |
2.3.2. Package Options and Maximum User I/Os
Device | Package | ||
---|---|---|---|
Type |
U169 169-pin UBGA |
E144 144-pin EQFP |
|
Size | 11 mm × 11 mm | 22 mm × 22 mm | |
Pitch | 0.8 mm | 0.5 mm | |
10M02S | 130 | 101 | |
10M04S | 130 | 101 | |
10M08S | 130 | 101 | |
10M16S | 130 | 101 | |
10M25S | — | 101 | |
10M40S | — | 101 | |
10M50S | — | 101 |
Device | Package | |||
---|---|---|---|---|
Type |
U324 324-pin UBGA |
F256 256-pin FBGA |
F484 484-pin FBGA |
|
Size | 15 mm × 15 mm | 17 mm × 17 mm | 23 mm × 23 mm | |
Ball Pitch | 0.8 mm | 1.0 mm | 1.0 mm | |
10M02D | 160 | — | — | |
10M04D | 246 | 178 | — | |
10M08D | 246 | 178 | 250 | |
10M16D | 246 | 178 | 320 | |
10M25D | — | 178 | 360 | |
10M40D | — | 178 | 360 | |
10M50D | — | 178 | 360 |
2.3.3. Device Ordering Codes
2.4. Cyclone V SoC Devices
2.4.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
5CSEBA2U19A7N | 5CSEBA2 | 484-pin UBGA | –40°C to 125°C | –7 |
5CSEBA2U23A7N | 5CSEBA2 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA2U23A7N | 5CSEMA2 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEBA4U19A7N | 5CSEBA4 | 484-pin UBGA | –40°C to 125°C | –7 |
5CSEBA4U23A7N | 5CSEBA4 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA4U23A7N | 5CSEMA4 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEBA5U19A7N | 5CSEBA5 | 484-pin UBGA | –40°C to 125°C | –7 |
5CSEBA5U23A7N | 5CSEBA5 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA5U23A7N | 5CSEMA5 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA5F31A7N | 5CSEMA5 | 896-pin FBGA | –40°C to 125°C | –7 |
5CSEBA6U19A7N | 5CSEBA6 | 484-pin UBGA | –40°C to 125°C | –7 |
5CSEBA6U23A7N | 5CSEBA6 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA6U23A7N | 5CSEMA6 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSEMA6F31A7N | 5CSEMA6 | 896-pin FBGA | –40°C to 125°C | –7 |
5CSXFC2C6U23A7N | 5CSXFC2 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSXFC4C6U23A7N | 5CSXFC4 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSXFC5C6U23A7N | 5CSXFC5 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSXFC6C6U23A7N | 5CSXFC6 | 672-pin UBGA | –40°C to 125°C | –7 |
5CSXFC6D6F31A7N | 5CSXFC6 | 896-pin FBGA | –40°C to 125°C | –7 |
2.4.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | |||
---|---|---|---|---|---|---|
5CSEA2 | 5CSEA4 | 5CSEA5 | 5CSEA6 | |||
(25K LEs) | (40K LEs) | (85K LEs) | (110K LEs) | |||
FPGA I/Os / HPS I/Os | ||||||
UBGA-484 | 0.8 | 19 x 19 | 66 / 151 | 66 / 151 | 66 / 151 | 66 / 151 |
UBGA-672 | 0.8 | 23 x 23 | 145 / 181 | 145 / 181 | 145 / 181 | 145 / 181 |
FBGA-896 | 1 | 31 x 31 | — | — | 288 / 181 | 288 / 181 |
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | |||
---|---|---|---|---|---|---|
5CSXC2 | 5CSXC4 | 5CSXC5 | 5CSXC6 | |||
