The Automotive-Grade Device Handbook

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AUT5V1 | 2018.10.01

Overview

Intel Automotive-Grade Devices

Intel automotive-grade devices are certified to AEC-Q100 (Grade 2 level) and are available in CPLD, FPGA, system on a chip (SoC), and Intel^® Enpirion^® PowerSoCs. You can use these devices in high-temperature environments, such as in automotive sectors.

Intel Automotive Qualifications

The automotive grade devices are designed and developed per a quality management system (QMS) that is registered to ISO 9001:2015. The scope of the ISO 9001:2015 registration includes design, development, and provision of semiconductor components, intellectual properties, and software tools. All the foundry, assembly, and test sites that manufacture the automotive devices are operating a QMS that is registered to IATF 16949 in addition to ISO 9001:2015.

Selected Intel^® devices are complied to the following Functional Safety (FuSa) standards:

ISO-26262
IEC-61508

Intel provides certified Automotive Functional Safety Data Package (AFSDP) for devices that are complied to ISO-26262. AFSDP delivers the framework, methodology, tools, and IP to assist you in building a safe system with cost and time savings. AFSDP typically saves you 12-18 man-months in certifying your safety critical applications at system level.

AFSDP includes:

Intel^® FPGA (automotive-grade Cyclone^® V, Cyclone^® V SoC)
Software development tools, including the Intel^® Quartus^® Prime software version 14.1
FMEDA tool
Diagnostic and standard intellectual property (IP)
Safety manual
Certificate

Supported Device Families

Table 1. Intel Automotive-Grade Device Families
Category	Product Family	Quartus Software Support ¹	Description
IC, FPGA	Intel^® Cyclone^® 10 LP	Version 17.1 and later	Low-cost, low-power, feature-rich FPGAs
IC, FPGA	Intel^® MAX^® 10	Version 14.0.2 and later	Low-cost, instant-on, small form factor programmable logic device, integrated analog module
IC, SoC	Cyclone^® V SoC	Version 12.1 and later	Low-cost, low-power, user-customizable ARM-based SoC devices
IC, FPGA	Cyclone^® V	Version 11.1 and later	Low-cost, low-power, feature-rich 28 nm FPGAs
IC, FPGA	Cyclone^® IV	Version 9.1 SP2 and later	Low-cost, low-power, feature-rich 60 nm FPGAs (1.2 V)
IC, CPLD	MAX^® V	Version 11.0 and later	High-density, low-power glue logic CPLDs (1.8 V)
IC, CPLD	MAX^® II	Version 7.2 SP1 and later	High-density, low-power glue logic CPLDs (3.3 V, 2.5 V)
IC, power	Intel^® Enpirion^®	—	Integrated inductor, combination of small footprint, low noise performance, and high efficiency
Volume Production Support for Legacy Device Families
Category	Product Family	Quartus Software Support ²	Description
IC, FPGA	Cyclone^® III	Version 8.0 to 13.1	Low-cost, feature-rich 65 nm FPGAs
IC, FPGA	Cyclone^® II	Version 7.2 SP1 to 13.0	Low-cost, feature-rich 90 nm FPGAs
IC, FPGA	Cyclone^®	Version 7.2 SP1 to 13.0	Low-cost, glue logic 130 nm FPGAs
IC, CPLD	MAX^® 7000AE	Version 7.2 SP1 to 13.0	High-performance, glue logic CPLDs (5-V I/O compatible)

¹ Starting from version 15.1, the Quartus II software is known as the Intel^® Quartus^® Prime Standard Edition software.

² The legacy devices are only supported in the Quartus II software.

Supported Automotive-Grade Devices

Intel Cyclone 10 LP Devices

Supported Automotive-Grade Devices

Table 2. Automotive-Grade in Intel^® Cyclone^® 10 LP DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
10CL006YE144A7G	10CL006	144-pin EQFP	–40°C to 125°C	–7
10CL006YU256A7G	10CL006	256-pin UBGA	–40°C to 125°C	–7
10CL010YE144A7G	10CL010	144-pin EQFP	–40°C to 125°C	–7
10CL010YM164A7G	10CL010	164-pin MBGA	–40°C to 125°C	–7
10CL010YU256A7G	10CL010	256-pin UBGA	–40°C to 125°C	–7
10CL016YE144A7G	10CL016	144-pin EQFP	–40°C to 125°C	–7
10CL016YM164A7G	10CL016	164-pin MBGA	–40°C to 125°C	–7
10CL016YU256A7G	10CL016	256-pin UBGA	–40°C to 125°C	–7
10CL025YE144A7G	10CL025	144-pin EQFP	–40°C to 125°C	–7
10CL025YU256A7G	10CL025	256-pin UBGA	–40°C to 125°C	–7
10CL025YU484A7G	10CL025	484-pin UBGA	–40°C to 125°C	–7
10CL040YU484A7G	10CL040	484-pin UBGA	–40°C to 125°C	–7
10CL055YU484A7G	10CL055	484-pin UBGA	–40°C to 125°C	–7
10CL080YU484A7G	10CL080	484-pin UBGA	–40°C to 125°C	–7

Package Options and Maximum User I/Os

Table 3. Package Options and Maximum User I/Os in Intel^® Cyclone^® 10 LP Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			10CL006	10CL010	10CL016	10CL025	10CL040	10CL055	10CL080
			(6K LEs)	(10K LEs)	(16K LEs)	(25K LEs)	(40K LEs)	(55K LEs)	(80K LEs)
			GPIO / LVDS
MBGA-164	0.5	8 × 8	—	71 / 22	71 / 22	—	—	—	—
UBGA-256	0.8	14 × 14	176 / 65	176 / 65	162 / 53	150 / 52	—	—	—
UBGA-484	0.8	19 × 19	—	—	—	325 / 124	325 / 124	321 / 132	289 / 110
EQFP-144	0.5	22 × 22	88 / 22	88 / 22	78 / 19	76 / 18	—	—	—

