External Memory Interfaces Intel Stratix 10 FPGA IP User Guide

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UG-S10EMI | 2018.08.08

External Memory Interfaces Intel Stratix 10 FPGA IP Introduction

Intel's fast, efficient, and low-latency external memory interface (EMIF) intellectual property (IP) cores easily interface with today's higher speed memory devices.

You can easily implement the EMIF IP core functions through the Intel^® Quartus^® Prime software. The Intel^® Quartus^® Prime software also provides external memory toolkits that help you test the implementation of the IP in the FPGA.

The External Memory Interfaces Intel^® Stratix^® 10 FPGA IP (referred to hereafter as the Intel^® Stratix^® 10 EMIF IP) provides the following components:

A physical layer interface (PHY) which builds the data path and manages timing transfers between the FPGA and the memory device.
A memory controller which implements all the memory commands and protocol-level requirements.

For information on the maximum speeds supported by the external memory interface IP, refer to the External Memory Interface Spec Estimator.

Intel^® Stratix^® 10 EMIF IP Protocol and Feature Support

Supports DDR4, DDR3, and DDR3L protocols with hard memory controller and hard PHY.
Supports QDR-IV, QDR II + Xtreme, QDR II +, and QDR II using soft memory controller and hard PHY.
Supports RLDRAM 3 using third-party soft controller.
Supports UDIMM, RDIMM, LRDIMM and SODIMM memory devices.
Supports 3D Stacked Die for DDR4 devices.
Supports up to 4 physical ranks.
Supports Ping Pong PHY mode, allowing two memory controllers to share command, address, and control pins.
Supports error correction code (ECC) for both hard memory controller and soft memory controller.

Intel Stratix 10 EMIF IP Design Flow

Intel recommends creating an example top-level file with the desired pin outs and all interface IPs instantiated. This enables the Intel^® Quartus^® Prime software to validate the design and resource allocation before PCB and schematic sign off.

The following figure shows the design flow to provide the fastest out-of-the-box experience with the EMIF IP.

Figure 1. EMIF IP Design Flow

Intel Stratix 10 EMIF IP Design Checklist

Refer to the following checklist as a quick reference for information about each step in the EMIF design flow.

Table 1. EMIF Design Checklist
Design Step	Description	Resources
Select an FPGA	Not all Intel FPGAs support all memory types and configurations. To help with the FPGA selection process, refer to these resources.	Intel FPGA Product Selector External Memory Interface Device Selector External Memory Interface Spec Estimator
Parameterize the IP	Correct IP parameterization is important for good EMIF IP operation. These resources define the memory parameters during IP generation.	DDR3 Parameter Descriptions DDR4 Parameter Descriptions QDR II/II+/II+ Xtreme Parameter Descriptions QDR-IV Parameter Descriptions RLDRAM 3 Parameter Descriptions
Generate initial IP and example design	After you have parameterized the EMIF IP, you can generate the IP, along with an optional example design. Refer to the Quick-Start Guide for a walkthrough of this process.	Design Example Quick Start Guide Design Example Description
Perform functional simulation	Simulation of the EMIF design helps to determine correct operation. These resources explain how to perform simulation and what differences exist between simulation and hardware implementation.	Design Example Quick Start Guide Simulating Memory IP
Make pin assignments	For guidance on pin placement, refer to these resources.	DDR3 Parameter Descriptions DDR4 Parameter Descriptions QDR II/II+/II+ Xtreme Parameter Descriptions QDR-IV Parameter Descriptions RLDRAM 3 Parameter Descriptions
Perform board simulation	Board simulation helps determine optimal settings for signal integrity, drive strength, as well as sufficient timing margins and eye openings. For guidance on board simulation, refer to these resources.	DDR3 Board Design Guidelines DDR4 Board Design Guidelines QDR II/II+/II+ Xtreme Board Design Guidelines QDR-IV Board Design Guidelines RLDRAM 3 Board Design Guidelines Board Skew Parameter Tool
Update board parameters in the IP	Board simulation is important to determine optimal settings for signal integrity, drive strength, and sufficient timing margins and eye openings. For guidance on board simulation refer to the mentioned resources.	DDR3 Board Design Guidelines DDR4 Board Design Guidelines QDR II/II+/II+ Xtreme Board Design Guidelines QDR-IV Board Design Guidelines RLDRAM 3 Board Design Guidelines Board Skew Parameter Tool
Verify timing closure	For information regarding compilation, system-level timing closure and timing reports refer to the Timing Closure section of this User Guide.	Timing Closure
Run the design on hardware	For instructions on how to program a FPGA refer to the Quick-Start Guide section of this User Guide.	Design Example Quick Start Guide
Debug issues with preceding steps	Operational problems can generally be attributed to one of the following: interface configuration, pin/resource planning, signal integrity, or timing. These resources contain information on typical debug procedures and available tools to help diagnose hardware issues.	Debugging External Memory Interfaces Support Center

Intel Stratix 10 EMIF IP Product Architecture

This chapter describes the Intel^® Stratix^® 10 product architecture.

Intel Stratix 10 EMIF Architecture: Introduction

The Intel^® Stratix^® 10 EMIF architecture contains many new hardware features designed to meet the high-speed requirements of emerging memory protocols, while consuming the smallest amount of core logic area and power.

The following are key hardware features of the Intel^® Stratix^® 10 EMIF architecture:

Hard Sequencer

The sequencer employs a hard Nios II processor, and can perform memory calibration for a wide range of protocols. You can share the sequencer among multiple memory interfaces of the same or different protocols.

Note: You cannot use the hard Nios II processor for any user applications after calibration is complete.

Hard PHY

The PHY circuitry in Intel^® Stratix^® 10 devices is hardened in the silicon, which simplifies the challenges of achieving timing closure and minimizing power consumption.

Hard Memory Controller

The hard memory controller reduces latency and minimizes core logic consumption in the external memory interface. The hard memory controller supports the DDR3 and DDR4 memory protocols.

PHY-Only Mode

Protocols that use a hard controller (DDR3, DDR4, and RLDRAM 3), provide a PHY-only option, which generates only the PHY and sequencer, but not the controller. This PHY-only mode provides a mechanism by which to integrate your own custom soft controller.

High-Speed PHY Clock Tree

Dedicated high speed PHY clock networks clock the I/O buffers in Intel^® Stratix^® 10 EMIF IP. The PHY clock trees exhibit low jitter and low duty cycle distortion, maximizing the data valid window.

Automatic Clock Phase Alignment

Automatic clock phase alignment circuitry dynamically adjusts the clock phase of core clock networks to match the clock phase of the PHY clock networks. The clock phase alignment circuitry minimizes clock skew that can complicate timing closure in transfers between the FPGA core and the periphery.

Resource Sharing

The Intel^® Stratix^® 10 architecture simplifies resource sharing between memory interfaces. Resources such as the OCT calibration block, PLL reference clock pin, and core clock can be shared. The hard Nios processor in the I/O subsystem manager (I/O SSM) must be shared across all interfaces in a column.

Intel Stratix 10 EMIF Architecture: I/O Subsystem

Depending on the Intel^® Stratix^® 10 device, the I/O subsystem consists of either two or three columns inside the core.

Figure 2. Stratix 10 I/O Subsystem

The I/O subsystem provides the following features:

General-purpose I/O registers and I/O buffers
On-chip termination control (OCT)
I/O PLLs for external memory interfaces and user logic
Low-voltage differential signaling (LVDS)
External memory interface components, as follows:
- Hard memory controller
- Hard PHY
- Hard Nios processor and calibration logic
- DLL

Intel Stratix 10 EMIF Architecture: I/O Column

Most Intel^® Stratix^® 10 devices have two I/O columns (some can have three), which contain the hardware related to external memory interfaces.

Each I/O column contains the following major parts:

A hardened Nios processor with dedicated memory. This Nios block is referred to as the I/O SSM.
Up to 13 I/O banks. Each I/O bank contains the hardware necessary for an external memory interface.

Figure 3. I/O Column

Intel Stratix 10 EMIF Architecture: I/O SSM

Each column includes one I/O subsystem manager (I/O SSM), which contains a hardened Nios II processor with dedicated memory. The I/O SSM is responsible for calibration of all the EMIFs in the column.

The I/O SSM includes dedicated memory which stores both the calibration algorithm and calibration run-time data. The hardened Nios II processor and the dedicated memory can be used only by an external memory interface, and cannot be employed for any other use. The I/O SSM can interface with soft logic, such as the debug toolkit, via an Avalon-MM bus.

The I/O SSM is clocked by an on-die oscillator, and therefore does not consume a PLL.

Intel Stratix 10 EMIF Architecture: I/O Bank

A single I/O bank contains all the hardware needed to build an external memory interface. Each I/O column contains up to 13 I/O banks; the exact number of banks depends on device size and pin package. You can make a wider interface by connecting multiple banks together.

Each I/O bank resides in an I/O column, and contains the following components:

Hard memory controller
Sequencer components
PLL and PHY clock trees
DLL
Input DQS clock trees
48 pins, organized into four I/O lanes of 12 pins each

Figure 4. I/O Bank Architecture in Intel^® Stratix^® 10 Devices

I/O Bank Usage

The pins in an I/O bank can serve as address and command pins, data pins, or clock and strobe pins for an external memory interface. You can implement a narrow interface, such as a DDR3 or DDR4 x8 interface, with only a single I/O bank. A wider interface of up to 72 bits can be implemented by configuring multiple adjacent banks in a multi-bank interface. Any pins in a bank which are not used by the EMIF IP can serve as general-purpose I/O pins of uncalibrated I/O standard with the same voltage settings.

Every I/O bank includes a hard memory controller which you can configure for DDR3 or DDR4. In a multi-bank interface, only the controller of one bank is active; controllers in the remaining banks are turned off to conserve power.

To use a multi-bank Intel^® Stratix^® 10 EMIF interface, you must observe the following rules:

Designate one bank as the address and command bank.
The address and command bank must contain all the address and command pins.
The locations of individual address and command pins within the address and command bank must adhere to the pin map defined in the pin table— regardless of whether you use the hard memory controller or not.
If you do use the hard memory controller, the address and command bank contains the active hard controller.

All the I/O banks in a column are capable of functioning as the address and command bank. However, for minimal latency, you should select the center-most bank of the interface as the address and command bank.

Intel Stratix 10 EMIF Architecture: I/O Lane

An I/O bank contains 48 I/O pins, organized into four I/O lanes of 12 pins each.

Each I/O lane can implement one x8/x9 read capture group (DQS group), with two pins functioning as the read capture clock/strobe pair (DQS/DQS#), and up to 10 pins functioning as data pins (DQ and DM pins). To implement x18 and x36 groups, you can use multiple lanes within the same bank.

It is also possible to implement a pair of x4 groups in a lane. In this case, four pins function as clock/strobe pair, and 8 pins function as data pins. DM is not available for x4 groups. There must be an even number of x4 groups for each interface.

For x4 groups, DQS0 and DQS1 must be placed in the same I/O lane as a pair. Similarly, DQS2 and DQS3 must be paired. In general, DQS(x) and DQS(x+1) must be paired in the same I/O lane.

Table 2. Lanes Used Per Group
Group Size	Number of Lanes Used	Maximum Number of Data Pins per Group
x8 / x9	1	10
x18	2	22
x36	4	46
pair of x4	1	4 per group, 8 per lane

Figure 5. x4 Group

Figure 6. x8 Group

Figure 7. x18 Group

Figure 8. x36 Group

Intel Stratix 10 EMIF Architecture: Input DQS Clock Tree

The input DQS clock tree is a balanced clock network that distributes the read capture clock (such as CQ/CQ# or QK/QK# which are free-running read clocks) and strobe (such as DQS/DQS#) from the external memory device to the read capture registers inside the I/Os.

You can configure an input DQS clock tree in x4 mode, x8/x9 mode, x18 mode, or x36 mode.

Within every bank, only certain physical pins at specific locations can drive the input DQS clock trees. The pin locations that can drive the input DQS clock trees vary, depending on the size of the group.

Table 3. Pins Usable as Read Capture Clock / Strobe Pair
Group Size	Index of Lanes Spanned by Clock Tree	In-Bank Index of Pins Usable as Read Capture Clock / Strobe Pair
Group Size	Index of Lanes Spanned by Clock Tree	Positive Leg	Negative Leg
x4	0A	4	5
x4	0B	8	9
x4	1A	16	17
x4	1B	20	21
x4	2A	28	29
x4	2B	32	33
x4	3A	40	41
x4	3B	44	45
x8 / x9	0	4	5
x8 / x9	1	16	17
x8 / x9	2	28	29
x8 / x9	3	40	41
x18	0, 1	12	13
x18	2, 3	36	37
x36	0, 1, 2, 3	20	21

Intel Stratix 10 EMIF Architecture: PHY Clock Tree

Dedicated high-speed clock networks drive I/Os in Intel^® Stratix^® 10 EMIF. Each PHY clock network spans only one bank.

The relatively short span of the PHY clock trees results in low jitter and low duty-cycle distortion, maximizing the data valid window.

The PHY clock tree in Intel^® Stratix^® 10 devices can run as fast as 1.3 GHz. All Intel^® Stratix^® 10 external memory interfaces use the PHY clock trees.

Intel Stratix 10 EMIF Architecture: PLL Reference Clock Networks

Each I/O bank includes a PLL that can drive the PHY clock trees of that bank, through dedicated connections. In addition to supporting EMIF-specific functions, such PLLs can also serve as general-purpose PLLs for user logic.

Intel^® Stratix^® 10 external memory interfaces that span multiple banks use the PLL in each bank. The Intel^® Stratix^® 10 architecture allows for relatively short PHY clock networks, reducing jitter and duty-cycle distortion.

The following mechanisms ensure that the clock outputs of individual PLLs in a multi-bank interface remain in phase:

A single PLL reference clock source feeds all PLLs. The reference clock signal reaches the PLLs by a balanced PLL reference clock tree. The Intel^® Quartus^® Prime software automatically configures the PLL reference clock tree so that it spans the correct number of banks.
The EMIF IP sets the PLL M and N values appropriately to maintain synchronization among the clock dividers across the PLLs. This requirement restricts the legal PLL reference clock frequencies for a given memory interface frequency and clock rate. The Stratix 10 EMIF IP parameter editor automatically calculates and displays the set of legal PLL reference clock frequencies. If you plan to use an on-board oscillator, you must ensure that its frequency matches the PLL reference clock frequency that you select from the displayed list. The correct M and N values of the PLLs are set automatically based on the PLL reference clock frequency that you select.

Note: The PLL reference clock pin may be placed in the address and command I/O bank or in a data I/O bank, there is no implication on timing. However, for debug flexibility, it is recommended to place the PLL reference clock in the address and command I/O bank.

Figure 9. PLL Balanced Reference Clock Tree

Intel Stratix 10 EMIF Architecture: Clock Phase Alignment

In Intel^® Stratix^® 10 external memory interfaces, a global clock network clocks registers inside the FPGA core, and the PHY clock network clocks registers inside the FPGA periphery. Clock phase alignment circuitry employs negative feedback to dynamically adjust the phase of the core clock signal to match the phase of the PHY clock signal.

The clock phase alignment feature effectively eliminates the clock skew effect in all transfers between the core and the periphery, facilitating timing closure. All Stratix 10 external memory interfaces employ clock phase alignment circuitry.

Figure 10. Clock Phase Alignment Illustration

Figure 11. Effect of Clock Phase Alignment

Intel Stratix 10 EMIF Sequencer

The Intel^® Stratix^® 10 EMIF sequencer is fully hardened in silicon, with executable code to handle protocols and topologies. Hardened RAM contains the calibration algorithm.

The Intel^® Stratix^® 10 EMIF sequencer is responsible for the following operations:

Initializes memory devices.
Calibrates the external memory interface.
Governs the hand-off of control to the memory controller.
Handles recalibration requests and debug requests.
Handles all supported protocols and configurations.

Figure 12. Intel^® Stratix^® 10 EMIF Sequencer Operation

Intel Stratix 10 EMIF DQS Tracking

DQS tracking tracks read capture clock/strobe timing variation over time, for improved read capture I/O timing. This feature takes sufficient samples to confirm the variation and adjust the DQS-enable position to maintain adequate operating margins.

DQS tracking is enabled for QDRII/II+/II+ Xtreme, QDR-IV, and RLDRAM 3 protocols; it is not available for DDR3 and DDR4 protocols. For QDRII/II+/II+ Xtreme, QDR-IV, and RLDRAM 3, DQS tracking does not need a specific command to initiate tracking, because the read capture clock/strobe is free running. Tracking happens constantly and automatically when the circuitry is enabled.

Intel Stratix 10 EMIF Calibration

The calibration process compensates for skews and delays in the external memory interface.