(25K LEs) | (40K LEs) | (85K LEs) | (110K LEs) | |||
FPGA I/Os / HPS I/Os / XCVRs | ||||||
UBGA-672 | 0.8 | 23 x 23 | 145 / 181 / 6 | 145 / 181 / 6 | 145 / 181 / 6 | 145 / 181 / 6 |
FBGA-896 | 1 | 31 x 31 | — | — | — | 288 / 181 / 9 |
2.4.3. Device Ordering Codes
2.5. Cyclone V Devices
2.5.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
5CEBA2F17A7N | 5CEBA2 | 256-pin FBGA | –40°C to 125°C | –7 |
5CEFA2U19A7N | 5CEFA2 | 484-pin UBGA | –40°C to 125°C | –7 |
5CEBA4F17A7N | 5CEBA4 | 256-pin FBGA | –40°C to 125°C | –7 |
5CEFA4U19A7N | 5CEFA4 | 484-pin UBGA | –40°C to 125°C | –7 |
5CEFA5U19A7N | 5CEFA5 | 484-pin UBGA | –40°C to 125°C | –7 |
5CEFA7U19A7N | 5CEFA7 | 484-pin UBGA | –40°C to 125°C | –7 |
5CEFA9U19A7N | 5CEFA9 | 484-pin UBGA | –40°C to 125°C | –7 |
5CGXFC3B6U15A7N | 5CGXFC3 | 324-pin UBGA | –40°C to 125°C | –7 |
5CGXFC3B6U19A7N | 5CGXFC3 | 484-pin UBGA | –40°C to 125°C | –7 |
5CGXFC4C6U19A7N | 5CGXFC4 | 484-pin UBGA | –40°C to 125°C | –7 |
5CGXFC5C6U19A7N | 5CGXFC5 | 484-pin UBGA | –40°C to 125°C | –7 |
5CGXFC5C6F23A7N | 5CGXFC5 | 484-pin FBGA | –40°C to 125°C | –7 |
5CGXFC7C6U19A7N | 5CGXFC7 | 484-pin UBGA | –40°C to 125°C | –7 |
5CGXFC7D6F31A7N | 5CGXFC7 | 896-pin FBGA | –40°C to 125°C | –7 |
5CGXFC9A6U19A7N | 5CGXFC9 | 484-pin UBGA | –40°C to 125°C | –7 |
2.5.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | ||||
---|---|---|---|---|---|---|---|
5CEA2 | 5CEA4 | 5CEA5 | 5CEA7 | 5CEA9 | |||
(25K LEs) | (49K LEs) | (77K LEs) | (149.5K LEs) | (301K LEs) | |||
I/Os | |||||||
FBGA-256 | 1 | 17 x 17 | 128 | 128 | — | — | — |
UBGA-484 | 0.8 | 19 x 19 | 224 | 224 | 224 | 240 | 240 |
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | ||||
---|---|---|---|---|---|---|---|
5CGXC3 | 5CGXC4 | 5CGXC5 | 5CGXC7 | 5CGXC9 | |||
(36K LEs) | (50K LEs) | (77K LEs) | (149.5K LEs) | (301K LEs) | |||
I/Os / XCVRs | |||||||
UBGA-324 | 0.8 | 15 x 15 | 144 / 3 | — | — | — | — |
UBGA-484 | 0.8 | 19 x 19 | 208 / 3 | 224 / 6 | 224 / 6 | 240 / 6 | 240 / 5 |
FBGA-484 | 1 | 23 x 23 | — | — | 240 / 6 | — | — |
FBGA-896 | 1 | 31 x 31 | — | — | — | 480 / 9 | — |
2.5.3. Device Ordering Codes
2.6. Cyclone IV Devices
2.6.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EP4CE6F17A7N | EP4CE6 | 256-pin FBGA | –40°C to 125°C | –7 |
EP4CE6E22A7N | EP4CE6 | 144-pin EQFP | –40°C to 125°C | –7 |
EP4CE10F17A7N | EP4CE10 | 256-pin FBGA | –40°C to 125°C | –7 |
EP4CE10E22A7N | EP4CE10 | 144-pin EQFP | –40°C to 125°C | –7 |
EP4CE15F17A7N | EP4CE15 | 256-pin FBGA | –40°C to 125°C | –7 |
EP4CE15F23A7N | EP4CE15 | 484-pin FBGA | –40°C to 125°C | –7 |
EP4CE15U14A7N | EP4CE15 | 256-pin UBGA | –40°C to 125°C | –7 |
EP4CE22F17A7N | EP4CE22 | 256-pin FBGA | –40°C to 125°C | –7 |
EP4CE22E22A7N | EP4CE22 | 144-pin EQFP | –40°C to 125°C | –7 |