Device Ordering Codes

Figure 1. Automotive-Grade Ordering Information for Intel^® Cyclone^® 10 LP Devices

Intel Enpirion Devices

Supported Automotive-Grade Devices

Table 4. Automotive-Grade in Intel^® Enpirion^® DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Maximum Output Current	Package	Ambient Operating Temperature Range	Junction Temperature Range
EP5358HUA	600 mA	16-pin QFN	–40°C to 105°C	–40°C to 125°C
EP5358LUA	600 mA	16-pin QFN	–40°C to 105°C	–40°C to 125°C
EN6310QA	1 A	30-pin QFN	–40°C to 105°C	–40°C to 125°C
EP53A8HQA	1 A	16-pin QFN	–40°C to 105°C	–40°C to 125°C
EP53A8LQA	1 A	16-pin QFN	–40°C to 105°C	–40°C to 125°C
EN6337QA	3 A	38-pin QFN	–40°C to 105°C	–40°C to 125°C
EN6347QA	4 A	38-pin QFN	–40°C to 105°C	–40°C to 125°C
EN6360QA	8 A	68-pin QFN	–40°C to 105°C	–40°C to 125°C
EN63A0QA	12 A	76-pin QFN	–40°C to 105°C	–40°C to 125°C

Intel MAX 10 Devices

Supported Automotive-Grade Devices

Table 5. Automotive-Grade in Intel^® MAX^® 10 Devices
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
10M02SCE144A7G	10M02SC	144-pin EQFP	–40°C to 125°C	–7
10M02SCU169A7G	10M02SC	169-pin UBGA	–40°C to 125°C	–7
10M02DCU324A7G	10M02DC	324-pin UBGA	–40°C to 125°C	–7
10M04SCE144A7G	10M04SC	144-pin EQFP	–40°C to 125°C	–7
10M04SCU169A7G	10M04SC	169-pin UBGA	–40°C to 125°C	–7
10M04DCF256A7G	10M04DC	256-pin FBGA	–40°C to 125°C	–7
10M04DAF256A7G	10M04DA	256-pin FBGA	–40°C to 125°C	–7
10M04DCU324A7G	10M04DC	324-pin UBGA	–40°C to 125°C	–7
10M08SAU169A7G	10M08SA	169-pin UBGA	–40°C to 125°C	–7
10M08SCE144A7G	10M08SC	144-pin EQFP	–40°C to 125°C	–7
10M08SCU169A7G	10M08SC	169-pin UBGA	–40°C to 125°C	–7
10M08DCF256A7G	10M08DC	256-pin FBGA	–40°C to 125°C	–7
10M08DAF256A7G	10M08DA	256-pin FBGA	–40°C to 125°C	–7
10M08DCU324A7G	10M08DC	324-pin UBGA	–40°C to 125°C	–7
10M16SCE144A7G	10M16SC	144-pin EQFP	–40°C to 125°C	–7
10M16SCU169A7G	10M16SC	169-pin UBGA	–40°C to 125°C	–7
10M16DCF256A7G	10M16DC	256-pin FBGA	–40°C to 125°C	–7
10M16DAF256A7G	10M16DA	256-pin FBGA	–40°C to 125°C	–7
10M16DCU324A7G	10M16DC	324-pin UBGA	–40°C to 125°C	–7
10M16DCF484A7G	10M16DC	484-pin FBGA	–40°C to 125°C	–7
10M25SCE144A7G	10M25SC	144-pin EQFP	–40°C to 125°C	–7
10M25DCF256A7G	10M25DC	256-pin FBGA	–40°C to 125°C	–7
10M25DAF256A7G	10M25DA	256-pin FBGA	–40°C to 125°C	–7
10M40SCE144A7G	10M40SC	144-pin EQFP	–40°C to 125°C	–7
10M40DCF256A7G	10M40DC	256-pin FBGA	–40°C to 125°C	–7
10M50SCE144A7G	10M50SC	144-pin EQFP	–40°C to 125°C	–7
10M50DCF256A7G	10M50DC	256-pin FBGA	–40°C to 125°C	–7

Package Options and Maximum User I/Os

Table 6. Package Options and Maximum User I/Os in Intel^® MAX^® 10 Single Power Supply Devices
Device	Package
	Type	U169 169-pin UBGA	E144 144-pin EQFP
	Size	11 mm × 11 mm	22 mm × 22 mm
	Pitch	0.8 mm	0.5 mm
10M02S		130	101
10M04S		130	101
10M08S		130	101
10M16S		130	101
10M25S		—	101
10M40S		—	101
10M50S		—	101

Table 7. Package Options and Maximum User I/Os in Intel^® MAX^® 10 Dual Power Supply Devices
Device	Package
	Type	U324 324-pin UBGA	F256 256-pin FBGA	F484 484-pin FBGA
	Size	15 mm × 15 mm	17 mm × 17 mm	23 mm × 23 mm
	Ball Pitch	0.8 mm	1.0 mm	1.0 mm
10M02D		160	—	—
10M04D		246	178	—
10M08D		246	178	250
10M16D		246	178	320
10M25D		—	178	360
10M40D		—	178	360
10M50D		—	178	360