The calibration process enables the system to compensate for the effects of factors such as the following:

Timing and electrical constraints, such as setup/hold time and V_ref variations.
Circuit board and package factors, such as skew, fly-by effects, and manufacturing variations.
Environmental uncertainties, such as variations in voltage and temperature.
The demanding effects of small margins associated with high-speed operation.

For a given external memory interface, calibration occurs in parallel for all DQS groups and I/O banks. For an I/O column containing multiple external memory interfaces, there is no particular calibration order in relation to the interfaces; however, for a given SRAM Object File (.sof), calibration will always occur in the same order.

Note: The calibration process is intended to maximize margins for robust EMIF operation; it cannot compensate for an inadequate PCB layout.

Intel Stratix 10 Calibration Stages

At a high level, the calibration routine consists of address and command calibration, read calibration, and write calibration.

The stages of calibration vary, depending on the protocol of the external memory interface.

Table 5. Calibration Stages by Protocol
Stage	DDR4	DDR3	RLDRAM 3	QDR-IV	QDR II/II+
Address and command
Leveling	Yes	Yes	—	—	—
Deskew	Yes	—	—	Yes	—
Read
DQSen	Yes	Yes	Yes	Yes	Yes
Deskew	Yes	Yes	Yes	Yes	Yes
VREF-In	Yes	—	—	Yes	—
LFIFO	Yes	Yes	Yes	Yes	Yes
Write
Leveling	Yes	Yes	Yes	Yes	—
Deskew	Yes	Yes	Yes	Yes	Yes
VREF-Out	Yes	—	—	—	—

Intel Stratix 10 Calibration Stages Descriptions

The various stages of calibration perform address and command calibration, read calibration, and write calibration.

Address and Command Calibration

The goal of address and command calibration is to delay address and command signals as necessary to optimize the address and command window. This stage is not available for all protocols, and cannot compensate for a poorly implemented board design.

Address and command calibration consists of the following parts:

Leveling calibration— Centers the CS# signal and the entire address and command bus, relative to the CK clock. This operation is available for DDR3 and DDR4 interfaces only.
Deskew calibration— Provides per-bit deskew for the address and command bus (except CS#), relative to the CK clock. This operation is available for DDR4 and QDR-IV interfaces only.

Read Calibration

Read calibration consists of the following parts:

DQSen calibration— Calibrates the timing of the read capture clock gating and ungating, so that the PHY can gate and ungate the read clock at precisely the correct time—if too early or too late, data corruption can occur. The algorithm for this stage varies, depending on the memory protocol.
Deskew calibration— Performs per-bit deskew of read data relative to the read strobe or clock.
VREF-In calibration— Calibrates the VREF level at the FPGA.
LFIFO calibration: Normalizes differences in read delays between groups due to fly-by, skews, and other variables and uncertainties.

Write Calibration

Write calibration consists of the following parts:

Leveling calibration— Aligns the write strobe and clock to the memory clock, to compensate for skews, especially those associated with fly-by topology. The algorithm for this stage varies, depending on the memory protocol.
Deskew calibration— Performs per-bit deskew of write data relative to the write strobe and clock.
VREF-Out calibration— Calibrates the VREF level at the memory device.

Intel Stratix 10 Calibration Flowchart

The following flowchart illustrates the Intel^® Stratix^® 10 calibration flow.

Figure 13. Calibration Flowchart

Intel Stratix 10 Calibration Algorithms

The calibration algorithms sometimes vary, depending on the targeted memory protocol.

Address and Command Calibration

Address and command calibration consists of the following parts:

Leveling calibration— (DDR3 and DDR4 only) Toggles the CS# and CAS# signals to send read commands while keeping other address and command signals constant. The algorithm monitors for incoming DQS signals, and if the DQS signal toggles, it indicates that the read commands have been accepted. The algorithm then repeats using different delay values, to find the optimal window.
Deskew calibration— (DDR4 and QDR-IV only)
- (DDR4) Uses the DDR4 address and command parity feature. The FPGA sends the address and command parity bit, and the DDR4 memory device responds with an alert signal if the parity bit is detected. The alert signal from the memory device tells the FPGA that the parity bit was received.
  Deskew calibration requires use of the PAR/ALERT# pins, so you should not omit these pins from your design. One limitation of deskew calibration is that it cannot deskew ODT and CKE pins.
- (QDR-IV) Uses the QDR-IV loopback mode. The FPGA sends address and command signals, and the memory device sends back the address and command signals which it captures, via the read data pins. The returned signals indicate to the FPGA what the memory device has captured. Deskew calibration can deskew all synchronous address and command signals.
  Note: For more information about loopback mode, refer to your QDR-IV memory device data sheet.

Read Calibration

DQSen calibration— (DDR3, DDR4, RLDRAMx and QDRx) DQSen calibration occurs before Read deskew, therefore only a single DQ bit is required to pass in order to achieve a successful read pass.
- (DDR3 and DDR4) The DQSen calibration algorithm searches the DQS preamble using a hardware state machine. The algorithm sends many back-to-back reads with a one clock cycle gap between. The hardware state machine searches for the DQS gap while sweeping DQSen delay values. the algorithm then increments the VFIFO value, and repeats the process until a pattern is found. The process is then repeated for all other read DQS groups.
- (RLDRAMx and QDRx) The DQSen calibration algorithm does not use a hardware state machine; rather, it calibrates cycle-level delays using software and subcycle delays using DQS tracking hardware. The algorithm requires good data in memory, and therefore relies on guaranteed writes. (Writing a burst of 0s to one location, and a burst of 1s to another; back-to-back reads from these two locations are used for read calibration.)
  The algorithm enables DQS tracking to calibrate the phase component of DQS enable, and then issues a guaranteed write, followed by back-to-back reads. The algorithm sweeps DQSen values cycle by cycle until the read operation succeeds. The process is then repeated for all other read groups.
Deskew calibration— Read deskew calibration is performed before write leveling, and must be performed at least twice: once before write calibration, using simple data patterns from guaranteed writes, and again after write calibration, using complex data patterns.
The deskew calibration algorithm performs a guaranteed write, and then sweeps dqs_in delay values from low to high, to find the right edge of the read window. The algorithm then sweeps dq-in delay values low to high, to find the left edge of the read window. Updated dqs_in and dq_in delay values are then applied to center the read window. The algorithm then repeats the process for all data pins.
Vref-In calibration— Read Vref-In calibration begins by programming Vref-In with an arbitrary value. The algorithm then sweeps the Vref-In value from the starting value to both ends, and measures the read window for each value. The algorithm selects the Vref-In value which provides the maximum read window.
LFIFO calibration— Read LFIFO calibration normalizes read delays between groups. The PHY must present all data to the controller as a single data bus. The LFIFO latency should be large enough for the slowest read data group, and large enough to allow proper synchronization across FIFOs.

Write Calibration

Leveling calibration— Write leveling calibration aligns the write strobe and clock to the memory clock, to compensate for skews. In general, leveling calibration tries a variety of delay values to determine the edges of the write window, and then selects an appropriate value to center the window. The details of the algorithm vary, depending on the memory protocol.
- (DDRx) Write leveling occurs before write deskew, therefore only one successful DQ bit is required to register a pass. Write leveling staggers the DQ bus to ensure that at least one DQ bit falls within the valid write window.
- (RLDRAMx) Optimizes for the CK versus DK relationship.
- (QDR-IV) Optimizes for the CK versus DK relationship. Is covered by address and command deskew using the loopback mode.
- (QDR II/II+/Xtreme) The K clock is the only clock, therefore write leveling is not required.
Deskew calibration— Performs per-bit deskew of write data relative to the write strobe and clock. Write deskew calibration does not change dqs_out delays; the write clock is aligned to the CK clock during write leveling.
VREF-Out calibration— (DDR4) Calibrates the VREF level at the memory device. The VREF-Out calibration algorithm is similar to the VREF-In calibration algorithm.

Intel Stratix 10 EMIF IP Controller

Hard Memory Controller

The Intel^® Stratix^® 10 hard memory controller is designed for high speed, high performance, high flexibility, and area efficiency. The Intel^® Stratix^® 10 hard memory controller supports DDR3 and DDR4 memory standards.

The hard memory controller implements efficient pipelining techniques and advanced dynamic command and data reordering algorithms to improve bandwidth usage and reduce latency, providing a high performance solution.

The controller architecture is modular and fits in a single I/O bank. The structure allows you to:

Configure each I/O bank as either:
- A control path that drives all the address and command pins for the memory interface.
- A data path that drives up to 32 data pins for DDR-type interfaces.
Place your memory controller in any location.
Pack up multiple banks together to form memory interfaces of different widths up to 72 bits.
Bypass the hard memory controller and use your own custom IP if required.

Figure 14. Hard Memory Controller Architecture

The hard memory controller consists of the following logic blocks:

Core and PHY interfaces
Main control path
Data buffer controller
Read and write data buffers

The core interface supports the Avalon^® Memory-Mapped (Avalon-MM) interface. The interface communicates to the PHY using the Altera PHY Interface (AFI). The whole control path is split into the main control path and the data buffer controller.

Hard Memory Controller Features

Table 6. Features of the Intel^® Stratix^® 10 Hard Memory Controller
Feature	Description
Memory standards support	Supports the following memory standards: DDR4 SDRAM DDR3 SDRAM
Memory devices support	Supports the following memory devices: Discrete UDIMM RDIMM LRDIMM SODIMM
3D Stacked Die support	Supports 2 and 4 height of 3D stacked die for DDR4 to increase memory capacity.
Memory controller bypass mode	You can use this configurable mode to bypass the hard memory controller and use your own customized controller.
Ping-Pong controller mode	You can use this configurable mode to enable two memory controllers to time-share the same set of address and command pins.
Interface protocols support	Supports Avalon-MM interface. The PHY interface adheres to the AFI protocol.
Rate support	The hard memory controller runs at half rate. It can accept memory access commands from the core logic at half rate or quarter rate.
Configurable memory interface width	Supports data widths from 8 to 72 bits, in 8 bit increments
Multiple ranks support	Supports: 4 ranks with single slot 2 ranks with dual slots
Burst adapter	Able to accept burst lengths of 1–127 on the local interface of the controller and map the bursts to efficient memory commands. No burst chop support for DDR3 and DDR4.
Efficiency optimization features	Open-page policy—by default, opens page on every access. However, the controller intelligently closes a row based on incoming traffic, which improves the efficiency of the controller especially for random traffic. Pre-emptive bank management—the controller issues bank management commands early, which ensures that the required row is open when the read or write occurs. Data reordering—the controller reorders read/write commands. Additive latency—the controller can issue a READ/WRITE command after the ACTIVATE command to the memory bank prior to t_RCD, which increases the command efficiency.
User requested priority	You can assign priority to commands. This feature allows you to specify that higher priority commands are issued earlier to reduce latency.
Starvation counter	Ensures all requests are served after a predefined time out period, which ensures that low priority access are not left behind while reordering data for efficiency.
Timing for address/command bus	To maximize command bandwidth, you can double the number of memory commands in one controller clock cycle: Quasi-1T addressing for half-rate address and command bus. Quasi-2T addressing for quarter-rate address and command. Note: Quasi-1T and Quasi-2T addressing is not supported for Ping Pong PHY.
Bank interleaving	Able to issue read or write commands continuously to "random" addresses. You must correctly cycle the bank addresses.
On-die termination	The controller controls the on-die termination signal for the memory. This feature improves signal integrity and simplifies your board design.
Refresh features	User-controlled refresh timing—optionally, you can control when refreshes occur and this allows you to prevent important read or write operations from clashing with the refresh lock-out time. Per-rank refresh—allows refresh for each individual rank. Controller-controlled refresh.
ECC support	8 bit ECC code; single error correction, double error detection (SECDED). User ECC supporting pass through user ECC bits as part of data bits.
DQS tracking	Tracks the DQS timing and makes auto adjustments to align to the DQS edges.
Power saving features	Low power modes (power down and self-refresh)—optionally, you can request the controller to put the memory into one of the two low power states. Automatic power down—puts the memory device in power down mode when the controller is idle. You can configure the idle waiting time. Memory clock gating.
Mode register set	Access the memory mode register.
DDR4 features	Bank group support—supports different timing parameters for between bank groups. Command/Address parity—command and address bus parity check. Alert reporting—responds to the error alert flag. Low power auto self refresh— operating temperature triggered auto adjustment to self refresh rate. Maximum power saving. Support Direct Dual CS Mode and Direct QuadCS Mode for DDR4 LRDIMM devices. Support Encoded Quad CSMode for single CS assertion memory mapping for DDR4 LRDIMM devices.
User ZQ calibration	Long or short ZQ calibration request for DDR3 or DDR4.

Hard Memory Controller Main Control Path

The main control path performs the following functions:

Contains the command processing pipeline.
Monitors all the timing parameters.
Keeps track of dependencies between memory access commands.
Guards against memory access hazards.

Table 7. Main Control Path Components
Component	Description
Input interface	Accepts memory access commands from the core logic at half or quarter rate. Uses the Avalon^® -MM protocol. You can connect the Avalon^® -MM interface to the AXI bus master in the Platform Designer (formerly Qsys). To connect the Avalon^® -MM interface, implement the AXI bus master as a Platform Designer component and connect the AXI bus master to the Avalon^® -MM slave. The Platform Designer interconnect performs the bus translation between the AXI and Avalon^® -MM bus interfaces. To support all bypass modes and keep the port count minimum, the super set of all port lists is used as the physical width. Ports are shared among the bypass modes.
Command generator and burst adapter	Drains your commands from the input interface and feeds them to the timing bank pool. If read-modify-write is required, inserts the necessary read-modify-write read and write commands into the stream. The burst adapter chops your arbitrary burst length to the number specified by the memory types.
Timing Bank Pool	Key component in the memory controller. Sets parallel queues to track command dependencies. Signals the ready status of each command being tracked to the arbiter for the final dispatch. Big scoreboard structure. The number of entries is currently sized to 8 where it monitors up to 8 commands at the same time. Handles the memory access hazards such as Read After Write (RAW), Write After Read (WAR), and Write After Write (WAW), while part of the timing constraints are being tracked. Assist the arbiter in reordering row commands and column commands. When the pool is full, a flow control signal is sent back upstream to stall the traffic.
Arbiter	Enforces the arbitration rules. Performs the final arbitration to select a command from all ready commands, and issues the selected command to the memory. Supports Quasi-1T mode for half rate mode. For the quasi modes, a row command must be paired with a column command.
Global Timer	Tracks the global timing constraints including: t_FAW—the Four Activates Window parameter that specifies the time period in which only four activate commands are allowed. t_RRD—the delay between back-to-back activate commands to different banks. Some of the bus turnaround time parameters.
MMR/IOCSR	The host of all the configuration registers. Uses Avalon^® -MM bus to talk to the core. Core logic can read and write all the configuration bits. The debug bus is routed to the core through this block.
Sideband	Executes the refresh and power down features.
ECC controller	Although ECC encoding and decoding is performed in soft logic¹, the ECC controller maintains the read-modify-write state machine in the hard solution.
AFI interface	The memory controller communicates with the PHY using this interface.

¹ ECC encoding and decoding is performed in soft logic to exempt the hard connection from routing data bits to a central ECC calculation location. Routing data to a central location removes the modular design benefits and reduces flexibility.

Data Buffer Controller

The data buffer controller performs the following operations:

Manages the read and write access to the data buffers:
- Provides the data storing pointers to the buffers when the write data is accepted or the read return data arrives.
- Provides the draining pointer when the write data is dispatched to memory or the read data is read out of the buffer and sent back to users.
Satisfies the required write latency.
If ECC support is enabled, assists the main control path to perform read-modify-write.

Data reordering is performed with the data buffer controller and the data buffers.

Each I/O bank contains two data buffer controller blocks for the data buffer lanes that are split within each bank. To improve your timing, place the data buffer controller physically close to the I/O lanes.

Intel Stratix 10 Hard Memory Controller Rate Conversion Feature

The hard memory controller's rate conversion feature allows the hard memory controller and PHY to run at half-rate, even though user logic is configured to run at quarter-rate.

To facilitate timing closure, you may choose to clock your core user logic at quarter-rate, resulting in easier timing closure at the expense of increased area and latency. To improve efficiency and help reduce overall latency, you can run the hard memory controller and PHY at half rate.

The rate conversion feature converts traffic from the FPGA core to the hard memory controller from quarter-rate to half-rate, and traffic from the hard memory controller to the FPGA core from half-rate to quarter-rate. From the perspective of user logic inside the FPGA core, the effect is the same as if the hard memory controller were running at quarter-rate.

The rate conversion feature is enabled automatically during IP generation whenever all of the following conditions are met:

The hard memory controller is in use.
User logic runs at quarter-rate.
The interface targets either an ES2 or production device.
Running the hard memory controller at half-rate does not exceed the fMax specification of the hard memory controller and hard PHY.