EP4CE22U14A7N | EP4CE22 | 256-pin UBGA | –40°C to 125°C | –7 |
EP4CE30F19A7N | EP4CE30 | 324-pin FBGA | –40°C to 125°C | –7 |
EP4CE30F23A7N | EP4CE30 | 484-pin FBGA | –40°C to 125°C | –7 |
EP4CE40F19A7N | EP4CE40 | 324-pin FBGA | –40°C to 125°C | –7 |
EP4CE40F23A7N | EP4CE40 | 484-pin FBGA | –40°C to 125°C | –7 |
EP4CE40U19A7N | EP4CE40 | 484-pin UBGA | –40°C to 125°C | –7 |
EP4CE55F23A7N | EP4CE55 | 484-pin FBGA | –40°C to 125°C | –7 |
EP4CGX15BF14A7N | EP4CGX15 | 169-pin FBGA | –40°C to 125°C | –7 |
2.6.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | ||||||
---|---|---|---|---|---|---|---|---|---|
EP4CE6 (6.3K LEs) | EP4CE10 (10.3K LEs) | EP4CE15 (15.4K LEs) | EP4CE22 (22.3K LEs) | EP4CE30 (28.8K LEs) | EP4CE40 (39.6K LEs) | EP4CE55 (55.9K LEs) | |||
I/Os | |||||||||
EQFP-144 | 0.5 | 22 x 22 | 91 | 91 | — | 79 | — | — | — |
UBGA-256 | 0.8 | 14 x 14 | — | — | 165 | 153 | — | — | — |
FBGA-256 | 1 | 17 x 17 | 179 | 179 | 165 | 153 | — | — | — |
UBGA-484 | 0.8 | 19 x 19 | — | — | — | — | — | 328 | — |
FBGA-324 | 1 | 19 x 19 | — | — | — | — | 193 | 193 | — |
FBGA-484 | 1 | 23 x 23 | — | — | 343 | — | 328 | 328 | 324 |
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line |
---|---|---|---|
EP4CGX15 (14.4K LEs) | |||
I/Os | |||
FBGA-169 | 1 | 14 x 14 | 72 / 2 |
2.6.3. Device Ordering Codes
2.7. MAX V Devices
2.7.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
5M40ZE64A5N | 5M40Z | 64-pin EQFP | –40°C to 125°C | –5 |
5M80ZE64A5N | 5M80Z | 64-pin EQFP | –40°C to 125°C | –5 |
5M80ZT100A5N | 5M80Z | 100-pin TQFP | –40°C to 125°C | –5 |
5M160ZE64A5N | 5M160Z | 64-pin EQFP | –40°C to 125°C | –5 |
5M160ZT100A5N | 5M160Z | 100-pin TQFP | –40°C to 125°C | –5 |
5M240ZT100A5N | 5M240Z | 100-pin TQFP | –40°C to 125°C | –5 |
5M570ZT100A5N | 5M570Z | 100-pin TQFP | –40°C to 125°C | –5 |
5M1270ZF256A5N | 5M1270Z | 256-pin FBGA | –40°C to 125°C | –5 |
5M1270ZT144A5N | 5M1270Z | 144-pin TQFP | –40°C to 125°C | –5 |
2.7.2. Package Options and Maximum User I/Os
Package Type/ Pin Count | Ball Spacing (mm) | Dimensions (mm) | Product Line | |||||
---|---|---|---|---|---|---|---|---|
5M40Z (40 LEs) | 5M80Z (80 LEs) | 5M160Z (160 LEs) | 5M240Z (240 LEs) | 5M570Z (570 LEs) | 5M1270Z (1270 LEs) | |||
I/Os | ||||||||
EQFP-64 | 0.5 | 7 x 7 | 54 | 54 | 54 | — | — | — |
TQFP-100 | 0.5 | 14 x 14 | — | 79 | 79 | 79 | 74 | — |
TQFP-144 | 0.5 | 20 x 20 | — | — | — | — | — | 114 |
FBGA-256 | 1 | 17 x 17 | — | — | — | — | — | 211 |
2.7.3. Device Ordering Codes
2.8. MAX II Devices
2.8.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EPM240T100A5N | EPM240 | 100-pin TQFP | –40°C to 125°C | –5 |
EPM570F100A5N | EPM570 | 100-pin FBGA | –40°C to 125°C | –5 |
EPM570T100A5N | EPM570 | 100-pin TQFP | –40°C to 125°C | –5 |