Device Ordering Codes

Figure 2. Automotive-Grade Ordering Information for Intel^® MAX^® 10 Devices

Cyclone V SoC Devices

Supported Automotive-Grade Devices

Table 8. Automotive-Grade in Cyclone^® V SoC DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
5CSEBA2U19A7N	5CSEBA2	484-pin UBGA	–40°C to 125°C	–7
5CSEBA2U23A7N	5CSEBA2	672-pin UBGA	–40°C to 125°C	–7
5CSEMA2U23A7N	5CSEMA2	672-pin UBGA	–40°C to 125°C	–7
5CSEBA4U19A7N	5CSEBA4	484-pin UBGA	–40°C to 125°C	–7
5CSEBA4U23A7N	5CSEBA4	672-pin UBGA	–40°C to 125°C	–7
5CSEMA4U23A7N	5CSEMA4	672-pin UBGA	–40°C to 125°C	–7
5CSEBA5U19A7N	5CSEBA5	484-pin UBGA	–40°C to 125°C	–7
5CSEBA5U23A7N	5CSEBA5	672-pin UBGA	–40°C to 125°C	–7
5CSEMA5U23A7N	5CSEMA5	672-pin UBGA	–40°C to 125°C	–7
5CSEMA5F31A7N	5CSEMA5	896-pin FBGA	–40°C to 125°C	–7
5CSEBA6U19A7N	5CSEBA6	484-pin UBGA	–40°C to 125°C	–7
5CSEBA6U23A7N	5CSEBA6	672-pin UBGA	–40°C to 125°C	–7
5CSEMA6U23A7N	5CSEMA6	672-pin UBGA	–40°C to 125°C	–7
5CSEMA6F31A7N	5CSEMA6	896-pin FBGA	–40°C to 125°C	–7
5CSXFC2C6U23A7N	5CSXFC2	672-pin UBGA	–40°C to 125°C	–7
5CSXFC4C6U23A7N	5CSXFC4	672-pin UBGA	–40°C to 125°C	–7
5CSXFC5C6U23A7N	5CSXFC5	672-pin UBGA	–40°C to 125°C	–7
5CSXFC6C6U23A7N	5CSXFC6	672-pin UBGA	–40°C to 125°C	–7
5CSXFC6D6F31A7N	5CSXFC6	896-pin FBGA	–40°C to 125°C	–7

Package Options and Maximum User I/Os

Table 9. Package Options and Maximum User I/Os in Cyclone^® V SE Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			5CSEA2	5CSEA4	5CSEA5	5CSEA6
			(25K LEs)	(40K LEs)	(85K LEs)	(110K LEs)
			FPGA I/Os / HPS I/Os
UBGA-484	0.8	19 x 19	66 / 151	66 / 151	66 / 151	66 / 151
UBGA-672	0.8	23 x 23	145 / 181	145 / 181	145 / 181	145 / 181
FBGA-896	1	31 x 31	—	—	288 / 181	288 / 181

Table 10. Package Options and Maximum User I/Os in Cyclone^® V SX Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			5CSXC2	5CSXC4	5CSXC5	5CSXC6
			(25K LEs)	(40K LEs)	(85K LEs)	(110K LEs)
			FPGA I/Os / HPS I/Os / XCVRs
UBGA-672	0.8	23 x 23	145 / 181 / 6	145 / 181 / 6	145 / 181 / 6	145 / 181 / 6
FBGA-896	1	31 x 31	—	—	—	288 / 181 / 9

Device Ordering Codes

Figure 3. Automotive-Grade Ordering Information for Cyclone^® V SE Devices

Figure 4. Automotive-Grade Ordering Information for Cyclone^® V SX Devices

Cyclone V Devices

Supported Automotive-Grade Devices

Table 11. Automotive-Grade in Cyclone^® V DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
5CEBA2F17A7N	5CEBA2	256-pin FBGA	–40°C to 125°C	–7
5CEFA2U19A7N	5CEFA2	484-pin UBGA	–40°C to 125°C	–7
5CEBA4F17A7N	5CEBA4	256-pin FBGA	–40°C to 125°C	–7
5CEFA4U19A7N	5CEFA4	484-pin UBGA	–40°C to 125°C	–7
5CEFA5U19A7N	5CEFA5	484-pin UBGA	–40°C to 125°C	–7
5CEFA7U19A7N	5CEFA7	484-pin UBGA	–40°C to 125°C	–7
5CEFA9U19A7N	5CEFA9	484-pin UBGA	–40°C to 125°C	–7
5CGXFC3B6U15A7N	5CGXFC3	324-pin UBGA	–40°C to 125°C	–7
5CGXFC3B6U19A7N	5CGXFC3	484-pin UBGA	–40°C to 125°C	–7
5CGXFC4C6U19A7N	5CGXFC4	484-pin UBGA	–40°C to 125°C	–7
5CGXFC5C6U19A7N	5CGXFC5	484-pin UBGA	–40°C to 125°C	–7
5CGXFC5C6F23A7N	5CGXFC5	484-pin FBGA	–40°C to 125°C	–7
5CGXFC7C6U19A7N	5CGXFC7	484-pin UBGA	–40°C to 125°C	–7
5CGXFC7D6F31A7N	5CGXFC7	896-pin FBGA	–40°C to 125°C	–7
5CGXFC9A6U19A7N	5CGXFC9	484-pin UBGA	–40°C to 125°C	–7

Package Options and Maximum User I/Os

Table 12. Package Options and Maximum User I/Os in Cyclone^® V E Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			5CEA2	5CEA4	5CEA5	5CEA7	5CEA9
			(25K LEs)	(49K LEs)	(77K LEs)	(149.5K LEs)	(301K LEs)
			I/Os
FBGA-256	1	17 x 17	128	128	—	—	—
UBGA-484	0.8	19 x 19	224	224	224	240	240