When the rate conversion feature is enabled, you should see the following info message displayed in the IP generation GUI:

PHY and controller running at 2x the frequency of user logic for improved efficiency.

Hardware Resource Sharing Among Multiple Intel Stratix 10 EMIFs

Often, it is necessary or desirable to share certain hardware resources between interfaces.

I/O SSM Sharing

The I/O SSM contains a hard Nios^® II processor and dedicated memory storing the calibration software code and data.

When a column contains multiple memory interfaces, the Nios^® II processor calibrates each interface serially. Interfaces placed within the same I/O column always share the same I/O SSM. The Intel^® Quartus^® Prime Fitter handles I/O SSM sharing automatically.

Note: Do not instantiate more memory interfaces in your design than are available on your board. If you instantiate a memory interface with no corresponding memory device placed on the board, calibration will fail for all interfaces in the same column.

I/O Bank Sharing

Data lanes from multiple compatible interfaces can share a physical I/O bank to achieve a more compact pin placement. To share an I/O bank, interfaces must use the same memory protocol, rate, frequency, I/O standard, and PLL reference clock signal.

Rules for Sharing I/O Banks

A bank cannot serve as the address and command bank for more than one interface. This means that lanes which implement address and command pins for different interfaces cannot be allocated to the same physical bank.
Note: An exception to the above rule exists when two interfaces are configured in a Ping-Pong PHY fashion. In such a configuration, two interfaces share the same set of address and command pins, effectively meaning that they share the same address and command tile.
Pins within a lane cannot be shared by multiple memory interfaces.
Any pins in a bank which are not used by the EMIF IP can serve as general-purpose I/O pins of uncalibrated I/O standard with the same voltage settings.
You can configure a bank as LVDS or as EMIF, but not both at the same time.
Interfaces that share banks must reside at adjacent bank locations.

The following diagram illustrates two x16 interfaces sharing an I/O bank. The two interfaces share the same clock phase alignment block, so that one core clock signal can interact with both interfaces. Without sharing, the two interfaces would occupy a total of four physical banks instead of three.

Figure 15. I/O Bank Sharing

PLL Reference Clock Sharing

To implement PLL reference clock sharing, in your RTL code connect the PLL reference clock signal at your design's top-level to the PLL reference clock port of multiple interfaces.

To share a PLL reference clock, the following requirements must be met:

Interfaces must expect a reference clock signal of the same frequency.
Interfaces must be placed in the same column.
Interfaces must be placed at adjacent bank locations.

Core Clock Network Sharing

It is often desirable or necessary for multiple memory interfaces to be accessible using a single clock domain in the FPGA core.

You might want to share core clock networks for the following reasons:

To minimize the area and latency penalty associated with clock domain crossing.
To minimize consumption of core clock networks.

Multiple memory interfaces can share the same core clock signals under the following conditions:

The memory interfaces have the same protocol, rate, frequency, and PLL reference clock source.
The interfaces reside in the same I/O column.
The interfaces reside in adjacent bank locations.

For multiple memory interfaces to share core clocks, you must specify one of the interfaces as master and the remaining interfaces as slaves. Use the Core clocks sharing setting in the parameter editor to specify the master and slaves.

In your RTL, connect the clks_sharing_master_out signal from the master interface to the clks_sharing_slave_in signal of all the slave interfaces. Both the master and slave interfaces expose their own output clock ports in the RTL (e.g. emif_usr_clk, afi_clk), but the signals are equivalent, so it does not matter whether a clock port from a master or a slave is used.

Core clock sharing necessitates PLL reference clock sharing; therefore, only the master interface exposes an input port for the PLL reference clock. All slave interfaces use the same PLL reference clock signal.

User-requested Reset in Intel Stratix 10 EMIF IP

The following table summarizes information about the user-requested reset mechanism in the Intel^® Stratix^® 10 EMIF IP.

Table 8.
	Description
Reset-related signals	`local_reset_req` (input) `local_reset_done` (output)
When can user logic request a reset?	`local_reset_req` has effect only `local_reset_done` is high. After device power-on, the `local_reset_done` signal transitions high upon completion of the first calibration, whether the calibration is successful or not.
Is user-requested reset a requirement?	A user-requested reset is optional. The I/O SSM automatically ensures that the memory interface begins from a known state as part of the device power-on sequence. A user-requested reset is necessarily only if the user logic must explicitly reset a memory interface after the device power-on sequence.
When does a user-requested reset actually happen?	A reset request is handled by the I/O SSM. If the I/O SSM receives a reset request from multiple interfaces within the same I/O column, it must serialize the reset sequence of the individual interfaces. You should avoid making assumptions on when the reset sequence will begin after a request is issued.
Timing requirement and triggering mechanism.	Reset request is sent by transitioning the `local_reset_req` signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low.`local_reset_req` is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.
How long can an external memory interface be kept in reset?	It is not possible to keep an external memory interface in reset indefinitely. Asserting `local_reset_req` high continuously has no effect as a reset request is completed by a full 0->1->0 pulse.
Delaying initial calibration.	Initial calibration cannot be skipped. The `local_reset_done` signal is driven high only after initial calibration has completed.
Reset scope (within an external memory interface).	Only circuits that are required to restore EMIF to power-up state are reset. Excluded from the reset sequence are the IOSSM, the IOPLL(s), the DLL(s), and the CPA.
Reset scope (within an I/O column).	`local_reset_req` is a per-interface reset.

Method for Initiating a User-requested Reset

Step 1 - Precondition

Before asserting local_reset_req, user logic must ensure that the local_reset_done signal is high.

As part of the device power-on sequence, thelocal_reset_done signal automatically transitions to high upon the completion of the interface calibration sequence, regardless of whether calibration is successful or not.

Note: When targeting a group of interfaces that share the same core clocks, user logic must ensure that the local_reset_done signal of every interface is high.

Step 2 - Reset Request

After the pre-condition is satisfied, user logic can send a reset request by driving the local_cal_req signal from low to high and then low again (that is, by sending a pulse of 1).

The low-to-high and high-to-low transitions can occur asychronously; that is, they need not happen in relation to any clock edges. However, the pulse must meet a minimum pulse width of at least 2 EMIF core clock cycles. For example, if the emif_usr_clk has a period of 4ns, then the local_reset_req pulse must last at least 8ns (that is, two emif_usr_clk periods).
The reset request is considered complete only after the high-to-low transition. The EMIF IP does not initiate the reset sequence when the local_reset_req is simply held high.
Additional pulses to local_reset_req are ignored until the reset sequence is completed.

Optional - Detecting local_reset_done deassertion and assertion

If you want, you can monitor the status of the local_reset_done signal to to explicitly detect the status of the reset sequence.

After the EMIF IP receives a reset request, it deasserts the local_reset_done signal. After initial power-up calibration, local_reset_done is de-asserted only in response to a user-requested reset. The reset sequence is imminent when local_reset_done has transitioned to low, although the exact timing depends on the current state of the I/O SSM. As part of the EMIF reset sequence, the core reset signal (emif_usr_reset_n, afi_reset_n) is driven low. Do not use a register reset by the core reset signal to sample local_reset_done.
After the reset sequence has completed, local_reset_done is driven high again. local_reset_done being driven high indicates the completion of the reset sequence and the readiness to accept a new reset request; however, it does not imply that calibration was successful or that the hard memory controller is ready to accept requests. For these purposes, user logic must check signals such as afi_cal_success, afi_cal_fail, and amm_ready.

Intel Stratix 10 EMIF for Hard Processor Subsystem

The Intel^® Stratix^® 10 EMIF IP can enable the Intel^® Stratix^® 10 Hard Processor Subsystem (HPS) to access external DRAM memory devices.

To enable connectivity between the Intel^® Stratix^® 10 HPS and the Intel^® Stratix^® 10 EMIF IP, you must create and configure an instance of the Intel^® Stratix^® 10 External Memory Interface for HPS IP core, and use Platform Designer to connect it to the Intel^® Stratix^® 10 Hard Processor Subsystem instance in your system.

Supported Modes

The Intel^® Stratix^® 10 Hard Processor Subsystem is compatible with the following external memory configurations:

Table 9. Intel^® Stratix^® 10 Hard Processor Subsystem Compatibility
Protocol	DDR3, DDR4
Maximum memory clock frequency	DDR3: 1.067 GHz DDR4: 1.333 GHz
Configuration	Hard PHY with hard memory controller
Clock rate of PHY and hard memory controller	Half-rate
Data width (without ECC)	16-bit, 32-bit, 64-bit
Data width (with ECC)	24-bit, 40-bit, 72-bit
DQ width per group	x8
Maximum number of I/O lanes for address/command	3
Memory format	Discrete, UDIMM, SODIMM, RDIMM
Ranks / CS# width	Up to 2

Restrictions on I/O Bank Usage for Intel Stratix 10 EMIF IP with HPS

You can use only certain Intel^® Stratix^® 10 I/O banks to implement Intel^® Stratix^® 10 EMIF IP with the Intel^® Stratix^® 10 Hard Processor Subsystem.

The restrictions on I/O bank usage result from the Intel^® Stratix^® 10 HPS having hard-wired connections to the EMIF circuits in the I/O banks closest to the HPS. For any given EMIF configuration, the pin-out of the EMIF-to-HPS interface is fixed.

The following diagram illustrates the use of I/O banks and lanes for various EMIF-HPS data widths:

Figure 16. Intel^® Stratix^® 10 External Memory Interfaces I/O Bank and Lanes Usage

The HPS EMIF uses the closest located external memory interfaces I/O banks to connect to SDRAM. These banks include:

Bank 2N—used for data I/Os (Data bits 31:0)
Bank 2M—used for address, command and ECC data I/Os
Bank 2L—used for data I/Os (Data bits 63:32)

If no HPS EMIF is used in a system, the entire HPS EMIF bank can be used as FPGA GPIO. If there is a HPS EMIF in a system, the unused HPS EMIF pins can be used as FPGA general I/O with restrictions:

Bank 2M:
- Lane 3 is used for SDRAM ECC data. Unused pins in lane 3 can be used as FPGA inputs only.
- Lanes 2, 1, and 0 are used for SDRAM address and command. Unused pins in these lanes can be used as FPGA inputs or outputs.
Bank 2N and Bank 2L :
- Lanes 3, 2, 1, and 0 are used for data bits.
- With 64-bit data widths, unused pins in these banks can be used as FPGA inputs only.
- With 32-bit data widths, unused pins in Bank 2N can be used as FPGA inputs only.Unused pins for Bank 2L can be used as FPGA inputs or outputs.
- With 16-bit data widths, Intel^® Quartus^® Prime assigns lane 0 and lane 1 as data lanes in bank 2N. Unused pins in lane 0 and lane 1 can be used as FPGA inputs only. The other two lanes are available to use as FPGA inputs or outputs.

By default, the Intel^® Stratix^® 10 External Memory Interface for HPS IP core together with the Intel^® Quartus^® Prime Fitter automatically implement the correct pin-out for HPS EMIF without you having to apply additional constraints. If you must modify the default pin-out for any reason, you must adhere to the following requirements, which are specific to HPS EMIF:

Within a single data lane (which implements a single x8 DQS group):
- DQ pins must use pins at indices 1, 2, 3, 6, 7, 8, 9, 10. You may swap the locations between the DQ bits (that is, you may swap location of DQ[0] and DQ[3]) so long as the resulting pin-out uses pins at these indices only.
- DM/DBI pin must use pin at index 11. There is no flexibility.
- DQS/DQS# must use pins at index 4 and 5. There is no flexibility.
Assignment of data lanes must be as illustrated in the above figure. You are allowed to swap the locations of entire byte lanes (that is, you may swap locations of byte 0 and byte 3) so long as the resulting pin-out uses only the lanes permitted by your HPS EMIF configuration, as shown in the above figure.
You must not change placement of the address and command pins from the default.
You may place the alert# pin at any available pin location in either a data lane or an address and command lane.

To override the default generated pin assignments, comment out the relevant HPS_LOCATION assignments in the .qip file, and add your own location assignments (using set_location_assignment) in the .qsf file.

Intel Stratix 10 EMIF Ping Pong PHY

Ping Pong PHY allows two memory interfaces to share the address and command bus through time multiplexing. Compared to having two independent interfaces that allocate address and command lanes separately, Ping Pong PHY achieves the same throughput with fewer resources, by sharing the address and command lanes.

In Intel^® Stratix^® 10 EMIF, Ping Pong PHY supports both half-rate and quarter-rate interfaces for DDR3, and quarter-rate for DDR4.

Intel Stratix 10 Ping Pong PHY Feature Description

Conventionally, the address and command buses of a DDR3 or DDR4 half-rate or quarter-rate interface use 2T time—meaning that commands are issued for two full-rate clock cycles, as illustrated below.

Figure 17. 2T Command Timing

With the Ping Pong PHY, address and command signals from two independent controllers are multiplexed onto shared buses by delaying one of the controller outputs by one full-rate clock cycle. The result is 1T timing, with a new command being issued on each full-rate clock cycle. The following figure shows address and command timing for the Ping Pong PHY.

The command signals CS, ODT, and CKE have two signals (one for ping and one for pong); the other address and command signals are shared.

Figure 18. 1T Command Timing Use by Ping Pong PHY

Intel Stratix 10 Ping Pong PHY Architecture

In Intel^® Stratix^® 10 EMIF, the Ping Pong PHY feature can be enabled only with the hard memory controller, where two hard memory controllers are instantiated—one for the primary interface and one for the secondary interface.

The hard memory controller I/O bank of the primary interface is used for address and command and is always adjacent and above the hard memory controller bank of the secondary interface. All four lanes of the primary hard memory controller bank are used for address and command.

The following example shows a 2x16 Ping Pong PHY bank-lane configuration. The upper bank (I/O bank N) is the address and command bank, which serves both the primary and secondary interfaces. The primary hard memory controller is linked to the secondary interface by the Ping Pong bus. The lower bank (I/O bank N-1) is the secondary interface bank, which carries the data buses for both primary and secondary interfaces. In the 2x16 case a total of four I/O banks are required for data, hence two banks in total are sufficient for the implementation.

The data for the primary interface is routed down to the top two lanes of the secondary I/O bank, and the data for the secondary interface is routed to the bottom two lanes of the secondary I/O bank.

Figure 19. 2x16 Ping Pong PHY I/O Bank-Lane Configuration

A 2x32 interface can be implemented similarly, with the additional data lanes placed above and below the primary and secondary I/O banks, such that primary data lanes are placed above the primary bank and secondary data lanes are placed below the secondary bank.

Figure 20. 2x32 Ping Pong PHY I/O Bank-Lane Configuration.

Intel Stratix 10 Ping Pong PHY Limitations

Ping Pong PHY supports up to two ranks per memory interface. In addition, the maximum data width is x72, which is half the maximum width of x144 for a single interface.

Ping Pong PHY uses all lanes of the address and command I/O bank as address and command. For information on pin allocations, refer to the pin-out file for your device, at Pin-Out Files for Intel FPGA Devices on www.altera.com.

An additional limitation is that I/O lanes may be left unused when you instantiate multiple pairs of Ping Pong PHY interfaces. The following diagram shows two pairs of x8 Pin Pong controllers (a total of 4 interfaces). Lanes highlighted in yellow are not driven by any memory interfaces (unused lanes and pins can still serve as general purpose I/Os). Even with some I/O lanes left unused, the Ping Pong PHY approach is still beneficial in terms of resource usage, compared to independent interfaces. Memory widths of 24 bits and 40 bits have a similar situation, while 16 bit, 32 bit, and 64 bit memory widths do not suffer this limitation.

Figure 21. Two Pairs of x8 Pin-Pong PHY Controllers

Intel Stratix 10 Ping Pong PHY Calibration

A Ping Pong PHY interface is calibrated as a regular interface of double width.

Calibration of a Ping Pong PHY interface incorporates two sequencers, one on the primary hard memory controller I/O bank, and one on the secondary hard memory controller I/O bank. To ensure that the two sequencers issue instructions on the same memory clock cycle, the Nios II processor configures the sequencer on the primary hard memory controller to receive a token from the secondary interface, ignoring any commands from the Avalon bus. Additional delays are programmed on the secondary interface to allow for the passing of the token from the sequencer on the secondary hard memory controller tile to the sequencer on the primary hard memory controller tile. During calibration, the Nios II processor assumes that commands are always issued from the sequencer on the primary hard memory controller I/O bank. After calibration, the Nios II processor adjusts the delays for use with the primary and secondary hard memory controllers.

Using the Ping Pong PHY

The following steps describe how to use the Ping Pong PHY for Intel^® Stratix^® 10 EMIF.

Configure a single memory interface according to your requirements.
Select Instantiate two controllers sharing a Ping Pong PHY on the General tab in the parameter editor.
The Intel^® Quartus^® Prime software replicates the interface, resulting in two memory controllers and a shared PHY. The system configures the I/O bank-lane structure, without further input from you.