EPM570T144A5N | EPM570 | 144-pin TQFP | –40°C to 125°C | –5 |
EPM1270T144A5N | EPM1270 | 144-pin TQFP | –40°C to 125°C | –5 |
EPM1270F256A5N | EPM1270 | 256-pin FBGA | –40°C to 125°C | –5 |
EPM2210F256A5N | EPM2210 | 256-pin FBGA | –40°C to 125°C | –5 |
EPM2210F324A5N | EPM2210 | 324-pin FBGA | –40°C to 125°C | –5 |
2.8.2. Device Ordering Codes
2.9. Cyclone III Devices (Legacy Support)
2.9.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EP3C5E144A7N | EP3C5 | 144-pin EQFP | –40°C to 125°C | –7 |
EP3C5F256A7N | EP3C5 | 256-pin FBGA | –40°C to 125°C | –7 |
EP3C5U256A7N | EP3C5 | 256-pin UBGA | –40°C to 125°C | –7 |
EP3C10E144A7N | EP3C10 | 144-pin EQFP | –40°C to 125°C | –7 |
EP3C10F256A7N | EP3C10 | 256-pin FBGA | –40°C to 125°C | –7 |
EP3C10U256A7N | EP3C10 | 256-pin UBGA | –40°C to 125°C | –7 |
EP3C16E144A7N | EP3C16 | 144-pin EQFP | –40°C to 125°C | –7 |
EP3C16F256A7N | EP3C16 | 256-pin FBGA | –40°C to 125°C | –7 |
EP3C16U256A7N | EP3C16 | 256-pin UBGA | –40°C to 125°C | –7 |
EP3C16F484A7N | EP3C16 | 484-pin FBGA | –40°C to 125°C | –7 |
EP3C16U484A7N | EP3C16 | 484-pin UBGA | –40°C to 125°C | –7 |
EP3C25E144A7N | EP3C25 | 144-pin EQFP | –40°C to 125°C | –7 |
EP3C25F256A7N | EP3C25 | 256-pin FBGA | –40°C to 125°C | –7 |
EP3C25U256A7N | EP3C25 | 256-pin UBGA | –40°C to 125°C | –7 |
EP3C25F324A7N | EP3C25 | 324-pin FBGA | –40°C to 125°C | –7 |
EP3C40F324A7N | EP3C40 | 324-pin FBGA | –40°C to 125°C | –7 |
EP3C40F484A7N | EP3C40 | 484-pin FBGA | –40°C to 125°C | –7 |
EP3C40U484A7N | EP3C40 | 484-pin UBGA | –40°C to 125°C | –7 |
2.9.2. Device Ordering Codes
2.10. Cyclone II Devices (Legacy Support)
2.10.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EP2C5AT144A7N | EP2C5 | 144-pin TQFP | –40°C to 125°C | –7 |
EP2C5AF256A7N | EP2C5 | 256-pin FBGA | –40°C to 125°C | –7 |
EP2C8AF256A7N | EP2C8 | 256-pin FBGA | –40°C to 125°C | –7 |
EP2C15AF256A7N | EP2C15 | 256-pin FBGA | –40°C to 125°C | –7 |
EP2C15AF484A7N | EP2C15 | 484-pin FBGA | –40°C to 125°C | –7 |
EP2C20AF256A7N | EP2C20 | 256-pin FBGA | –40°C to 125°C | –7 |
EP2C20AF484A7N | EP2C20 | 484-pin FBGA | –40°C to 125°C | –7 |
2.10.2. Device Ordering Codes
2.11. Cyclone Devices (Legacy Support)
2.11.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EP1C3T100A8N | EP1C3 | 100-pin TQFP | –40°C to 125°C | –8 |
EP1C3T144A8N | EP1C3 | 144-pin TQFP | –40°C to 125°C | –8 |
2.11.2. Device Ordering Codes
2.12. MAX 7000A Devices (Legacy Support)
2.12.1. Supported Automotive-Grade Devices
Device Ordering Code | Device | Package | Junction Temperature Range | Speed Grade |
---|---|---|---|---|
EPM7032AETA44-10N | EPM7032AE | 44-pin TQFP | –40°C to 130°C | –10 |
EPM7064AETA44-10N | EPM7064AE | 44-pin TQFP | –40°C to 130°C | –10 |
EPM7064AETA100-10N | EPM7064AE | 100-pin TQFP | –40°C to 130°C | –10 |