Table 13. Package Options and Maximum User I/Os in Cyclone^® V GX Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			5CGXC3	5CGXC4	5CGXC5	5CGXC7	5CGXC9
			(36K LEs)	(50K LEs)	(77K LEs)	(149.5K LEs)	(301K LEs)
			I/Os / XCVRs
UBGA-324	0.8	15 x 15	144 / 3	—	—	—	—
UBGA-484	0.8	19 x 19	208 / 3	224 / 6	224 / 6	240 / 6	240 / 5
FBGA-484	1	23 x 23	—	—	240 / 6	—	—
FBGA-896	1	31 x 31	—	—	—	480 / 9	—

Device Ordering Codes

Figure 5. Automotive-Grade Ordering Information for Cyclone^® V E Devices

Figure 6. Automotive-Grade Ordering Information for Cyclone^® V GX Devices

Cyclone IV Devices

Supported Automotive-Grade Devices

Table 14. Automotive-Grade in Cyclone^® IV DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EP4CE6F17A7N	EP4CE6	256-pin FBGA	–40°C to 125°C	–7
EP4CE6E22A7N	EP4CE6	144-pin EQFP	–40°C to 125°C	–7
EP4CE10F17A7N	EP4CE10	256-pin FBGA	–40°C to 125°C	–7
EP4CE10E22A7N	EP4CE10	144-pin EQFP	–40°C to 125°C	–7
EP4CE15F17A7N	EP4CE15	256-pin FBGA	–40°C to 125°C	–7
EP4CE15F23A7N	EP4CE15	484-pin FBGA	–40°C to 125°C	–7
EP4CE15U14A7N	EP4CE15	256-pin UBGA	–40°C to 125°C	–7
EP4CE22F17A7N	EP4CE22	256-pin FBGA	–40°C to 125°C	–7
EP4CE22E22A7N	EP4CE22	144-pin EQFP	–40°C to 125°C	–7
EP4CE22U14A7N	EP4CE22	256-pin UBGA	–40°C to 125°C	–7
EP4CE30F19A7N	EP4CE30	324-pin FBGA	–40°C to 125°C	–7
EP4CE30F23A7N	EP4CE30	484-pin FBGA	–40°C to 125°C	–7
EP4CE40F19A7N	EP4CE40	324-pin FBGA	–40°C to 125°C	–7
EP4CE40F23A7N	EP4CE40	484-pin FBGA	–40°C to 125°C	–7
EP4CE40U19A7N	EP4CE40	484-pin UBGA	–40°C to 125°C	–7
EP4CE55F23A7N	EP4CE55	484-pin FBGA	–40°C to 125°C	–7
EP4CGX15BF14A7N	EP4CGX15	169-pin FBGA	–40°C to 125°C	–7

Package Options and Maximum User I/Os

Table 15. Package Options and Maximum User I/Os in Cyclone^® IV E Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			EP4CE6 (6.3K LEs)	EP4CE10 (10.3K LEs)	EP4CE15 (15.4K LEs)	EP4CE22 (22.3K LEs)	EP4CE30 (28.8K LEs)	EP4CE40 (39.6K LEs)	EP4CE55 (55.9K LEs)
			I/Os
EQFP-144	0.5	22 x 22	91	91	—	79	—	—	—
UBGA-256	0.8	14 x 14	—	—	165	153	—	—	—
FBGA-256	1	17 x 17	179	179	165	153	—	—	—
UBGA-484	0.8	19 x 19	—	—	—	—	—	328	—
FBGA-324	1	19 x 19	—	—	—	—	193	193	—
FBGA-484	1	23 x 23	—	—	343	—	328	328	324

Table 16. Package Options and Maximum User I/Os in Cyclone^® IV GX Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			EP4CGX15 (14.4K LEs)
			I/Os
FBGA-169	1	14 x 14	72 / 2

Device Ordering Codes

Figure 7. Automotive-Grade Ordering Information for Cyclone^® IV E Devices

Figure 8. Automotive-Grade Ordering Information for Cyclone^® IV GX Devices

MAX V Devices

Supported Automotive-Grade Devices

Table 17. Automotive-Grade in MAX^® V DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
5M40ZE64A5N	5M40Z	64-pin EQFP	–40°C to 125°C	–5
5M80ZE64A5N	5M80Z	64-pin EQFP	–40°C to 125°C	–5
5M80ZT100A5N	5M80Z	100-pin TQFP	–40°C to 125°C	–5
5M160ZE64A5N	5M160Z	64-pin EQFP	–40°C to 125°C	–5
5M160ZT100A5N	5M160Z	100-pin TQFP	–40°C to 125°C	–5
5M240ZT100A5N	5M240Z	100-pin TQFP	–40°C to 125°C	–5
5M570ZT100A5N	5M570Z	100-pin TQFP	–40°C to 125°C	–5
5M1270ZF256A5N	5M1270Z	256-pin FBGA	–40°C to 125°C	–5
5M1270ZT144A5N	5M1270Z	144-pin TQFP	–40°C to 125°C	–5

Package Options and Maximum User I/Os

Table 18. Package Options and Maximum User I/Os in MAX^® V Devices
Package Type/ Pin Count	Ball Spacing (mm)	Dimensions (mm)	Product Line
			5M40Z (40K LEs)	5M80Z (80K LEs)	5M160Z (160K LEs)	5M240Z (240K LEs)	5M570Z (570K LEs)	5M1270Z (1270K LEs)
			I/Os
EQFP-64	0.5	7 x 7	54	54	54	—	—	—
TQFP-100	0.5	14 x 14	—	79	79	79	74	—
TQFP-144	0.5	20 x 20	—	—	—	—	—	114
FBGA-256	1	17 x 17	—	—	—	—	—	211