Ping Pong PHY Simulation Example Design

The following figure illustrates a top-level block diagram of a generated Ping Pong PHY simulation example design, using two I/O banks.

Functionally, the IP interfaces with user traffic separately, as it would with two independent memory interfaces. You can also generate synthesizable example designs, where the external memory interface IP interfaces with a traffic generator.

Figure 22. Ping Pong PHY Simulation Example Design

Intel Stratix 10 EMIF IP End-User Signals

Interface and Signal Descriptions

The following sections describe each of the interfaces and their signals, by protocol, for the Intel^® Stratix^® 10 EMIF IP.

Intel Stratix 10 EMIF IP Interfaces for DDR3

The interfaces in the Intel Stratix 10 External Memory Interface IP each have signals that can be connected in Qsys. The following table lists the interfaces and corresponding interface types for DDR3.

Table 10. Interfaces for DDR3
Interface Name	Interface Type	Description
global_reset_n	Reset Input	Global reset interface
local_reset_req	Conduit	Local reset request interface
local_reset_status	Conduit	Local reset status interface
pll_ref_clk	Clock Input	PLL reference clock interface
pll_locked	Conduit	PLL lock status interface
pll_extra_clk_0	Clock Output	PLL extra core clock interface 0
pll_extra_clk_1	Clock Output	PLL extra core clock interface 1
pll_extra_clk_2	Clock Output	PLL extra core clock interface 2
pll_extra_clk_3	Clock Output	PLL extra core clock interface 3
oct	Conduit	On-Chip Termination (OCT) interface
mem	Conduit	Interface between FPGA and external memory
status	Conduit	PHY calibration status interface
afi_reset_n	Reset Output	AFI reset interface
afi_clk	Clock Output	AFI clock interface
afi_half_clk	Clock Output	AFI half-rate clock interface
afi	Conduit	Altera PHY Interface (AFI)
emif_usr_reset_n	Reset Output	User clock domain reset interface
emif_usr_clk	Clock Output	User clock interface
emif_usr_reset_n_sec	Reset Output	User clock domain reset interface (for the secondary interface in ping-pong configuration)
emif_usr_clk_sec	Clock Output	User clock interface (for the secondary interface in ping-pong configuration)
cal_debug_reset_n	Reset Input	User calibration debug clock domain reset interface
cal_debug_clk	Clock Input	User calibration debug clock interface
cal_debug_out_reset_n	Reset Output	User calibration debug clock domain reset interface
cal_debug_out_clk	Clock Output	User calibration debug clock interface
clks_sharing_master_out	Conduit	Core clocks sharing master interface
clks_sharing_slave_in	Conduit	Core clocks sharing slave input interface
clks_sharing_slave_out	Conduit	Core clocks sharing slave output interface
ctrl_amm	Avalon Memory-Mapped Slave	Controller Avalon Memory-Mapped interface
ctrl_auto_precharge	Conduit	Controller auto-precharge interface
ctrl_user_priority	Conduit	Controller user-requested priority interface
ctrl_ecc_user_interrupt	Conduit	Controller ECC user interrupt interface
ctrl_mmr_slave	Avalon Memory-Mapped Slave	Controller MMR slave interface
hps_emif	Conduit	Conduit between Hard Processor Subsystem and memory interface
cal_debug	Avalon Memory-Mapped Slave	Calibration debug interface
cal_debug_out	Avalon Memory-Mapped Master	Calibration debug interface

global_reset_n for DDR3

Global reset interface

Table 11. Interface: global_reset_n. Interface type: Reset Input
Port Name	Direction	Description
global_reset_n	Input	Asynchronous reset causes the memory interface to be reset and recalibrated. The global reset signal applies to all memory interfaces placed within an I/O column.

local_reset_req for DDR3

Local reset request interface

Table 12. Interface: local_reset_req. Interface type: Conduit
Port Name	Direction	Description
local_reset_req	Input	Signal from user logic to request the memory interface to be reset and recalibrated. Reset request is sent by transitioning the local_reset_req signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low. local_reset_req is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.

local_reset_status for DDR3

Local reset status interface

Table 13. Interface: local_reset_status. Interface type: Conduit
Port Name	Direction	Description
local_reset_done	Output	Signal from memory interface to indicate whether it has completed a reset sequence, is currently out of reset, and is ready for a new reset request. When local_reset_done is low, the memory interface is in reset.

pll_ref_clk for DDR3

PLL reference clock interface

Table 14. Interface: pll_ref_clk. Interface type: Clock Input
Port Name	Direction	Description
pll_ref_clk	Input	PLL reference clock input

pll_locked for DDR3

PLL lock status interface

Table 15. Interface: pll_locked. Interface type: Conduit
Port Name	Direction	Description
pll_locked	Output	PLL lock signal to indicate whether the PLL has locked

pll_extra_clk_0 for DDR3

PLL extra core clock interface 0

Table 16. Interface: pll_extra_clk_0. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_0	Output	PLL extra core clock signal output 0. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_1 for DDR3

PLL extra core clock interface 1

Table 17. Interface: pll_extra_clk_1. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_1	Output	PLL extra core clock signal output 1. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_2 for DDR3

PLL extra core clock interface 2

Table 18. Interface: pll_extra_clk_2. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_2	Output	PLL extra core clock signal output 2. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_3 for DDR3

PLL extra core clock interface 3

Table 19. Interface: pll_extra_clk_3. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_3	Output	PLL extra core clock signal output 3. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

oct for DDR3

On-Chip Termination (OCT) interface

Table 20. Interface: oct. Interface type: Conduit
Port Name	Direction	Description
oct_rzqin	Input	Calibrated On-Chip Termination (OCT) RZQ input pin

mem for DDR3

Interface between FPGA and external memory

Table 21. Interface: mem. Interface type: Conduit
Port Name	Direction	Description
mem_ck	Output	CK clock
mem_ck_n	Output	CK clock (negative leg)
mem_a	Output	Address
mem_ba	Output	Bank address
mem_cke	Output	Clock enable
mem_cs_n	Output	Chip select
mem_rm	Output	Rank multiplication for LRDIMM. Typically, mem_rm[0] and mem_rm[1] connect to CS2# and CS3# of the memory buffer of all LRDIMM slots.
mem_odt	Output	On-die termination
mem_ras_n	Output	RAS command
mem_cas_n	Output	CAS command
mem_we_n	Output	WE command
mem_reset_n	Output	Asynchronous reset
mem_par	Output	Command and address parity
mem_dm	Output	Write data mask
mem_dq	Bidirectional	Read/write data
mem_dqs	Bidirectional	Data strobe
mem_dqs_n	Bidirectional	Data strobe (negative leg)
mem_alert_n	Input	Alert flag

status for DDR3

PHY calibration status interface

Table 22. Interface: status. Interface type: Conduit
Port Name	Direction	Description
local_cal_success	Output	When high, indicates that PHY calibration was successful
local_cal_fail	Output	When high, indicates that PHY calibration failed

afi_reset_n for DDR3

AFI reset interface

Table 23. Interface: afi_reset_n. Interface type: Reset Output
Port Name	Direction	Description
afi_reset_n	Output	Reset for the AFI clock domain. Asynchronous assertion and synchronous deassertion

afi_clk for DDR3

AFI clock interface

Table 24. Interface: afi_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_clk	Output	Clock for the Altera PHY Interface (AFI)

afi_half_clk for DDR3

AFI half-rate clock interface

Table 25. Interface: afi_half_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_half_clk	Output	Clock running at half the frequency of the AFI clock afi_clk

afi for DDR3

Altera PHY Interface (AFI)

Table 26. Interface: afi. Interface type: Conduit
Port Name	Direction	Description
afi_cal_success	Output	Signals calibration successful completion
afi_cal_fail	Output	Signals calibration failure
afi_cal_req	Input	When asserted, the interface is recalibrated
afi_rlat	Output	Latency in afi_clk cycles between read command and read data valid
afi_wlat	Output	Latency in afi_clk cycles between write command and write data valid
afi_addr	Input	Address
afi_ba	Input	Bank address
afi_cke	Input	Clock enable
afi_cs_n	Input	Chip select
afi_rm	Input	Rank multiplication for LRDIMM
afi_odt	Input	On-die termination
afi_ras_n	Input	RAS command
afi_cas_n	Input	CAS command
afi_we_n	Input	WE command
afi_rst_n	Input	Asynchronous reset
afi_par	Input	Command and address parity
afi_dm	Input	Write data mask
afi_dqs_burst	Input	Asserted by the controller to enable the output DQS signal
afi_wdata_valid	Input	Asserted by the controller to indicate that afi_wdata contains valid write data
afi_wdata	Input	Write data
afi_rdata_en_full	Input	Asserted by the controller to indicate the amount of relevant read data expected
afi_rdata	Output	Read data
afi_rdata_valid	Output	Asserted by the PHY to indicate that afi_rdata contains valid read data
afi_rrank	Input	Asserted by the controller to indicate which rank is being read from, to control shadow register switching
afi_wrank	Input	Asserted by the controller to indicate which rank is being written to, to control shadow register switching

emif_usr_reset_n for DDR3

User clock domain reset interface

Table 27. Interface: emif_usr_reset_n. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion

emif_usr_clk for DDR3

User clock interface

Table 28. Interface: emif_usr_clk. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk	Output	User clock domain

emif_usr_reset_n_sec for DDR3

User clock domain reset interface (for the secondary interface in ping-pong configuration)

Table 29. Interface: emif_usr_reset_n_sec. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n_sec	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion. Intended for the secondary interface in a ping-pong configuration.

emif_usr_clk_sec for DDR3

User clock interface (for the secondary interface in ping-pong configuration)

Table 30. Interface: emif_usr_clk_sec. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk_sec	Output	User clock domain. Intended for the secondary interface in a ping-pong configuration.

cal_debug_reset_n for DDR3

User calibration debug clock domain reset interface

Table 31. Interface: cal_debug_reset_n. Interface type: Reset Input
Port Name	Direction	Description
cal_debug_reset_n	Input	Reset for the user clock connecting to the Avalon calibration debug bus. Asynchronous assertion and synchronous deassertion

cal_debug_clk for DDR3

User calibration debug clock interface

Table 32. Interface: cal_debug_clk. Interface type: Clock Input
Port Name	Direction	Description
cal_debug_clk	Input	User clock domain

cal_debug_out_reset_n for DDR3

User calibration debug clock domain reset interface

Table 33. Interface: cal_debug_out_reset_n. Interface type: Reset Output
Port Name	Direction	Description
cal_debug_out_reset_n	Output	Reset for the user clock connecting to the Avalon calibration debug_out bus. Asynchronous assertion and synchronous deassertion

cal_debug_out_clk for DDR3

User calibration debug clock interface

Table 34. Interface: cal_debug_out_clk. Interface type: Clock Output
Port Name	Direction	Description
cal_debug_out_clk	Output	User clock domain

clks_sharing_master_out for DDR3

Core clocks sharing master interface

Table 35. Interface: clks_sharing_master_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_master_out	Output	This port should fanout to all the core clocks sharing slaves.

clks_sharing_slave_in for DDR3

Core clocks sharing slave input interface

Table 36. Interface: clks_sharing_slave_in. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_in	Input	This port should be connected to the core clocks sharing master.

clks_sharing_slave_out for DDR3

Core clocks sharing slave output interface

Table 37. Interface: clks_sharing_slave_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_out	Output	This port may be used to fanout to another core clocks sharing slave. Alternatively, the master can fanout to all slaves.

ctrl_amm for DDR3

Controller Avalon Memory-Mapped interface

Table 38. Interface: ctrl_amm. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
amm_ready	Output	Wait-request is asserted when controller is busy
amm_read	Input	Read request signal
amm_write	Input	Write request signal
amm_address	Input	Address for the read/write request
amm_readdata	Output	Read data
amm_writedata	Input	Write data
amm_burstcount	Input	Number of transfers in each read/write burst
amm_byteenable	Input	Byte-enable for write data
amm_beginbursttransfer	Input	Indicates when a burst is starting
amm_readdatavalid	Output	Indicates whether read data is valid

ctrl_auto_precharge for DDR3

Controller auto-precharge interface

Table 39. Interface: ctrl_auto_precharge. Interface type: Conduit
Port Name	Direction	Description
ctrl_auto_precharge_req	Input	When asserted high along with a read or write request to the memory controller, indicates that the controller should close the currently opened page after the read or write burst.

ctrl_user_priority for DDR3

Controller user-requested priority interface

Table 40. Interface: ctrl_user_priority. Interface type: Conduit
Port Name	Direction	Description
ctrl_user_priority_hi	Input	When asserted high along with a read or write request to the memory controller, indicates that the request is high priority and should be fullfilled before other low priority requests.

ctrl_ecc_user_interrupt for DDR3

Controller ECC user interrupt interface

Table 41. Interface: ctrl_ecc_user_interrupt. Interface type: Conduit
Port Name	Direction	Description
ctrl_ecc_user_interrupt	Output	Controller ECC user interrupt signal to determine whether there is a bit error

ctrl_mmr_slave for DDR3

Controller MMR slave interface

Table 42. Interface: ctrl_mmr_slave. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
mmr_slave_waitrequest	Output	Wait-request is asserted when controller MMR interface is busy
mmr_slave_read	Input	MMR read request signal
mmr_slave_write	Input	MMR write request signal
mmr_slave_address	Input	Word address for MMR interface of memory controller
mmr_slave_readdata	Output	MMR read data
mmr_slave_writedata	Input	MMR write data
mmr_slave_burstcount	Input	Number of transfers in each read/write burst
mmr_slave_beginbursttransfer	Input	Indicates when a burst is starting
mmr_slave_readdatavalid	Output	Indicates whether MMR read data is valid

hps_emif for DDR3

Conduit between Hard Processor Subsystem and memory interface

Table 43. Interface: hps_emif. Interface type: Conduit
Port Name	Direction	Description
hps_to_emif	Input	Signals coming from Hard Processor Subsystem to the memory interface
emif_to_hps	Output	Signals going to Hard Processor Subsystem from the memory interface
hps_to_emif_gp	Input	Signals coming from Hard Processor Subsystem GPIO to the memory interface
emif_to_hps_gp	Output	Signals going to Hard Processor Subsystem GPIO from the memory interface

cal_debug for DDR3

Calibration debug interface

Table 44. Interface: cal_debug. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
cal_debug_waitrequest	Output	Wait-request is asserted when controller is busy
cal_debug_read	Input	Read request signal
cal_debug_write	Input	Write request signal
cal_debug_addr	Input	Address for the read/write request
cal_debug_read_data	Output	Read data
cal_debug_write_data	Input	Write data
cal_debug_byteenable	Input	Byte-enable for write data
cal_debug_read_data_valid	Output	Indicates whether read data is valid

cal_debug_out for DDR3

Calibration debug interface

Table 45. Interface: cal_debug_out. Interface type: Avalon Memory-Mapped Master
Port Name	Direction	Description
cal_debug_out_waitrequest	Input	Wait-request is asserted when controller is busy
cal_debug_out_read	Output	Read request signal
cal_debug_out_write	Output	Write request signal
cal_debug_out_addr	Output	Address for the read/write request
cal_debug_out_read_data	Input	Read data
cal_debug_out_write_data	Output	Write data
cal_debug_out_byteenable	Output	Byte-enable for write data
cal_debug_out_read_data_valid	Input	Indicates whether read data is valid

Intel Stratix 10 EMIF IP Interfaces for DDR4

Table 46. Interfaces for DDR4
Interface Name	Interface Type	Description
global_reset_n	Reset Input	Global reset interface
local_reset_req	Conduit	Local reset request interface
local_reset_status	Conduit	Local reset status interface
pll_ref_clk	Clock Input	PLL reference clock interface
pll_locked	Conduit	PLL lock status interface
pll_extra_clk_0	Clock Output	PLL extra core clock interface 0
pll_extra_clk_1	Clock Output	PLL extra core clock interface 1
pll_extra_clk_2	Clock Output	PLL extra core clock interface 2
pll_extra_clk_3	Clock Output	PLL extra core clock interface 3
oct	Conduit	On-Chip Termination (OCT) interface
mem	Conduit	Interface between FPGA and external memory
status	Conduit	PHY calibration status interface
afi_reset_n	Reset Output	AFI reset interface
afi_clk	Clock Output	AFI clock interface
afi_half_clk	Clock Output	AFI half-rate clock interface
afi	Conduit	Altera PHY Interface (AFI)
emif_usr_reset_n	Reset Output	User clock domain reset interface
emif_usr_clk	Clock Output	User clock interface
emif_usr_reset_n_sec	Reset Output	User clock domain reset interface (for the secondary interface in ping-pong configuration)
emif_usr_clk_sec	Clock Output	User clock interface (for the secondary interface in ping-pong configuration)
cal_debug_reset_n	Reset Input	User calibration debug clock domain reset interface
cal_debug_clk	Clock Input	User calibration debug clock interface
cal_debug_out_reset_n	Reset Output	User calibration debug clock domain reset interface
cal_debug_out_clk	Clock Output	User calibration debug clock interface
clks_sharing_master_out	Conduit	Core clocks sharing master interface
clks_sharing_slave_in	Conduit	Core clocks sharing slave input interface
clks_sharing_slave_out	Conduit	Core clocks sharing slave output interface
ctrl_amm	Avalon Memory-Mapped Slave	Controller Avalon Memory-Mapped interface
ctrl_auto_precharge	Conduit	Controller auto-precharge interface
ctrl_user_priority	Conduit	Controller user-requested priority interface
ctrl_ecc_user_interrupt	Conduit	Controller ECC user interrupt interface
ctrl_mmr_slave	Avalon Memory-Mapped Slave	Controller MMR slave interface
hps_emif	Conduit	Conduit between Hard Processor Subsystem and memory interface
cal_debug	Avalon Memory-Mapped Slave	Calibration debug interface
cal_debug_out	Avalon Memory-Mapped Master	Calibration debug interface

global_reset_n for DDR4

Global reset interface

Table 47. Interface: global_reset_n. Interface type: Reset Input
Port Name	Direction	Description
global_reset_n	Input	Asynchronous reset causes the memory interface to be reset and recalibrated. The global reset signal applies to all memory interfaces placed within an I/O column.