EPM7128AETA100-10N | EPM7128AE | 100-pin TQFP | –40°C to 130°C | –10 |
EPM7128AETA144-10N | EPM7128AE | 144-pin TQFP | –40°C to 130°C | –10 |
2.12.2. Device Ordering Codes
3. Intel Quartus Prime Software Support
The Intel® Quartus® Prime design software supports the automotive-grade devices in the automotive temperature range. The Intel® Quartus® Prime software provides a comprehensive environment for SoC design. It also includes HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis, Signal Tap II logic analyzer, and device configuration.
To target an automotive-grade device in your design in the Intel® Quartus® Prime software, follow these steps:
- Click Assignments > Device. The Settings dialog box appears.
- In the Family drop-down list, select your device.
- Under Target device, select Specific device selected in ‘Available devices’ list.
- In the Available devices list, select the
appropriate ordering code.Note: The Intel® Quartus® Prime software does not show the “N” suffix, which indicates a lead-free device. For example, the 5CGXFC3B6U15A7N device is shown only as 5CGXFC3B6U15A7.
- Click OK.
The following automotive-grade devices are from the legacy device families and are not recommended for new automotive designs.
- Cyclone® III
- Cyclone® II
- Cyclone®
- MAX® 7000AE
4. Power Analysis and Estimation
4.1. Early Power Estimator
The Early Power Estimator (EPE) is a power estimation tool that helps you estimate the power consumption of your design during the system planning phase for proper power supply planning and consideration.
The EPE allows you to enter design information based on architectural features and calculates the power consumed by each architectural feature. Inputs to the EPE are environmental conditions and device resources (such as clock frequency, RAM blocks, and digital signal processing [DSP] blocks) that you expect to use in your design. The EPE then calculates the static and dynamic power, current estimates, and thermal analysis for the design.
You can either enter the design information manually into the spreadsheet or import a power estimator file of a fully or partially completed design from the Intel® Quartus® Prime software. After importing a file, you can edit some of the input parameters including VCCINT, ambient temperature, airflow, clock frequency, and toggle percentage to suit your system requirements.
The value obtained from the EPE is only an estimation and should not be used as a specification. The accuracy of the EPE results depends on how close your input of the design information into the EPE resembles that of the final design.
For more information about the EPE, and how to generate and import the power estimator file, refer to the respective user guides.