Device Ordering Codes

Figure 9. Automotive-Grade Ordering Information for MAX^® V Devices

MAX II Devices

Supported Automotive-Grade Devices

Table 19. Automotive-Grade in MAX^® II DevicesOther automotive-grade product line/package combinations or ordering codes might be available upon request. Consult your Intel sales representative to submit your request.
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EPM240T100A5N	EPM240	100-pin TQFP	–40°C to 125°C	–5
EPM570F100A5N	EPM570	100-pin FBGA	–40°C to 125°C	–5
EPM570T100A5N	EPM570	100-pin TQFP	–40°C to 125°C	–5
EPM570T144A5N	EPM570	144-pin TQFP	–40°C to 125°C	–5
EPM1270T144A5N	EPM1270	144-pin TQFP	–40°C to 125°C	–5
EPM1270F256A5N	EPM1270	256-pin FBGA	–40°C to 125°C	–5
EPM2210F256A5N	EPM2210	256-pin FBGA	–40°C to 125°C	–5
EPM2210F324A5N	EPM2210	324-pin FBGA	–40°C to 125°C	–5

Device Ordering Codes

Figure 10. Automotive-Grade Ordering Information for MAX^® II Devices

Cyclone III Devices (Legacy Support)

Supported Automotive-Grade Devices

Table 20. Automotive-Grade in Cyclone^® III Devices
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EP3C5E144A7N	EP3C5	144-pin EQFP	–40°C to 125°C	–7
EP3C5F256A7N	EP3C5	256-pin FBGA	–40°C to 125°C	–7
EP3C5U256A7N	EP3C5	256-pin UBGA	–40°C to 125°C	–7
EP3C10E144A7N	EP3C10	144-pin EQFP	–40°C to 125°C	–7
EP3C10F256A7N	EP3C10	256-pin FBGA	–40°C to 125°C	–7
EP3C10U256A7N	EP3C10	256-pin UBGA	–40°C to 125°C	–7
EP3C16E144A7N	EP3C16	144-pin EQFP	–40°C to 125°C	–7
EP3C16F256A7N	EP3C16	256-pin FBGA	–40°C to 125°C	–7
EP3C16U256A7N	EP3C16	256-pin UBGA	–40°C to 125°C	–7
EP3C16F484A7N	EP3C16	484-pin FBGA	–40°C to 125°C	–7
EP3C16U484A7N	EP3C16	484-pin UBGA	–40°C to 125°C	–7
EP3C25E144A7N	EP3C25	144-pin EQFP	–40°C to 125°C	–7
EP3C25F256A7N	EP3C25	256-pin FBGA	–40°C to 125°C	–7
EP3C25U256A7N	EP3C25	256-pin UBGA	–40°C to 125°C	–7
EP3C25F324A7N	EP3C25	324-pin FBGA	–40°C to 125°C	–7
EP3C40F324A7N	EP3C40	324-pin FBGA	–40°C to 125°C	–7
EP3C40F484A7N	EP3C40	484-pin FBGA	–40°C to 125°C	–7
EP3C40U484A7N	EP3C40	484-pin UBGA	–40°C to 125°C	–7

Device Ordering Codes

Figure 11. Automotive-Grade Ordering Information for Cyclone^® III Devices

Cyclone II Devices (Legacy Support)

Supported Automotive-Grade Devices

Table 21. Automotive-Grade in Cyclone^® II Devices
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EP2C5AT144A7N	EP2C5	144-pin TQFP	–40°C to 125°C	–7
EP2C5AF256A7N	EP2C5	256-pin FBGA	–40°C to 125°C	–7
EP2C8AF256A7N	EP2C8	256-pin FBGA	–40°C to 125°C	–7
EP2C15AF256A7N	EP2C15	256-pin FBGA	–40°C to 125°C	–7
EP2C15AF484A7N	EP2C15	484-pin FBGA	–40°C to 125°C	–7
EP2C20AF256A7N	EP2C20	256-pin FBGA	–40°C to 125°C	–7
EP2C20AF484A7N	EP2C20	484-pin FBGA	–40°C to 125°C	–7

Device Ordering Codes

Figure 12. Automotive-Grade Ordering Information for Cyclone^® II Devices

Cyclone Devices (Legacy Support)

Supported Automotive-Grade Devices

Table 22. Automotive-Grade in Cyclone^® Devices
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EP1C3T100A8N	EP1C3	100-pin TQFP	–40°C to 125°C	–8
EP1C3T144A8N	EP1C3	144-pin TQFP	–40°C to 125°C	–8

Device Ordering Codes

Figure 13. Automotive-Grade Ordering Information for Cyclone^® Devices

MAX 7000A Devices (Legacy Support)

Supported Automotive-Grade Devices

Table 23. Automotive-Grade in MAX^® 7000A Devices
Device Ordering Code	Device	Package	Junction Temperature Range	Speed Grade
EPM7032AETA44-10N	EPM7032AE	44-pin TQFP	–40°C to 130°C	–10
EPM7064AETA44-10N	EPM7064AE	44-pin TQFP	–40°C to 130°C	–10
EPM7064AETA100-10N	EPM7064AE	100-pin TQFP	–40°C to 130°C	–10
EPM7128AETA100-10N	EPM7128AE	100-pin TQFP	–40°C to 130°C	–10
EPM7128AETA144-10N	EPM7128AE	144-pin TQFP	–40°C to 130°C	–10

Device Ordering Codes

Figure 14. Automotive-Grade Ordering Information for MAX^® 7000A Devices

Intel Quartus Prime Software Support

The Intel^® Quartus^® Prime design software supports the automotive-grade devices in the automotive temperature range. The Intel^® Quartus^® Prime software provides a comprehensive environment for SoC design. It also includes HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis, Signal Tap II logic analyzer, and device configuration.