local_reset_req for DDR4

Local reset request interface

Table 48. Interface: local_reset_req. Interface type: Conduit
Port Name	Direction	Description
local_reset_req	Input	Signal from user logic to request the memory interface to be reset and recalibrated. Reset request is sent by transitioning the local_reset_req signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low. local_reset_req is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.

local_reset_status for DDR4

Local reset status interface

Table 49. Interface: local_reset_status. Interface type: Conduit
Port Name	Direction	Description
local_reset_done	Output	Signal from memory interface to indicate whether it has completed a reset sequence, is currently out of reset, and is ready for a new reset request. When local_reset_done is low, the memory interface is in reset.

pll_ref_clk for DDR4

PLL reference clock interface

Table 50. Interface: pll_ref_clk. Interface type: Clock Input
Port Name	Direction	Description
pll_ref_clk	Input	PLL reference clock input

pll_locked for DDR4

PLL lock status interface

Table 51. Interface: pll_locked. Interface type: Conduit
Port Name	Direction	Description
pll_locked	Output	PLL lock signal to indicate whether the PLL has locked

pll_extra_clk_0 for DDR4

PLL extra core clock interface 0

Table 52. Interface: pll_extra_clk_0. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_0	Output	PLL extra core clock signal output 0. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_1 for DDR4

PLL extra core clock interface 1

Table 53. Interface: pll_extra_clk_1. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_1	Output	PLL extra core clock signal output 1. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_2 for DDR4

PLL extra core clock interface 2

Table 54. Interface: pll_extra_clk_2. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_2	Output	PLL extra core clock signal output 2. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_3 for DDR4

PLL extra core clock interface 3

Table 55. Interface: pll_extra_clk_3. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_3	Output	PLL extra core clock signal output 3. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

oct for DDR4

On-Chip Termination (OCT) interface

Table 56. Interface: oct. Interface type: Conduit
Port Name	Direction	Description
oct_rzqin	Input	Calibrated On-Chip Termination (OCT) RZQ input pin

mem for DDR4

Interface between FPGA and external memory

Table 57. Interface: mem. Interface type: Conduit
Port Name	Direction	Description
mem_ck	Output	CK clock
mem_ck_n	Output	CK clock (negative leg)
mem_a	Output	Address
mem_ba	Output	Bank address
mem_bg	Output	Bank group
mem_cke	Output	Clock enable
mem_cs_n	Output	Chip select
mem_odt	Output	On-die termination
mem_reset_n	Output	Asynchronous reset
mem_act_n	Output	Activation command
mem_par	Output	Command and address parity
mem_dq	Bidirectional	Read/write data
mem_dbi_n	Bidirectional	Acts as either the data bus inversion pin, or the data mask pin, depending on configuration.
mem_dqs	Bidirectional	Data strobe
mem_dqs_n	Bidirectional	Data strobe (negative leg)
mem_alert_n	Input	Alert flag

status for DDR4

PHY calibration status interface

Table 58. Interface: status. Interface type: Conduit
Port Name	Direction	Description
local_cal_success	Output	When high, indicates that PHY calibration was successful
local_cal_fail	Output	When high, indicates that PHY calibration failed

afi_reset_n for DDR4

AFI reset interface

Table 59. Interface: afi_reset_n. Interface type: Reset Output
Port Name	Direction	Description
afi_reset_n	Output	Reset for the AFI clock domain. Asynchronous assertion and synchronous deassertion

afi_clk for DDR4

AFI clock interface

Table 60. Interface: afi_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_clk	Output	Clock for the Altera PHY Interface (AFI)

afi_half_clk for DDR4

AFI half-rate clock interface

Table 61. Interface: afi_half_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_half_clk	Output	Clock running at half the frequency of the AFI clock afi_clk

afi for DDR4

Altera PHY Interface (AFI)

Table 62. Interface: afi. Interface type: Conduit
Port Name	Direction	Description
afi_cal_success	Output	Signals calibration successful completion
afi_cal_fail	Output	Signals calibration failure
afi_cal_req	Input	When asserted, the interface is recalibrated
afi_rlat	Output	Latency in afi_clk cycles between read command and read data valid
afi_wlat	Output	Latency in afi_clk cycles between write command and write data valid
afi_addr	Input	Address
afi_ba	Input	Bank address
afi_bg	Input	Bank group
afi_cke	Input	Clock enable
afi_cs_n	Input	Chip select
afi_odt	Input	On-die termination
afi_rst_n	Input	Asynchronous reset
afi_act_n	Input	Activation command
afi_par	Input	Command and address parity
afi_dm_n	Input	Write data mask
afi_dqs_burst	Input	Asserted by the controller to enable the output DQS signal
afi_wdata_valid	Input	Asserted by the controller to indicate that afi_wdata contains valid write data
afi_wdata	Input	Write data
afi_rdata_en_full	Input	Asserted by the controller to indicate the amount of relevant read data expected
afi_rdata	Output	Read data
afi_rdata_valid	Output	Asserted by the PHY to indicate that afi_rdata contains valid read data
afi_rrank	Input	Asserted by the controller to indicate which rank is being read from, to control shadow register switching
afi_wrank	Input	Asserted by the controller to indicate which rank is being written to, to control shadow register switching

emif_usr_reset_n for DDR4

User clock domain reset interface

Table 63. Interface: emif_usr_reset_n. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion

emif_usr_clk for DDR4

User clock interface

Table 64. Interface: emif_usr_clk. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk	Output	User clock domain

emif_usr_reset_n_sec for DDR4

User clock domain reset interface (for the secondary interface in ping-pong configuration)

Table 65. Interface: emif_usr_reset_n_sec. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n_sec	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion. Intended for the secondary interface in a ping-pong configuration.

emif_usr_clk_sec for DDR4

User clock interface (for the secondary interface in ping-pong configuration)

Table 66. Interface: emif_usr_clk_sec. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk_sec	Output	User clock domain. Intended for the secondary interface in a ping-pong configuration.

cal_debug_reset_n for DDR4

User calibration debug clock domain reset interface

Table 67. Interface: cal_debug_reset_n. Interface type: Reset Input
Port Name	Direction	Description
cal_debug_reset_n	Input	Reset for the user clock connecting to the Avalon calibration debug bus. Asynchronous assertion and synchronous deassertion

cal_debug_clk for DDR4

User calibration debug clock interface

Table 68. Interface: cal_debug_clk. Interface type: Clock Input
Port Name	Direction	Description
cal_debug_clk	Input	User clock domain

cal_debug_out_reset_n for DDR4

User calibration debug clock domain reset interface

Table 69. Interface: cal_debug_out_reset_n. Interface type: Reset Output
Port Name	Direction	Description
cal_debug_out_reset_n	Output	Reset for the user clock connecting to the Avalon calibration debug_out bus. Asynchronous assertion and synchronous deassertion

cal_debug_out_clk for DDR4

User calibration debug clock interface

Table 70. Interface: cal_debug_out_clk. Interface type: Clock Output
Port Name	Direction	Description
cal_debug_out_clk	Output	User clock domain

clks_sharing_master_out for DDR4

Core clocks sharing master interface

Table 71. Interface: clks_sharing_master_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_master_out	Output	This port should fanout to all the core clocks sharing slaves.

clks_sharing_slave_in for DDR4

Core clocks sharing slave input interface

Table 72. Interface: clks_sharing_slave_in. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_in	Input	This port should be connected to the core clocks sharing master.

clks_sharing_slave_out for DDR4

Core clocks sharing slave output interface

Table 73. Interface: clks_sharing_slave_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_out	Output	This port may be used to fanout to another core clocks sharing slave. Alternatively, the master can fanout to all slaves.

ctrl_amm for DDR4

Controller Avalon Memory-Mapped interface

Table 74. Interface: ctrl_amm. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
amm_ready	Output	Wait-request is asserted when controller is busy
amm_read	Input	Read request signal
amm_write	Input	Write request signal
amm_address	Input	Address for the read/write request
amm_readdata	Output	Read data
amm_writedata	Input	Write data
amm_burstcount	Input	Number of transfers in each read/write burst
amm_byteenable	Input	Byte-enable for write data
amm_beginbursttransfer	Input	Indicates when a burst is starting
amm_readdatavalid	Output	Indicates whether read data is valid

ctrl_auto_precharge for DDR4

Controller auto-precharge interface

Table 75. Interface: ctrl_auto_precharge. Interface type: Conduit
Port Name	Direction	Description
ctrl_auto_precharge_req	Input	When asserted high along with a read or write request to the memory controller, indicates that the controller should close the currently opened page after the read or write burst.

ctrl_user_priority for DDR4

Controller user-requested priority interface

Table 76. Interface: ctrl_user_priority. Interface type: Conduit
Port Name	Direction	Description
ctrl_user_priority_hi	Input	When asserted high along with a read or write request to the memory controller, indicates that the request is high priority and should be fullfilled before other low priority requests.

ctrl_ecc_user_interrupt for DDR4

Controller ECC user interrupt interface

Table 77. Interface: ctrl_ecc_user_interrupt. Interface type: Conduit
Port Name	Direction	Description
ctrl_ecc_user_interrupt	Output	Controller ECC user interrupt signal to determine whether there is a bit error

ctrl_mmr_slave for DDR4

Controller MMR slave interface

Table 78. Interface: ctrl_mmr_slave. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
mmr_slave_waitrequest	Output	Wait-request is asserted when controller MMR interface is busy
mmr_slave_read	Input	MMR read request signal
mmr_slave_write	Input	MMR write request signal
mmr_slave_address	Input	Word address for MMR interface of memory controller
mmr_slave_readdata	Output	MMR read data
mmr_slave_writedata	Input	MMR write data
mmr_slave_burstcount	Input	Number of transfers in each read/write burst
mmr_slave_beginbursttransfer	Input	Indicates when a burst is starting
mmr_slave_readdatavalid	Output	Indicates whether MMR read data is valid

hps_emif for DDR4

Conduit between Hard Processor Subsystem and memory interface

Table 79. Interface: hps_emif. Interface type: Conduit
Port Name	Direction	Description
hps_to_emif	Input	Signals coming from Hard Processor Subsystem to the memory interface
emif_to_hps	Output	Signals going to Hard Processor Subsystem from the memory interface
hps_to_emif_gp	Input	Signals coming from Hard Processor Subsystem GPIO to the memory interface
emif_to_hps_gp	Output	Signals going to Hard Processor Subsystem GPIO from the memory interface

cal_debug for DDR4

Calibration debug interface

Table 80. Interface: cal_debug. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
cal_debug_waitrequest	Output	Wait-request is asserted when controller is busy
cal_debug_read	Input	Read request signal
cal_debug_write	Input	Write request signal
cal_debug_addr	Input	Address for the read/write request
cal_debug_read_data	Output	Read data
cal_debug_write_data	Input	Write data
cal_debug_byteenable	Input	Byte-enable for write data
cal_debug_read_data_valid	Output	Indicates whether read data is valid

cal_debug_out for DDR4

Calibration debug interface

Table 81. Interface: cal_debug_out. Interface type: Avalon Memory-Mapped Master
Port Name	Direction	Description
cal_debug_out_waitrequest	Input	Wait-request is asserted when controller is busy
cal_debug_out_read	Output	Read request signal
cal_debug_out_write	Output	Write request signal
cal_debug_out_addr	Output	Address for the read/write request
cal_debug_out_read_data	Input	Read data
cal_debug_out_write_data	Output	Write data
cal_debug_out_byteenable	Output	Byte-enable for write data
cal_debug_out_read_data_valid	Input	Indicates whether read data is valid

Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme

Table 82. Interfaces for QDR II/II+/II+ Xtreme
Interface Name	Interface Type	Description
global_reset_n	Reset Input	Global reset interface
local_reset_req	Conduit	Local reset request interface
local_reset_status	Conduit	Local reset status interface
pll_ref_clk	Clock Input	PLL reference clock interface
pll_locked	Conduit	PLL lock status interface
pll_extra_clk_0	Clock Output	PLL extra core clock interface 0
pll_extra_clk_1	Clock Output	PLL extra core clock interface 1
pll_extra_clk_2	Clock Output	PLL extra core clock interface 2
pll_extra_clk_3	Clock Output	PLL extra core clock interface 3
oct	Conduit	On-Chip Termination (OCT) interface
mem	Conduit	Interface between FPGA and external memory
status	Conduit	PHY calibration status interface
emif_usr_reset_n	Reset Output	User clock domain reset interface
emif_usr_clk	Clock Output	User clock interface
cal_debug_reset_n	Reset Input	User calibration debug clock domain reset interface
cal_debug_clk	Clock Input	User calibration debug clock interface
cal_debug_out_reset_n	Reset Output	User calibration debug clock domain reset interface
cal_debug_out_clk	Clock Output	User calibration debug clock interface
clks_sharing_master_out	Conduit	Core clocks sharing master interface
clks_sharing_slave_in	Conduit	Core clocks sharing slave input interface
clks_sharing_slave_out	Conduit	Core clocks sharing slave output interface
ctrl_amm	Avalon Memory-Mapped Slave	Controller Avalon Memory-Mapped interface
hps_emif	Conduit	Conduit between Hard Processor Subsystem and memory interface
cal_debug	Avalon Memory-Mapped Slave	Calibration debug interface
cal_debug_out	Avalon Memory-Mapped Master	Calibration debug interface

global_reset_n for QDR II/II+/II+ Xtreme

Global reset interface

Table 83. Interface: global_reset_n. Interface type: Reset Input
Port Name	Direction	Description
global_reset_n	Input	Asynchronous reset causes the memory interface to be reset and recalibrated. The global reset signal applies to all memory interfaces placed within an I/O column.

local_reset_req for QDR II/II+/II+ Xtreme

Local reset request interface

Table 84. Interface: local_reset_req. Interface type: Conduit
Port Name	Direction	Description
local_reset_req	Input	Signal from user logic to request the memory interface to be reset and recalibrated. Reset request is sent by transitioning the local_reset_req signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low. local_reset_req is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.

local_reset_status for QDR II/II+/II+ Xtreme

Local reset status interface

Table 85. Interface: local_reset_status. Interface type: Conduit
Port Name	Direction	Description
local_reset_done	Output	Signal from memory interface to indicate whether it has completed a reset sequence, is currently out of reset, and is ready for a new reset request. When local_reset_done is low, the memory interface is in reset.

pll_ref_clk for QDR II/II+/II+ Xtreme

PLL reference clock interface

Table 86. Interface: pll_ref_clk. Interface type: Clock Input
Port Name	Direction	Description
pll_ref_clk	Input	PLL reference clock input

pll_locked for QDR II/II+/II+ Xtreme

PLL lock status interface

Table 87. Interface: pll_locked. Interface type: Conduit
Port Name	Direction	Description
pll_locked	Output	PLL lock signal to indicate whether the PLL has locked

pll_extra_clk_0 for QDR II/II+/II+ Xtreme

PLL extra core clock interface 0

Table 88. Interface: pll_extra_clk_0. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_0	Output	PLL extra core clock signal output 0. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_1 for QDR II/II+/II+ Xtreme

PLL extra core clock interface 1

Table 89. Interface: pll_extra_clk_1. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_1	Output	PLL extra core clock signal output 1. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_2 for QDR II/II+/II+ Xtreme

PLL extra core clock interface 2

Table 90. Interface: pll_extra_clk_2. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_2	Output	PLL extra core clock signal output 2. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_3 for QDR II/II+/II+ Xtreme