4.2. Power Analyzer
The Power Analyzer tool in the Intel® Quartus® Prime software is a power analysis tool that helps you calculate your design power consumption accurately to ensure thermal and power supply budgets are not violated after your design is complete. The Power Analyzer tool requires your design to be synthesized and fitted to the target device. Availability of information such as design resources, how the design is placed and routed on the target device, and the I/O standards assigned to each I/O cell allow the Power Analyzer tool to provide accurate power estimation.
The process of using the Power Analyzer tool consists of the following three parts:
- Specifying sources of input data
- Specifying operating conditions
- Running the Power Analyzer tool
The input data consists of the signal activities data (toggle rates and static probabilities) of the compiled design. Signal activity data can be derived from simulation results, user assignment in the Assignment Editor, user-defined default toggle rate, and vectorless estimation.
The operating conditions include device power characteristic, ambient and junction temperature, cooling solution, and board thermal model, all of which can be set in the Intel® Quartus® Prime software.
The Power Analyzer tool calculates the dynamic, static and I/O thermal power consumption, current consumed from voltage source, a summary of the signal activities used for analysis, and a confidence metric that reflects the overall quality of the data sources for the signal activities.
5. DC and Timing Specifications
The automotive-grade devices have the same values for the following specifications as published in the respective device datasheets :
- Absolute maximum ratings
- Recommended operating conditions
- DC electrical characteristics
- Timing specifications over the automotive temperature range
For the maximum power-up current (ICCINT) required to power up an automotive-grade Cyclone® device, use the value specified for the corresponding industrial-grade device.
The on-chip series termination (RS OCT) specifications for the following automotive-grade devices are as follows:
- Automotive-grade Cyclone® III, Cyclone® IV, Cyclone® V, Cyclone® V SoC, Intel® Cyclone® 10 LP, and Intel® MAX® 10 devices—same as the corresponding industrial-grade devices
- Automotive-grade Cyclone® II devices—same as the corresponding extended-temperature devices
The switching characteristics for the following automotive-grade devices are as follows:
- Automotive-grade Cyclone® III, Cyclone® IV, Cyclone® V, and Cyclone® V SoC devices—same as the devices with –8 speed grade as published in the respective device datasheets
- Automotive-grade MAX® II and MAX® V devices—same as the devices with –5 speed grade as published in the respective device datasheets
6. Pin-Out Information
For more information about the device pin-outs, refer to the respective device pin-out files.
7. Package and Board Layout Information
Intel provides information on package and PCB design guidelines.
A. Document Revision History for the Automotive-Grade Device Handbook
Document Version | Changes |
---|---|
2021.03.01 | Mentioned that the switching characteristics of the automotive-grade MAX® II and MAX® V devices are the same as the devices with –5 speed grade as published in the respective device datasheets in the DC and Timing Specifications section. |
2019.08.27 |
|
2018.10.01 |
|
Date | Version | Changes |
---|---|---|
December 2017 | 2017.12.15 |
|
July 2017 | 2017.07.13 | Corrected the automotive temperature range in the figure showing the available options for the Intel® Arria® 10 GX devices from "-40°C to 100°C" to "-40°C to 125°C". |
May 2017 | 2017.05.08 |
|
February 2017 | 2017.02.13 |
|
May 2016 | 2016.05.03 |
|
September 2014 | 2014.09.22 |
|
September 2013 | 3.4 |
|
June 2013 | 3.3 | Updated Table 3–1 and Table 3–5. |
May 2013 | 3.2 |
|
February 2013 | 3.1 | Updated Table 2-2, Table 2-3, Table 3–2, Table 3–3, Table 3–4, Table 4–2, Table 4–3, and Table 5–2. |
January 2013 | 3.0 |
|
May 2011 | 2.0 |
|
March 2010 | 1.2 |
|
October 2008 | 1.1 |
|
February 2008 | 1.0 | Initial release. |