To target an automotive-grade device in your design in the Intel^® Quartus^® Prime software, follow these steps:

Click Assignments > Device. The Settings dialog box appears.
In the Family drop-down list, select your device.
Under Target device, select Specific device selected in ‘Available devices’ list.
In the Available devices list, select the appropriate ordering code.
Note: The Intel^® Quartus^® Prime software does not show the “N” suffix, which indicates a lead-free device. For example, the 5CGXFC3B6U15A7N device is shown only as 5CGXFC3B6U15A7.
Click OK.

The following automotive-grade devices are from the legacy device families and are not recommended for new automotive designs.

Cyclone^® III
Cyclone^® II
Cyclone^®
MAX^® 7000AE

Power Analysis and Estimation

Early Power Estimator

The Early Power Estimator (EPE) is a power estimation tool that helps you estimate the power consumption of your design during the system planning phase for proper power supply planning and consideration.

The EPE allows you to enter design information based on architectural features and calculates the power consumed by each architectural feature. Inputs to the EPE are environmental conditions and device resources (such as clock frequency, RAM blocks, and digital signal processing [DSP] blocks) that you expect to use in your design. The EPE then calculates the static and dynamic power, current estimates, and thermal analysis for the design.

You can either enter the design information manually into the spreadsheet or import a power estimator file of a fully or partially completed design from the Intel^® Quartus^® Prime software. After importing a file, you can edit some of the input parameters including V_CCINT, ambient temperature, airflow, clock frequency, and toggle percentage to suit your system requirements.

The value obtained from the EPE is only an estimation and should not be used as a specification. The accuracy of the EPE results depends on how close your input of the design information into the EPE resembles that of the final design.

For more information about the EPE, and how to generate and import the power estimator file, refer to the respective user guides.

Power Analyzer

The Power Analyzer tool in the Intel^® Quartus^® Prime software is a power analysis tool that helps you calculate your design power consumption accurately to ensure thermal and power supply budgets are not violated after your design is complete. The Power Analyzer tool requires your design to be synthesized and fitted to the target device. Availability of information such as design resources, how the design is placed and routed on the target device, and the I/O standards assigned to each I/O cell allow the Power Analyzer tool to provide accurate power estimation.

The process of using the Power Analyzer tool consists of the following three parts:

Specifying sources of input data
Specifying operating conditions
Running the Power Analyzer tool

The input data consists of the signal activities data (toggle rates and static probabilities) of the compiled design. Signal activity data can be derived from simulation results, user assignment in the Assignment Editor, user-defined default toggle rate, and vectorless estimation.

The operating conditions include device power characteristic, ambient and junction temperature, cooling solution, and board thermal model, all of which can be set in the Intel^® Quartus^® Prime software.

The Power Analyzer tool calculates the dynamic, static and I/O thermal power consumption, current consumed from voltage source, a summary of the signal activities used for analysis, and a confidence metric that reflects the overall quality of the data sources for the signal activities.

DC and Timing Specifications

The automotive-grade devices have the same values for the following specifications as published in the respective device datasheets :

Absolute maximum ratings
Recommended operating conditions
DC electrical characteristics
Timing specifications over the automotive temperature range

For the maximum power-up current (I_CCINT) required to power up an automotive-grade Cyclone^® device, use the value specified for the corresponding industrial-grade device.

The on-chip series termination (R_S OCT) specifications for the following automotive-grade devices are as follows:

Automotive-grade Cyclone^® III, Cyclone^® IV, Cyclone^® V, Cyclone^® V SoC, Intel^® Cyclone^® 10 LP, and Intel^® MAX^® 10 devices—same as the corresponding industrial-grade devices
Automotive-grade Cyclone^® II devices—same as the corresponding extended-temperature devices

The switching characteristics of the automotive-grade Cyclone^® III, Cyclone^® IV, Cyclone^® V, and Cyclone^® V SoC devices are the same as the devices with –8 speed grade as published in the respective device datasheets.

Pin-Out Information

For more information about the device pin-outs, refer to the respective device pin-out files.

Package and Board Layout Information

Intel provides information on package and PCB design guidelines.