PLL extra core clock interface 3

Table 91. Interface: pll_extra_clk_3. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_3	Output	PLL extra core clock signal output 3. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

oct for QDR II/II+/II+ Xtreme

On-Chip Termination (OCT) interface

Table 92. Interface: oct. Interface type: Conduit
Port Name	Direction	Description
oct_rzqin	Input	Calibrated On-Chip Termination (OCT) RZQ input pin

mem for QDR II/II+/II+ Xtreme

Interface between FPGA and external memory

Table 93. Interface: mem. Interface type: Conduit
Port Name	Direction	Description
mem_ck	Output	CK clock
mem_ck_n	Output	CK clock (negative leg)
mem_k	Output	K clock
mem_k_n	Output	K clock (negative leg)
mem_a	Output	Address
mem_reset_n	Output	Asynchronous reset
mem_wps_n	Output	Write port select
mem_rps_n	Output	Read port select
mem_doff_n	Output	DLL turn off
mem_bws_n	Output	Byte write select
mem_d	Output	Write data
mem_q	Input	Read data
mem_cq	Input	Echo clock
mem_cq_n	Input	Echo clock (negative leg)

status for QDR II/II+/II+ Xtreme

PHY calibration status interface

Table 94. Interface: status. Interface type: Conduit
Port Name	Direction	Description
local_cal_success	Output	When high, indicates that PHY calibration was successful
local_cal_fail	Output	When high, indicates that PHY calibration failed

emif_usr_reset_n for QDR II/II+/II+ Xtreme

User clock domain reset interface

Table 95. Interface: emif_usr_reset_n. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion

emif_usr_clk for QDR II/II+/II+ Xtreme

User clock interface

Table 96. Interface: emif_usr_clk. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk	Output	User clock domain

cal_debug_reset_n for QDR II/II+/II+ Xtreme

User calibration debug clock domain reset interface

Table 97. Interface: cal_debug_reset_n. Interface type: Reset Input
Port Name	Direction	Description
cal_debug_reset_n	Input	Reset for the user clock connecting to the Avalon calibration debug bus. Asynchronous assertion and synchronous deassertion

cal_debug_clk for QDR II/II+/II+ Xtreme

User calibration debug clock interface

Table 98. Interface: cal_debug_clk. Interface type: Clock Input
Port Name	Direction	Description
cal_debug_clk	Input	User clock domain

cal_debug_out_reset_n for QDR II/II+/II+ Xtreme

User calibration debug clock domain reset interface

Table 99. Interface: cal_debug_out_reset_n. Interface type: Reset Output
Port Name	Direction	Description
cal_debug_out_reset_n	Output	Reset for the user clock connecting to the Avalon calibration debug_out bus. Asynchronous assertion and synchronous deassertion

cal_debug_out_clk for QDR II/II+/II+ Xtreme

User calibration debug clock interface

Table 100. Interface: cal_debug_out_clk. Interface type: Clock Output
Port Name	Direction	Description
cal_debug_out_clk	Output	User clock domain

clks_sharing_master_out for QDR II/II+/II+ Xtreme

Core clocks sharing master interface

Table 101. Interface: clks_sharing_master_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_master_out	Output	This port should fanout to all the core clocks sharing slaves.

clks_sharing_slave_in for QDR II/II+/II+ Xtreme

Core clocks sharing slave input interface

Table 102. Interface: clks_sharing_slave_in. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_in	Input	This port should be connected to the core clocks sharing master.

clks_sharing_slave_out for QDR II/II+/II+ Xtreme

Core clocks sharing slave output interface

Table 103. Interface: clks_sharing_slave_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_out	Output	This port may be used to fanout to another core clocks sharing slave. Alternatively, the master can fanout to all slaves.

ctrl_amm for QDR II/II+/II+ Xtreme

Controller Avalon Memory-Mapped interface

Table 104. Interface: ctrl_amm. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
amm_ready	Output	Wait-request is asserted when controller is busy
amm_read	Input	Read request signal
amm_write	Input	Write request signal
amm_address	Input	Address for the read/write request
amm_readdata	Output	Read data
amm_writedata	Input	Write data
amm_burstcount	Input	Number of transfers in each read/write burst
amm_byteenable	Input	Byte-enable for write data
amm_beginbursttransfer	Input	Indicates when a burst is starting
amm_readdatavalid	Output	Indicates whether read data is valid

hps_emif for QDR II/II+/II+ Xtreme

Conduit between Hard Processor Subsystem and memory interface

Table 105. Interface: hps_emif. Interface type: Conduit
Port Name	Direction	Description
hps_to_emif	Input	Signals coming from Hard Processor Subsystem to the memory interface
emif_to_hps	Output	Signals going to Hard Processor Subsystem from the memory interface
hps_to_emif_gp	Input	Signals coming from Hard Processor Subsystem GPIO to the memory interface
emif_to_hps_gp	Output	Signals going to Hard Processor Subsystem GPIO from the memory interface

cal_debug for QDR II/II+/II+ Xtreme

Calibration debug interface

Table 106. Interface: cal_debug. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
cal_debug_waitrequest	Output	Wait-request is asserted when controller is busy
cal_debug_read	Input	Read request signal
cal_debug_write	Input	Write request signal
cal_debug_addr	Input	Address for the read/write request
cal_debug_read_data	Output	Read data
cal_debug_write_data	Input	Write data
cal_debug_byteenable	Input	Byte-enable for write data
cal_debug_read_data_valid	Output	Indicates whether read data is valid

cal_debug_out for QDR II/II+/II+ Xtreme

Calibration debug interface

Table 107. Interface: cal_debug_out. Interface type: Avalon Memory-Mapped Master
Port Name	Direction	Description
cal_debug_out_waitrequest	Input	Wait-request is asserted when controller is busy
cal_debug_out_read	Output	Read request signal
cal_debug_out_write	Output	Write request signal
cal_debug_out_addr	Output	Address for the read/write request
cal_debug_out_read_data	Input	Read data
cal_debug_out_write_data	Output	Write data
cal_debug_out_byteenable	Output	Byte-enable for write data
cal_debug_out_read_data_valid	Input	Indicates whether read data is valid

Intel Stratix 10 EMIF IP Interfaces for QDR-IV

Table 108. Interfaces for QDR-IV
Interface Name	Interface Type	Description
global_reset_n	Reset Input	Global reset interface
local_reset_req	Conduit	Local reset request interface
local_reset_status	Conduit	Local reset status interface
pll_ref_clk	Clock Input	PLL reference clock interface
pll_locked	Conduit	PLL lock status interface
pll_extra_clk_0	Clock Output	PLL extra core clock interface 0
pll_extra_clk_1	Clock Output	PLL extra core clock interface 1
pll_extra_clk_2	Clock Output	PLL extra core clock interface 2
pll_extra_clk_3	Clock Output	PLL extra core clock interface 3
oct	Conduit	On-Chip Termination (OCT) interface
mem	Conduit	Interface between FPGA and external memory
status	Conduit	PHY calibration status interface
afi_reset_n	Reset Output	AFI reset interface
afi_clk	Clock Output	AFI clock interface
afi_half_clk	Clock Output	AFI half-rate clock interface
afi	Conduit	Altera PHY Interface (AFI)
emif_usr_reset_n	Reset Output	User clock domain reset interface
emif_usr_clk	Clock Output	User clock interface
cal_debug_reset_n	Reset Input	User calibration debug clock domain reset interface
cal_debug_clk	Clock Input	User calibration debug clock interface
cal_debug_out_reset_n	Reset Output	User calibration debug clock domain reset interface
cal_debug_out_clk	Clock Output	User calibration debug clock interface
clks_sharing_master_out	Conduit	Core clocks sharing master interface
clks_sharing_slave_in	Conduit	Core clocks sharing slave input interface
clks_sharing_slave_out	Conduit	Core clocks sharing slave output interface
ctrl_amm	Avalon Memory-Mapped Slave	Controller Avalon Memory-Mapped interface
hps_emif	Conduit	Conduit between Hard Processor Subsystem and memory interface
cal_debug	Avalon Memory-Mapped Slave	Calibration debug interface
cal_debug_out	Avalon Memory-Mapped Master	Calibration debug interface

global_reset_n for QDR-IV

Global reset interface

Table 109. Interface: global_reset_n. Interface type: Reset Input
Port Name	Direction	Description
global_reset_n	Input	Asynchronous reset causes the memory interface to be reset and recalibrated. The global reset signal applies to all memory interfaces placed within an I/O column.

local_reset_req for QDR-IV

Local reset request interface

Table 110. Interface: local_reset_req. Interface type: Conduit
Port Name	Direction	Description
local_reset_req	Input	Signal from user logic to request the memory interface to be reset and recalibrated. Reset request is sent by transitioning the local_reset_req signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low. local_reset_req is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.

local_reset_status for QDR-IV

Local reset status interface

Table 111. Interface: local_reset_status. Interface type: Conduit
Port Name	Direction	Description
local_reset_done	Output	Signal from memory interface to indicate whether it has completed a reset sequence, is currently out of reset, and is ready for a new reset request. When local_reset_done is low, the memory interface is in reset.

pll_ref_clk for QDR-IV

PLL reference clock interface

Table 112. Interface: pll_ref_clk. Interface type: Clock Input
Port Name	Direction	Description
pll_ref_clk	Input	PLL reference clock input

pll_locked for QDR-IV

PLL lock status interface

Table 113. Interface: pll_locked. Interface type: Conduit
Port Name	Direction	Description
pll_locked	Output	PLL lock signal to indicate whether the PLL has locked

pll_extra_clk_0 for QDR-IV

PLL extra core clock interface 0

Table 114. Interface: pll_extra_clk_0. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_0	Output	PLL extra core clock signal output 0. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_1 for QDR-IV

PLL extra core clock interface 1

Table 115. Interface: pll_extra_clk_1. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_1	Output	PLL extra core clock signal output 1. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_2 for QDR-IV

PLL extra core clock interface 2

Table 116. Interface: pll_extra_clk_2. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_2	Output	PLL extra core clock signal output 2. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_3 for QDR-IV

PLL extra core clock interface 3

Table 117. Interface: pll_extra_clk_3. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_3	Output	PLL extra core clock signal output 3. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

oct for QDR-IV

On-Chip Termination (OCT) interface

Table 118. Interface: oct. Interface type: Conduit
Port Name	Direction	Description
oct_rzqin	Input	Calibrated On-Chip Termination (OCT) RZQ input pin

mem for QDR-IV

Interface between FPGA and external memory

Table 119. Interface: mem. Interface type: Conduit
Port Name	Direction	Description
mem_ck	Output	CK clock
mem_ck_n	Output	CK clock (negative leg)
mem_dka	Output	DK clock for port A
mem_dka_n	Output	DK clock for port A (negative leg)
mem_dkb	Output	DK clock for port B
mem_dkb_n	Output	DK clock for port B (negative leg)
mem_a	Output	Address
mem_reset_n	Output	Asynchronous reset
mem_lda_n	Output	Synchronous load for port A
mem_ldb_n	Output	Synchronous load for port B
mem_rwa_n	Output	Synchronous read/write for port A
mem_rwb_n	Output	Synchronous read/write for port B
mem_lbk0_n	Output	Loopback mode
mem_lbk1_n	Output	Loopback mode
mem_cfg_n	Output	Configuration bit
mem_ap	Output	Address parity
mem_ainv	Output	Address inversion
mem_dqa	Bidirectional	Read/write data for port A
mem_dqb	Bidirectional	Read/write data for port B
mem_dinva	Bidirectional	Read/write data inversion for port A
mem_dinvb	Bidirectional	Read/write data inversion for port B
mem_qka	Input	Read data clock for port A
mem_qka_n	Input	Read data clock for port A (negative leg)
mem_qkb	Input	Read data clock for port B
mem_qkb_n	Input	Read data clock for port B (negative leg)
mem_pe_n	Input	Address parity error flag

status for QDR-IV

PHY calibration status interface

Table 120. Interface: status. Interface type: Conduit
Port Name	Direction	Description
local_cal_success	Output	When high, indicates that PHY calibration was successful
local_cal_fail	Output	When high, indicates that PHY calibration failed

afi_reset_n for QDR-IV

AFI reset interface

Table 121. Interface: afi_reset_n. Interface type: Reset Output
Port Name	Direction	Description
afi_reset_n	Output	Reset for the AFI clock domain. Asynchronous assertion and synchronous deassertion

afi_clk for QDR-IV

AFI clock interface

Table 122. Interface: afi_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_clk	Output	Clock for the Altera PHY Interface (AFI)

afi_half_clk for QDR-IV

AFI half-rate clock interface

Table 123. Interface: afi_half_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_half_clk	Output	Clock running at half the frequency of the AFI clock afi_clk

afi for QDR-IV

Altera PHY Interface (AFI)

Table 124. Interface: afi. Interface type: Conduit
Port Name	Direction	Description
afi_ld_n	Input	Synchronous load for port A and B
afi_rw_n	Input	Synchronous read/write for port A and B
afi_lbk0_n	Input	Loopback mode
afi_lbk1_n	Input	Loopback mode
afi_cfg_n	Input	Configuration bit
afi_ap	Input	Address parity
afi_ainv	Input	Address inversion
afi_rdata_dinv	Output	Data inversion for read data
afi_wdata_dinv	Input	Data inversion for write data
afi_pe_n	Output	Address parity error flag

emif_usr_reset_n for QDR-IV

User clock domain reset interface

Table 125. Interface: emif_usr_reset_n. Interface type: Reset Output
Port Name	Direction	Description
emif_usr_reset_n	Output	Reset for the user clock domain. Asynchronous assertion and synchronous deassertion

emif_usr_clk for QDR-IV

User clock interface

Table 126. Interface: emif_usr_clk. Interface type: Clock Output
Port Name	Direction	Description
emif_usr_clk	Output	User clock domain

cal_debug_reset_n for QDR-IV

User calibration debug clock domain reset interface

Table 127. Interface: cal_debug_reset_n. Interface type: Reset Input
Port Name	Direction	Description
cal_debug_reset_n	Input	Reset for the user clock connecting to the Avalon calibration debug bus. Asynchronous assertion and synchronous deassertion

cal_debug_clk for QDR-IV

User calibration debug clock interface

Table 128. Interface: cal_debug_clk. Interface type: Clock Input
Port Name	Direction	Description
cal_debug_clk	Input	User clock domain

cal_debug_out_reset_n for QDR-IV

User calibration debug clock domain reset interface

Table 129. Interface: cal_debug_out_reset_n. Interface type: Reset Output
Port Name	Direction	Description
cal_debug_out_reset_n	Output	Reset for the user clock connecting to the Avalon calibration debug_out bus. Asynchronous assertion and synchronous deassertion

cal_debug_out_clk for QDR-IV

User calibration debug clock interface

Table 130. Interface: cal_debug_out_clk. Interface type: Clock Output
Port Name	Direction	Description
cal_debug_out_clk	Output	User clock domain

clks_sharing_master_out for QDR-IV

Core clocks sharing master interface

Table 131. Interface: clks_sharing_master_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_master_out	Output	This port should fanout to all the core clocks sharing slaves.

clks_sharing_slave_in for QDR-IV

Core clocks sharing slave input interface

Table 132. Interface: clks_sharing_slave_in. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_in	Input	This port should be connected to the core clocks sharing master.

clks_sharing_slave_out for QDR-IV

Core clocks sharing slave output interface

Table 133. Interface: clks_sharing_slave_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_out	Output	This port may be used to fanout to another core clocks sharing slave. Alternatively, the master can fanout to all slaves.

ctrl_amm for QDR-IV

Controller Avalon Memory-Mapped interface

Table 134. Interface: ctrl_amm. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
amm_ready	Output	Wait-request is asserted when controller is busy
amm_read	Input	Read request signal
amm_write	Input	Write request signal
amm_address	Input	Address for the read/write request
amm_readdata	Output	Read data
amm_writedata	Input	Write data
amm_burstcount	Input	Number of transfers in each read/write burst
amm_beginbursttransfer	Input	Indicates when a burst is starting
amm_readdatavalid	Output	Indicates whether read data is valid

hps_emif for QDR-IV

Conduit between Hard Processor Subsystem and memory interface

Table 135. Interface: hps_emif. Interface type: Conduit
Port Name	Direction	Description
hps_to_emif	Input	Signals coming from Hard Processor Subsystem to the memory interface
emif_to_hps	Output	Signals going to Hard Processor Subsystem from the memory interface
hps_to_emif_gp	Input	Signals coming from Hard Processor Subsystem GPIO to the memory interface
emif_to_hps_gp	Output	Signals going to Hard Processor Subsystem GPIO from the memory interface

cal_debug for QDR-IV

Calibration debug interface

Table 136. Interface: cal_debug. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
cal_debug_waitrequest	Output	Wait-request is asserted when controller is busy
cal_debug_read	Input	Read request signal
cal_debug_write	Input	Write request signal
cal_debug_addr	Input	Address for the read/write request
cal_debug_read_data	Output	Read data
cal_debug_write_data	Input	Write data
cal_debug_byteenable	Input	Byte-enable for write data
cal_debug_read_data_valid	Output	Indicates whether read data is valid

cal_debug_out for QDR-IV

Calibration debug interface

Table 137. Interface: cal_debug_out. Interface type: Avalon Memory-Mapped Master
Port Name	Direction	Description
cal_debug_out_waitrequest	Input	Wait-request is asserted when controller is busy
cal_debug_out_read	Output	Read request signal
cal_debug_out_write	Output	Write request signal
cal_debug_out_addr	Output	Address for the read/write request
cal_debug_out_read_data	Input	Read data
cal_debug_out_write_data	Output	Write data
cal_debug_out_byteenable	Output	Byte-enable for write data
cal_debug_out_read_data_valid	Input	Indicates whether read data is valid

Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3

Table 138. Interfaces for RLDRAM 3
Interface Name	Interface Type	Description
global_reset_n	Reset Input	Global reset interface
local_reset_req	Conduit	Local reset request interface
local_reset_status	Conduit	Local reset status interface
pll_ref_clk	Clock Input	PLL reference clock interface
pll_locked	Conduit	PLL lock status interface
pll_extra_clk_0	Clock Output	PLL extra core clock interface 0
pll_extra_clk_1	Clock Output	PLL extra core clock interface 1
pll_extra_clk_2	Clock Output	PLL extra core clock interface 2
pll_extra_clk_3	Clock Output	PLL extra core clock interface 3
oct	Conduit	On-Chip Termination (OCT) interface
mem	Conduit	Interface between FPGA and external memory
status	Conduit	PHY calibration status interface
afi_reset_n	Reset Output	AFI reset interface
afi_clk	Clock Output	AFI clock interface
afi_half_clk	Clock Output	AFI half-rate clock interface
afi	Conduit	Altera PHY Interface (AFI)
cal_debug_reset_n	Reset Input	User calibration debug clock domain reset interface
cal_debug_clk	Clock Input	User calibration debug clock interface
cal_debug_out_reset_n	Reset Output	User calibration debug clock domain reset interface
cal_debug_out_clk	Clock Output	User calibration debug clock interface
clks_sharing_master_out	Conduit	Core clocks sharing master interface
clks_sharing_slave_in	Conduit	Core clocks sharing slave input interface
clks_sharing_slave_out	Conduit	Core clocks sharing slave output interface
hps_emif	Conduit	Conduit between Hard Processor Subsystem and memory interface
cal_debug	Avalon Memory-Mapped Slave	Calibration debug interface
cal_debug_out	Avalon Memory-Mapped Master	Calibration debug interface

global_reset_n for RLDRAM 3

Global reset interface

Table 139. Interface: global_reset_n. Interface type: Reset Input
Port Name	Direction	Description
global_reset_n	Input	Asynchronous reset causes the memory interface to be reset and recalibrated. The global reset signal applies to all memory interfaces placed within an I/O column.

local_reset_req for RLDRAM 3

Local reset request interface

Table 140. Interface: local_reset_req. Interface type: Conduit
Port Name	Direction	Description
local_reset_req	Input	Signal from user logic to request the memory interface to be reset and recalibrated. Reset request is sent by transitioning the local_reset_req signal from low to high, then keeping the signal at the high state for a minimum of 2 EMIF core clock cycles, then transitioning the signal from high to low. local_reset_req is asynchronous in that there is no setup/hold timing to meet, but it must meet the minimum pulse width requirement of 2 EMIF core clock cycles.

local_reset_status for RLDRAM 3

Local reset status interface

Table 141. Interface: local_reset_status. Interface type: Conduit
Port Name	Direction	Description
local_reset_done	Output	Signal from memory interface to indicate whether it has completed a reset sequence, is currently out of reset, and is ready for a new reset request. When local_reset_done is low, the memory interface is in reset.

pll_ref_clk for RLDRAM 3

PLL reference clock interface

Table 142. Interface: pll_ref_clk. Interface type: Clock Input
Port Name	Direction	Description
pll_ref_clk	Input	PLL reference clock input

pll_locked for RLDRAM 3

PLL lock status interface

Table 143. Interface: pll_locked. Interface type: Conduit
Port Name	Direction	Description
pll_locked	Output	PLL lock signal to indicate whether the PLL has locked

pll_extra_clk_0 for RLDRAM 3

PLL extra core clock interface 0

Table 144. Interface: pll_extra_clk_0. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_0	Output	PLL extra core clock signal output 0. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_1 for RLDRAM 3

PLL extra core clock interface 1

Table 145. Interface: pll_extra_clk_1. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_1	Output	PLL extra core clock signal output 1. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_2 for RLDRAM 3

PLL extra core clock interface 2

Table 146. Interface: pll_extra_clk_2. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_2	Output	PLL extra core clock signal output 2. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

pll_extra_clk_3 for RLDRAM 3

PLL extra core clock interface 3

Table 147. Interface: pll_extra_clk_3. Interface type: Clock Output
Port Name	Direction	Description
pll_extra_clk_3	Output	PLL extra core clock signal output 3. This signal exists if you specify the EMIF PLL to generate additional output clock signals (up to 4) that can be used by user logic. This clock signal is asynchronous to the memory interface core clock domains (such as emif_usr_clk or afi_clk). You must follow proper clock-domain-crossing techniques when transferring data between clock domains.

oct for RLDRAM 3

On-Chip Termination (OCT) interface

Table 148. Interface: oct. Interface type: Conduit
Port Name	Direction	Description
oct_rzqin	Input	Calibrated On-Chip Termination (OCT) RZQ input pin

mem for RLDRAM 3

Interface between FPGA and external memory

Table 149. Interface: mem. Interface type: Conduit
Port Name	Direction	Description
mem_ck	Output	CK clock
mem_ck_n	Output	CK clock (negative leg)
mem_dk	Output	DK clock
mem_dk_n	Output	DK clock (negative leg)
mem_a	Output	Address
mem_ba	Output	Bank address
mem_cs_n	Output	Chip select
mem_rm	Output	Rank multiplication for LRDIMM. Typically, mem_rm[0] and mem_rm[1] connect to CS2# and CS3# of the memory buffer of all LRDIMM slots.
mem_we_n	Output	WE command
mem_reset_n	Output	Asynchronous reset
mem_ref_n	Output	REF command
mem_dm	Output	Write data mask
mem_dq	Bidirectional	Read/write data
mem_qk	Input	Read data clock
mem_qk_n	Input	Read data clock (negative leg)

status for RLDRAM 3

PHY calibration status interface

Table 150. Interface: status. Interface type: Conduit
Port Name	Direction	Description
local_cal_success	Output	When high, indicates that PHY calibration was successful
local_cal_fail	Output	When high, indicates that PHY calibration failed

afi_reset_n for RLDRAM 3

AFI reset interface

Table 151. Interface: afi_reset_n. Interface type: Reset Output
Port Name	Direction	Description
afi_reset_n	Output	Reset for the AFI clock domain. Asynchronous assertion and synchronous deassertion

afi_clk for RLDRAM 3

AFI clock interface

Table 152. Interface: afi_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_clk	Output	Clock for the Altera PHY Interface (AFI)

afi_half_clk for RLDRAM 3

AFI half-rate clock interface

Table 153. Interface: afi_half_clk. Interface type: Clock Output
Port Name	Direction	Description
afi_half_clk	Output	Clock running at half the frequency of the AFI clock afi_clk

afi for RLDRAM 3

Altera PHY Interface (AFI)

Table 154. Interface: afi. Interface type: Conduit
Port Name	Direction	Description
afi_cal_success	Output	Signals calibration successful completion
afi_cal_fail	Output	Signals calibration failure
afi_cal_req	Input	When asserted, the interface is recalibrated
afi_rlat	Output	Latency in afi_clk cycles between read command and read data valid
afi_wlat	Output	Latency in afi_clk cycles between write command and write data valid
afi_addr	Input	Address
afi_ba	Input	Bank address
afi_cs_n	Input	Chip select
afi_we_n	Input	WE command
afi_rst_n	Input	Asynchronous reset
afi_ref_n	Input	REF command
afi_dm	Input	Write data mask
afi_wdata_valid	Input	Asserted by the controller to indicate that afi_wdata contains valid write data
afi_wdata	Input	Write data
afi_rdata_en_full	Input	Asserted by the controller to indicate the amount of relevant read data expected
afi_rdata	Output	Read data
afi_rdata_valid	Output	Asserted by the PHY to indicate that afi_rdata contains valid read data
afi_rrank	Input	Asserted by the controller to indicate which rank is being read from, to control shadow register switching
afi_wrank	Input	Asserted by the controller to indicate which rank is being written to, to control shadow register switching

cal_debug_reset_n for RLDRAM 3

User calibration debug clock domain reset interface

Table 155. Interface: cal_debug_reset_n. Interface type: Reset Input
Port Name	Direction	Description
cal_debug_reset_n	Input	Reset for the user clock connecting to the Avalon calibration debug bus. Asynchronous assertion and synchronous deassertion

cal_debug_clk for RLDRAM 3

User calibration debug clock interface

Table 156. Interface: cal_debug_clk. Interface type: Clock Input
Port Name	Direction	Description
cal_debug_clk	Input	User clock domain

cal_debug_out_reset_n for RLDRAM 3

User calibration debug clock domain reset interface

Table 157. Interface: cal_debug_out_reset_n. Interface type: Reset Output
Port Name	Direction	Description
cal_debug_out_reset_n	Output	Reset for the user clock connecting to the Avalon calibration debug_out bus. Asynchronous assertion and synchronous deassertion

cal_debug_out_clk for RLDRAM 3

User calibration debug clock interface

Table 158. Interface: cal_debug_out_clk. Interface type: Clock Output
Port Name	Direction	Description
cal_debug_out_clk	Output	User clock domain

clks_sharing_master_out for RLDRAM 3

Core clocks sharing master interface

Table 159. Interface: clks_sharing_master_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_master_out	Output	This port should fanout to all the core clocks sharing slaves.

clks_sharing_slave_in for RLDRAM 3

Core clocks sharing slave input interface

Table 160. Interface: clks_sharing_slave_in. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_in	Input	This port should be connected to the core clocks sharing master.

clks_sharing_slave_out for RLDRAM 3

Core clocks sharing slave output interface

Table 161. Interface: clks_sharing_slave_out. Interface type: Conduit
Port Name	Direction	Description
clks_sharing_slave_out	Output	This port may be used to fanout to another core clocks sharing slave. Alternatively, the master can fanout to all slaves.

hps_emif for RLDRAM 3

Conduit between Hard Processor Subsystem and memory interface

Table 162. Interface: hps_emif. Interface type: Conduit
Port Name	Direction	Description
hps_to_emif	Input	Signals coming from Hard Processor Subsystem to the memory interface
emif_to_hps	Output	Signals going to Hard Processor Subsystem from the memory interface
hps_to_emif_gp	Input	Signals coming from Hard Processor Subsystem GPIO to the memory interface
emif_to_hps_gp	Output	Signals going to Hard Processor Subsystem GPIO from the memory interface

cal_debug for RLDRAM 3

Calibration debug interface

Table 163. Interface: cal_debug. Interface type: Avalon Memory-Mapped Slave
Port Name	Direction	Description
cal_debug_waitrequest	Output	Wait-request is asserted when controller is busy
cal_debug_read	Input	Read request signal
cal_debug_write	Input	Write request signal
cal_debug_addr	Input	Address for the read/write request
cal_debug_read_data	Output	Read data
cal_debug_write_data	Input	Write data
cal_debug_byteenable	Input	Byte-enable for write data
cal_debug_read_data_valid	Output	Indicates whether read data is valid

cal_debug_out for RLDRAM 3

Calibration debug interface

Table 164. Interface: cal_debug_out. Interface type: Avalon Memory-Mapped Master
Port Name	Direction	Description
cal_debug_out_waitrequest	Input	Wait-request is asserted when controller is busy
cal_debug_out_read	Output	Read request signal
cal_debug_out_write	Output	Write request signal
cal_debug_out_addr	Output	Address for the read/write request
cal_debug_out_read_data	Input	Read data
cal_debug_out_write_data	Output	Write data
cal_debug_out_byteenable	Output	Byte-enable for write data
cal_debug_out_read_data_valid	Input	Indicates whether read data is valid

AFI Signals

The following tables list Altera PHY interface (AFI) signals grouped according to their functions.

In each table, the Direction column denotes the direction of the signal relative to the PHY. For example, a signal defined as an output passes out of the PHY to the controller. The AFI specification does not include any bidirectional signals.

Not all signals are used for all protocols.

AFI Clock and Reset Signals

The AFI interface provides up to two clock signals and an asynchronous reset signal.

Table 165. Clock and Reset Signals
Signal Name	Direction	Width	Description
afi_clk	Output	1	Clock with which all data exchanged on the AFI bus is synchronized. In general, this clock is referred to as full-rate, half-rate, or quarter-rate, depending on the ratio between the frequency of this clock and the frequency of the memory device clock.
afi_half_clk	Output	1	Clock signal that runs at half the speed of the afi_clk. The controller uses this signal when the half-rate bridge feature is in use. This signal is optional.
afi_reset_n	Output	1	Asynchronous reset output signal. You must synchronize this signal to the clock domain in which you use it.

AFI Address and Command Signals

The address and command signals for AFI 4.0 encode read/write/configuration commands to send to the memory device. The address and command signals are single-data rate signals.

Table 166. Address and Command Signals
Signal Name	Direction	Width	Description
afi_addr	Input	AFI_ADDR_WIDTH	Address.
afi_bg	Input	AFI_BANKGROUP_WIDTH	Bank group (DDR4 only).
afi_ba	Input	AFI_BANKADDR_WIDTH	Bank address.
afi_cke	Input	AFI_CLK_EN_WIDTH	Clock enable.
afi_cs_n	Input	AFI_CS_WIDTH	Chip select signal. (The number of chip selects may not match the number of ranks; for example, RDIMMs and LRDIMMs require a minimum of 2 chip select signals for both single-rank and dual-rank configurations. Consult your memory device data sheet for information about chip select signal width.)
afi_ras_n	Input	AFI_CONTROL_WIDTH	RAS# (for DDR3 memory devices.)
afi_we_n	Input	AFI_CONTROL_WIDTH	WE# (for DDR3 memory devices.)
afi_rw_n	Input	AFI_CONTROL_WIDTH * 2	RWA/B# (QDR-IV).
afi_cas_n	Input	AFI_CONTROL_WIDTH	CAS# (for DDR3 memory devices.)
afi_act_n	Input	AFI_CONTROL_WIDTH	ACT# (DDR4).
afi_rst_n	Input	AFI_CONTROL_WIDTH	RESET# (for DDR3 and DDR4 memory devices.)
afi_odt	Input	AFI_CLK_EN_WIDTH	On-die termination signal for DDR3 memory devices. (Do not confuse this memory device signal with the FPGA’s internal on-chip termination signal.)
afi_par	Input	AFI_CS_WIDTH	Address and command parity input. (DDR4) Address parity input. (QDR-IV)
afi_ainv	Input	AFI_CONTROL_WIDTH	Address inversion. (QDR-IV)
afi_mem_clk_disable	Input	AFI_CLK_PAIR_COUNT	When this signal is asserted, mem_clk and mem_clk_n are disabled. This signal is used in low-power mode.
afi_wps_n	Output	AFI_CS_WIDTH	WPS (for QDR II/II+ memory devices.)
afi_rps_n	Output	AFI_CS_WIDTH	RPS (for QDR II/II+ memory devices.)

AFI Write Data Signals

Write Data Signals for AFI 4.0 control the data, data mask, and strobe signals passed to the memory device during write operations.

Table 167. Write Data Signals
Signal Name	Direction	Width	Description
afi_dqs_burst	Input	AFI_RATE_RATIO	Controls the enable on the strobe (DQS) pins for DDR3 memory devices. When this signal is asserted, mem_dqs and mem_dqsn are driven. This signal must be asserted before afi_wdata_valid to implement the write preamble, and must be driven for the correct duration to generate a correctly timed mem_dqs signal.
afi_wdata_valid	Input	AFI_RATE_RATIO	Write data valid signal. This signal controls the output enable on the data and data mask pins.
afi_wdata	Input	AFI_DQ_WIDTH	Write data signal to send to the memory device at double-data rate. This signal controls the PHY’s mem_dq output.
afi_dm	Input	AFI_DM_WIDTH	Data mask. This signal controls the PHY’s mem_dm signal for DDR3 memory devices.) Also directly controls the PHY's mem_dbi signal for DDR4. The mem_dm and mem_dbi features share the same port on the memory device.
afi_bws_n	Input	AFI_DM_WIDTH	Data mask. This signal controls the PHY’s mem_bws_n signal for QDR II/II+ memory devices.
afi_dinv	Input	AFI_WRITE_DQS_WIDTH * 2	Data inversion. It directly controls the PHY's mem_dinva/b signal for QDR-IV devices.