Document Revision History for the Automotive-Grade Device Handbook

Document Version	Changes
2018.10.01	Updated the Intel Automotive-Grade Devices and Intel^® Automotive Qualifications sections. Updated Intel^® Cyclone^® 10 devices to Intel^® Cyclone^® 10 LP devices. Changed Enpirion to Intel^® Enpirion. Removed Intel^® Arria^® 10 devices. Removed Intel^® Arria^® 10 devices from the Intel Automotive-Grade Device Families table. Removed Intel^® Arria^® 10 devices from the Supported Automotive-Grade Devices section. Updated the description for Intel^® MAX^® 10 in the Intel Automotive-Grade Device Families table. Removed ES optional suffix from the Automotive-Grade Ordering Information for Intel^® Cyclone^® 10 LP Devices diagram. Updated the Automotive-Grade in Intel^® Enpirion^® Devices. Replaced Device column with Maximum Output Current column. Renamed the column Ambient Temperature Range as Ambient Operating Temperature Range. Added the Junction Temperature Range column. Removed the following devices from the Automotive-Grade in Intel^® MAX^® 10 Devices table. 10M02SCM153A7G 10M02DCV36A7G 10M04SCM153A7G 10M04DAU324A7G 10M08DCV81A7G 10M08DFV81A7G 10M08SCM153A7G 10M08DAU324A7G 10M08DCF484A7G 10M08DAF484A7G 10M16DAU324A7G 10M16DAF484A7G 10M25DCF484A7G 10M25DAF484A7G 10M25DCF672A7G 10M25DAF672A7G 10M40DAF256A7G 10M40DCF484A7G 10M40DAF484A7G 10M40DCF672A7G 10M40DAF672A7G 10M50DAF256A7G 10M50DCF484A7G 10M50DAF484A7G 10M50DCF672A7G 10M50DAF672A7G Removed M153 package in the Package Options and Maximum User I/Os in Intel^® MAX^® 10 Single Power Supply Devices table. Removed V36, V81, and F672 packages in the Package Options and Maximum User I/Os in Intel^® MAX^® 10 Dual Power Supply Devices table. Updated the Automotive-Grade Ordering Information for Intel^® MAX^® 10 Devices diagram. Removed V and M package types. Removed WLCSP (36 and 81), MBGA (153), and FBGA (672) package types. Removed DF feature option. Removed notes from the following tables: Package Options and Maximum User I/Os in Cyclone^® V SE Devices Package Options and Maximum User I/Os in Cyclone^® V SX Devices Removed the resource count for FBGA-896 package in 5CSXC5 device. Updated the Automotive-Grade in Cyclone^® V Devices table. Added 5CGXFC7D6F31A7N Removed Cyclone^® V GT devices: 5CGTFD5C5U19A7N, 5CGTFD7C5U19A7N, and 5CGTFD9A5U19A7N Removed resources for packages that are not currently available in automotive-grade for Cyclone^® V E and GX devices. Updated the description for embedded hard IPs in the following diagrams: Automotive-Grade Ordering Information for Cyclone^® V E Devices Automotive-Grade Ordering Information for Cyclone^® V GX Devices Removed QFN-148 package in the Package Options and Maximum User I/Os in Cyclone^® IV GX Devices table. Removed resources for packages that are not currently available in automotive-grade for Cyclone^® IV E and GX devices. Updated the Package Options and Maximum User I/Os in MAX^® V Devices table. Corrected QFP-100 to TQFP-100 and DFP-144 to TQFP-144. Removed MBGA-64, MBGA-68, MBGA-100, and FBGA-324 packages. Removed resources for packages that are not currently available in automotive-grade. Updated the description for the legacy device families in the Intel^® Quartus^® Prime Software Support section. Added Intel^® Cyclone^® 10 LP and Intel^® MAX^® 10 devices in the DC and Timing Specifications section.

Document Version

Changes

2018.10.01

Updated the Intel Automotive-Grade Devices and Intel^® Automotive Qualifications sections.
Updated Intel^® Cyclone^® 10 devices to Intel^® Cyclone^® 10 LP devices.
Changed Enpirion to Intel^® Enpirion.
Removed Intel^® Arria^® 10 devices.
- Removed Intel^® Arria^® 10 devices from the Intel Automotive-Grade Device Families table.
- Removed Intel^® Arria^® 10 devices from the Supported Automotive-Grade Devices section.
Updated the description for Intel^® MAX^® 10 in the Intel Automotive-Grade Device Families table.
Removed ES optional suffix from the Automotive-Grade Ordering Information for Intel^® Cyclone^® 10 LP Devices diagram.
Updated the Automotive-Grade in Intel^® Enpirion^® Devices.
- Replaced Device column with Maximum Output Current column.
- Renamed the column Ambient Temperature Range as Ambient Operating Temperature Range.
- Added the Junction Temperature Range column.
Removed the following devices from the Automotive-Grade in Intel^® MAX^® 10 Devices table.
- 10M02SCM153A7G
- 10M02DCV36A7G
- 10M04SCM153A7G
- 10M04DAU324A7G
- 10M08DCV81A7G
- 10M08DFV81A7G
- 10M08SCM153A7G
- 10M08DAU324A7G
- 10M08DCF484A7G
- 10M08DAF484A7G
- 10M16DAU324A7G
- 10M16DAF484A7G
- 10M25DCF484A7G
- 10M25DAF484A7G
- 10M25DCF672A7G
- 10M25DAF672A7G
- 10M40DAF256A7G
- 10M40DCF484A7G
- 10M40DAF484A7G
- 10M40DCF672A7G
- 10M40DAF672A7G
- 10M50DAF256A7G
- 10M50DCF484A7G
- 10M50DAF484A7G
- 10M50DCF672A7G
- 10M50DAF672A7G
Removed M153 package in the Package Options and Maximum User I/Os in Intel^® MAX^® 10 Single Power Supply Devices table.
Removed V36, V81, and F672 packages in the Package Options and Maximum User I/Os in Intel^® MAX^® 10 Dual Power Supply Devices table.
Updated the Automotive-Grade Ordering Information for Intel^® MAX^® 10 Devices diagram.
- Removed V and M package types.
- Removed WLCSP (36 and 81), MBGA (153), and FBGA (672) package types.
- Removed DF feature option.
Removed notes from the following tables:
- Package Options and Maximum User I/Os in Cyclone^® V SE Devices
- Package Options and Maximum User I/Os in Cyclone^® V SX Devices
Removed the resource count for FBGA-896 package in 5CSXC5 device.
Updated the Automotive-Grade in Cyclone^® V Devices table.
- Added 5CGXFC7D6F31A7N
- Removed Cyclone^® V GT devices: 5CGTFD5C5U19A7N, 5CGTFD7C5U19A7N, and 5CGTFD9A5U19A7N
Removed resources for packages that are not currently available in automotive-grade for Cyclone^® V E and GX devices.
Updated the description for embedded hard IPs in the following diagrams:
- Automotive-Grade Ordering Information for Cyclone^® V E Devices
- Automotive-Grade Ordering Information for Cyclone^® V GX Devices
Removed QFN-148 package in the Package Options and Maximum User I/Os in Cyclone^® IV GX Devices table.
Removed resources for packages that are not currently available in automotive-grade for Cyclone^® IV E and GX devices.
Updated the Package Options and Maximum User I/Os in MAX^® V Devices table.
- Corrected QFP-100 to TQFP-100 and DFP-144 to TQFP-144.
- Removed MBGA-64, MBGA-68, MBGA-100, and FBGA-324 packages.
- Removed resources for packages that are not currently available in automotive-grade.
Updated the description for the legacy device families in the Intel^® Quartus^® Prime Software Support section.
Added Intel^® Cyclone^® 10 LP and Intel^® MAX^® 10 devices in the DC and Timing Specifications section.

Date	Version	Changes
December 2017	2017.12.15	Removed Intel^® Cyclone^® 10 GX devices. Removed Intel^® Cyclone^® 10 GX devices from Automotive-Grade in Intel^® Cyclone^® 10 GX Devices table. Removed Package Options and Maximum User I/Os in Intel^® Cyclone^® 10 GX Devices table. Removed Automotive-Grade Ordering Information for Intel^® Cyclone^® 10 GX Devices diagram. Intel rebranding.
July 2017	2017.07.13	Corrected the automotive temperature range in the figure showing the available options for the Intel^® Arria^® 10 GX devices from "-40°C to 100°C" to "-40°C to 125°C".
May 2017	2017.05.08	Updated links. Rebranded as Intel.
February 2017	2017.02.13	Added Intel^® Arria^® 10, Cyclone^® 10, and Intel^® Enpirion^® devices. Removed PowerPlay text from tool name.
May 2016	2016.05.03	Updated the Overview topic to remove ASIC devices. Updated footnote in Automotive-Grade in MAX 10 Devices table. Added new automotive-grade devices for the following device families: MAX 10—10M08SAU169A7G Cyclone^® V SoC—5CSXFC6D6F31A7N Cyclone^® IV—EP4CE15U14A7N, EP4CE22U14A7N, and EP4CE55F23A7N Removed the following devices from Automotive-Grade in MAX 10 Devices table. 10M04SFE144A7G 10M04SFU169A7G 10M04DFF256A7G 10M04DFU324A7G 10M08SFE144A7G 10M08SFU169A7G 10M08DFF256A7G 10M08DFU324A7G 10M08DFF484A7G 10M16SFE144A7G 10M16SFU169A7G 10M16DFF256A7G 10M16DFU324A7G 10M16DFF484A7G 10M25SFE144A7G 10M25DFF256A7G 10M25DFF484A7G 10M25DFF672A7G 10M40SFE144A7G 10M40DFF256A7G 10M40DFF484A7G 10M40DFF672A7G 10M50SFE144A7G 10M50DFF256A7G 10M50DFF484A7G 10M50DFF672A7G Updated the Package Options and Maximum User I/Os in Cyclone^® V GX Devices table. Updated the LE count for 5CGXC3 from 31.5K LEs to 36K LEs. Added I/Os / XCVRs count for UBGA-484 package in 5CGXC9 device. Updated the Package Options and Maximum User I/Os in Cyclone^® V GT Devices table. Added I/Os / XCVRs count for UBGA-484 package in 5CGTD9 device. Updated the following device ordering codes diagrams: Automotive-Grade Ordering Information for MAX 10 Devices Automotive-Grade Ordering Information for Cyclone^® IV E Devices Automotive-Grade Ordering Information for Cyclone^® V SE Devices Automotive-Grade Ordering Information for Cyclone^® V SX Devices Changed instances of Quartus II to Quartus Prime.
September 2014	2014.09.22	Added MAX^® 10 devices. Removed HardCopy^® II devices. Updated the Quartus^® II software support versions for the legacy device families. Cyclone^® III—Version 8.0 to 13.1 Cyclone^® II—Version 7.2 SP1 to 13.0 Cyclone^®—Version 7.2 SP1 to 13.0 MAX^® 7000AE—Version 7.2 SP1 to 13.0 Added new automotive-grade devices for the following device families: Cyclone^® V—5CGXFC5C6F23A7N Cyclone^® IV—EP4CE40U19A7N and EP4CGX15BF14A7N MAX^® V—5M40ZE64A5N, 5M80ZT100A5N, and 5M160ZT100A5N Added Cyclone^® IV GX ordering information diagram. Updated HPS I/O count for Cyclone^® V SE and SX devices.
September 2013	3.4	Updated Table 3–2, Table 3–3, and Table 3–4. Updated Figure 3–1, Figure 3–2, and Figure 3–3.
June 2013	3.3	Updated Table 3–1 and Table 3–5.
May 2013	3.2	Updated Figure 3–2, Figure 3–3, Figure 4–1, and Figure 5–1. Updated Table 3–1, Table 3–5, Table 4–2, Table 5–1, and Table 5–3.
February 2013	3.1	Updated Table 2-2, Table 2-3, Table 3–2, Table 3–3, Table 3–4, Table 4–2, Table 4–3, and Table 5–2.
January 2013	3.0	Added Cyclone V and Cyclone V SoC devices. Added Table 4–2, Table 4–3, and Table 5–2. Updated Table 4–1, Table 4–4, Table 6–1, and Table 6–2. Updated Figure 4–1. Listed the following devices under legacy support: Cyclone III Cyclone II Cyclone MAX 7000A
May 2011	2.0	Added MAX V devices. Updated part number for Cyclone III, Cyclone IV, and HardCopy II devices. Template conversion. Minor text edits.
March 2010	1.2	Added Cyclone IV devices. Removed Referenced Documents section.
October 2008	1.1	Updated DC and Timing Specifications section. Converted to new template.
February 2008	1.0	Initial release.