AFI Read Data Signals

Read Data Signals for AFI 4.0 control the data sent from the memory device during read operations.

Table 168. Read Data Signals
Signal Name	Direction	Width	Description
afi_rdata_en_full	Input	AFI_RATE_RATIO	Read data enable full. Indicates that the memory controller is currently performing a read operation. This signal is held high for the entire read burst.If this signal is aligned to even clock cycles, it is possible to use 1-bit even in half-rate mode (i.e., AFI_RATE=2).
afi_rdata	Output	AFI_DQ_WIDTH	Read data from the memory device. This data is considered valid only when afi_rdata_valid is asserted by the PHY.
afi_rdata_valid	Output	AFI_RATE_RATIO	Read data valid. When asserted, this signal indicates that the afi_rdata bus is valid.If this signal is aligned to even clock cycles, it is possible to use 1-bit even in half-rate mode (i.e., AFI_RATE=2).

AFI Calibration Status Signals

The PHY instantiates a sequencer which calibrates the memory interface with the memory device and some internal components such as read FIFOs and valid FIFOs. The sequencer reports the results of the calibration process to the controller through the Calibration Status Signals in the AFI interface.

Table 169. Calibration Status Signals
Signal Name	Direction	Width	Description
afi_cal_success	Output	1	Asserted to indicate that calibration has completed successfully.
afi_cal_fail	Output	1	Asserted to indicate that calibration has failed.
afi_cal_req	Input	1	Effectively a synchronous reset for the sequencer. When this signal is asserted, the sequencer returns to the reset state; when this signal is released, a new calibration sequence begins.
afi_wlat	Output	AFI_WLAT_WIDTH	The required write latency in afi_clk cycles, between address/command and write data being issued at the PHY/controller interface. The afi_wlat value can be different for different groups; each group’s write latency can range from 0 to 63. If write latency is the same for all groups, only the lowest 6 bits are required.
afi_rlat *⁽¹⁾*	Output	AFI_RLAT_WIDTH	The required read latency in afi_clk cycles between address/command and read data being returned to the PHY/controller interface. Values can range from 0 to 63.
Note to Table: The `afi_rlat` signal is not supported for PHY-only designs. Instead, you can sample the `afi_rdata_valid` signal to determine when valid read data is available.

AFI Tracking Management Signals

When tracking management is enabled, the sequencer can take control over the AFI 4.0 interface at given intervals, and issue commands to the memory device to track the internal DQS Enable signal alignment to the DQS signal returning from the memory device. The tracking management portion of the AFI 4.0 interface provides a means for the sequencer and the controller to exchange handshake signals.

Table 170. Tracking Management Signals
Signal Name	Direction	Width	Description
afi_ctl_refresh_done	Input	4	Handshaking signal from controller to tracking manager, indicating that a refresh has occurred and waiting for a response.
afi_seq_busy	Output	4	Handshaking signal from sequencer to controller, indicating when DQS tracking is in progress.
afi_ctl_long_idle	Input	4	Handshaking signal from controller to tracking manager, indicating that it has exited low power state without a periodic refresh, and waiting for response.

AFI Shadow Register Management Signals

Shadow registers are a feature that enables high-speed multi-rank support. Shadow registers allow the sequencer to calibrate each rank separately, and save the calibrated settings—such as deskew delay-chain configurations—of each rank in its own set of shadow registers.

During a rank-to-rank switch, the correct set of calibrated settings is restored just in time to optimize the data valid window. The PHY relies on additional AFI signals to control which set of shadow registers to activate.

Table 171. Shadow Register Management Signals
Signal Name	Direction	Width	Description
afi_wrank	Input	AFI_WRANK_WIDTH	Signal from controller specifying which rank the write data is going to. The signal timing is identical to that of afi_dqs_burst. That is, afi_wrank must be asserted at the same time and must last the same duration as the afi_dqs_burst signal.
afi_rrank	Output	AFI_RRANK_WIDTH	Signal from controller specifying which rank is being read. The signal must be asserted at the same time as the afi_rdata_en signal when issuing a read command, but unlike afi_rdata_en, afi_rrank is stateful. That is, once asserted, the signal value must remain unchanged until the controller issues a new read command to a different rank.

Both the afi_wrank and afi_rrank signals encode the rank being accessed using the one-hot scheme (e.g. in a quad-rank interface, 0001, 0010, 0100, 1000 refer to the 1^st, 2^nd, 3^rd, 4^th rank respectively). The ordering within the bus is the same as other AFI signals. Specifically the bus is ordered by time slots, for example:

Half-rate afi_w/rrank = {T1, T0}

Quarter-rate afi_w/rrank = {T3, T2, T1, T0}

Where Tx is a number of rank-bit words that one-hot encodes the rank being accessed at the y ^th full-rate cycle.

Additional Requirements for Shadow Register Support

To ensure that the hardware has enough time to switch from one shadow register to another, the controller must satisfy the following minimum rank-to-rank-switch delays (tRTRS):

Two read commands going to different ranks must be separated by a minimum of 3 full-rate cycles (in addition to the burst length delay needed to avoid collision of data bursts).
Two write commands going to different rank must be separated by a minimum of 4 full-rate cycles (in addition to the burst length delay needed to avoid collision of data bursts).

The FPGA device supports a maximum of 4 sets of shadow registers, each for an independent set of timings. More than 4 ranks are supported if those ranks have four or fewer sets of independent timing. For example, the rank multiplication mode of an LRDIMM allows more than one physical rank to share a set of timing data as a single logical rank. Therefore the device can support up to 4 logical ranks, though that means more than 4 physical ranks.

AFI 4.0 Timing Diagrams

AFI Address and Command Timing Diagrams

Depending on the ratio between the memory clock and the PHY clock, different numbers of bits must be provided per PHY clock on the AFI interface. The following figures illustrate the AFI address/command waveforms in full, half and quarter rate respectively.

The waveforms show how the AFI command phase corresponds to the memory command output. AFI command 0 corresponds to the first memory command slot, AFI command 1 corresponds to the second memory command slot, and so on.

Figure 23. AFI Address and Command Full-Rate

Figure 24. AFI Address and Command Half-Rate

Figure 25. AFI Address and Command Quarter-Rate

AFI Write Sequence Timing Diagrams

The following timing diagrams illustrate the relationships between the write command and corresponding write data and write enable signals, in full, half, and quarter rate.

Write sequences with wlat=0

For half rate and quarter rate, when the write command is sent on the first memory clock in a PHY clock (for example, afi_cs_n[0] = 0), that access is called aligned access; otherwise it is called unaligned access. You may use either aligned or unaligned access, or you may use both, but you must ensure that the distance between the write command and the corresponding write data are constant on the AFI interface. For example, if a command is sent on the second memory clock in a PHY clock, the write data must also start at the second memory clock in a PHY clock.

Figure 26. AFI Write Data Full-Rate, wlat=0

The following diagrams illustrate both aligned and unaligned access. The first three write commands are aligned accesses where they were issued on LSB of afi_command. The fourth write command is unaligned access where it was issued on a different command slot. AFI signals must be shifted accordingly, based on the command slot.

Figure 27. AFI Write Data Half-Rate, wlat=0

Figure 28. AFI Write Data Quarter-Rate, wlat=0

Write sequences with wlat=non-zero

The afi_wlat is a signal from the PHY. The controller must delay afi_dqs_burst, afi_wdata_valid, afi_wdata and afi_dm signals by a number of PHY clock cycles equal to afi_wlat, which is a static value determined by calibration before the PHY asserts cal_success to the controller. The following figures illustrate the cases when wlat=1. Note that wlat is in the number of PHY clocks and therefore wlat=1 equals 1, 2, and 4 memory clocks delay, respectively, on full, half and quarter rate.

Figure 29. AFI Write Data Full-Rate, wlat=1

Figure 30. AFI Write Data Half-Rate, wlat=1

Figure 31. AFI Write Data Quarter-Rate, wlat=1

DQS burst

The afi_dqs_burst signal must be asserted one or two complete memory clock cycles earlier to generate DQS preamble. DQS preamble is equal to one-half and one-quarter AFI clock cycles in half and quarter rate, respectively.

A DQS preamble of two is required in DDR4, when the write preamble is set to two clock cycles.

The following diagrams illustrate how afi_dqs_burst must be asserted in full, half, and quarter-rate configurations.

Figure 32. AFI DQS Burst Full-Rate, wlat=1

Figure 33. AFI DQS Burst Half-Rate, wlat=1

Figure 34. AFI DQS Burst Quarter-Rate, wlat=1

Write data sequence with DBI (DDR4 and QDRIV only)

The DDR4 write DBI feature is supported in the PHY, and when it is enabled, the PHY sends and receives the DBI signal without any controller involvement. The sequence is identical to non-DBI scenarios on the AFI interface.

Write data sequence with CRC (DDR4 only)

When the CRC feature of the PHY is enabled and used, the controller ensures at least one memory clock cycle between write commands, during which the PHY inserts the CRC data. Sending back to back write command would cause functional failure. The following figures show the legal sequences in CRC mode.

Entries marked as 0 and RESERVE must be observed by the controller; no information is allowed on those entries.

Figure 35. AFI Write Data with CRC Half-Rate, wlat=2

Figure 36. AFI Write Data with CRC Quarter-Rate, wlat=2

AFI Read Sequence Timing Diagrams

The following waveforms illustrate the AFI write data waveform in full, half, and quarter-rate, respectively.

The afi_rdata_en_full signal must be asserted for the entire read burst operation. The afi_rdata_en signal need only be asserted for the intended read data.

Aligned and unaligned access for read commands is similar to write commands; however, the afi_rdata_en_full signal must be sent on the same memory clock in a PHY clock as the read command. That is, if a read command is sent on the second memory clock in a PHY clock, afi_rdata_en_full must also be asserted, starting from the second memory clock in a PHY clock.

Figure 37. AFI Read Data Full-Rate

The following figure illustrates that the second and third reads require only the first and second half of data, respectively. The first three read commands are aligned accesses where they are issued on the LSB of afi_command. The fourth read command is unaligned access, where it is issued on a different command slot. AFI signals must be shifted accordingly, based on command slot.

Figure 38. AFI Read Data Half-Rate

In the following figure, the first three read commands are aligned accesses where they are issued on the LSB of afi_command. The fourth read command is unaligned access, where it is issued on a different command slot. AFI signals must be shifted accordingly, based on command slot.

Figure 39. AFI Read Data Quarter-Rate

AFI Calibration Status Timing Diagram

The controller interacts with the PHY during calibration at power-up and at recalibration.

At power-up, the PHY holds afi_cal_success and afi_cal_fail 0 until calibration is done, when it asserts afi_cal_success, indicating to controller that the PHY is ready to use and afi_wlat and afi_rlat signals have valid values.

At recalibration, the controller asserts afi_cal_req, which triggers the same sequence as at power-up, and forces recalibration of the PHY.

Figure 40. Calibration

Intel Stratix 10 Memory Mapped Register (MMR) Tables

The address buses to read and write from the MMR registers are 10 bits wide, while the read and write data buses are configured to be 32 bits. The Bits Register Link column in the table below provides the mapping on the width of the data read within the 32-bit bus. The reads and writes are always performed using the 32-bit-wide bus.

Register Summary

Register	Address 32-bit Bus	Bits Register Link
ctrlcfg0	10	32
ctrlcfg1	11	32
dramtiming0	20	32
caltiming0	31	32
caltiming1	32	32
caltiming2	33	32
caltiming3	34	32
caltiming4	35	32
caltiming9	40	32
dramaddrw	42	32
sideband0	43	32
sideband1	44	32
sideband2	45	32
sideband3	46	32
sideband4	47	32
sideband5	48	32
sideband6	49	32
sideband7	50	32
sideband8	51	32
sideband9	52	32
sideband10	53	32
sideband11	54	32
sideband12	55	32
sideband13	56	32
sideband14	57	32
dramsts	59	32
niosreserve0	68	32
niosreserve1	69	32
sideband16	79	32
ecc3	130	32
ecc4	144	32
ecc5	145	32
ecc6	146	32
ecc7	147	32
ecc8	148	32

Note: Addresses are in decimal format.

ctrlcfg0

address=10(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_mem_type	3	0	Indicates memory type. "0000" for DDR3 SDRAM, and "0001" for DDR4 SDRAM.	Read
cfg_dimm_type	6	4	Indicates dimm type.	Read
cfg_ac_pos	8	7	Indicates Command Address pin position.	Read
Reserved	31	9	Reserved.	Read

ctrlcfg1

address=11(32 bit)

Field	Bit High	Bit Low	Description	Access
Reserved	4	0	Reserved.	Read
cfg_addr_order	6	5	Indicates the order for address interleaving. This is related to mappings between Avalon-MM address and the SDRAM address. "00" - chip, row, bank(BG, BA), column; "01" - chip, bank(BG, BA), row, column; "10"-row, chip, bank(BG, BA), column.	Read
cfg_ctrl_enable_ecc	7	7	Enable the generation and checking of ECC.	Read
cfg_dbc0_enable_ecc	8	8	Enable the generation and checking of ECC.	Read
cfg_dbc1_enable_ecc	9	9	Enable the generation and checking of ECC.	Read
cfg_dbc2_enable_ecc	10	10	Enable the generation and checking of ECC.	Read
cfg_dbc3_enable_ecc	11	11	Enable the generation and checking of ECC.	Read
cfg_reorder_data	12	12	This bit controls whether the controller can reorder operations to optimize SDRAM bandwidth. It should generally be set to a one.	Read
cfg_ctrl_reorder_rdata	13	13	This bit controls whether the controller needs to reorder the read return data.	Read
cfg_dbc0_reorder_rdata	14	14	This bit controls whether the controller needs to reorder the read return data.	Read
cfg_dbc1_reorder_rdata	15	15	This bit controls whether the controller needs to reorder the read return data.	Read
cfg_dbc2_reorder_rdata	16	16	This bit controls whether the controller needs to reorder the read return data.	Read
cfg_dbc3_reorder_rdata	17	17	This bit controls whether the controller needs to reorder the read return data.	Read
cfg_reorder_read	18	18	This bit controls whether the controller can reorder read command.	Read
cfg_starve_limit	24	19	Specifies the number of DRAM burst transactions an individual transaction will allow to reorder ahead of it before its priority is raised in the memory controller.	Read
Reserved	25	25	Reserved.	Read
cfg_ctrl_enable_dm	26	26	Set to 1 to enable DRAM operation if DM pins are connected.	Read
cfg_dbc0_enable_dm	27	27	Set to 1 to enable DRAM operation if DM pins are connected.	Read
cfg_dbc1_enable_dm	28	28	Set to 1 to enable DRAM operation if DM pins are connected.	Read
cfg_dbc2_enable_dm	29	29	Set to 1 to enable DRAM operation if DM pins are connected.	Read
cfg_dbc3_enable_dm	30	30	Set to 1 to enable DRAM operation if DM pins are connected.	Read

dramtiming0

address=20(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_tcl	6	0	Memory read latency.	Read
Reserved	31	7	Reserved.	Read

caltiming0

address=31(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_act_to_rdwr	5	0	Activate to Read/Write command timing.	Read
cfg_t_param_act_to_pch	11	6	Active to precharge.	Read
cfg_t_param_act_to_act	17	12	Active to activate timing on same bank.	Read
cfg_t_param_act_to_act_diff_bank	23	18	Active to activate timing on different banks, for DDR4 same bank group.	Read
cfg_t_param_act_to_act_diff_bg	29	24	Active to activate timing on different bank groups, DDR4 only.	Read

caltiming1

address=32(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_rd_to_rd	5	0	Read to read command timing on same bank.	Read
cfg_t_param_rd_to_rd_diff_chip	11	6	Read to read command timing on different chips.	Read
cfg_t_param_rd_to_rd_diff_bg	17	12	Read to read command timing on different chips.	Read
cfg_t_param_rd_to_wr	23	18	Write to read command timing on same bank.	Read
cfg_t_param_rd_to_wr_diff_chip	29	24	Read to write command timing on different chips	Read

caltiming2

address=33(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_rd_to_wr_diff_bg	5	0	Read to write command timing on different bank groups.	Read
cfg_t_param_rd_to_pch	11	6	Read to precharge command timing.	Read
cfg_t_param_rd_ap_to_valid	17	12	Read command with autoprecharge to data valid timing.	Read
cfg_t_param_wr_to_wr	23	18	Write to write command timing on same bank.	Read
cfg_t_param_wr_to_wr_diff_chip	29	24	Write to write command timing on different chips.	Read

caltiming3

address=34(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_wr_to_wr_diff_bg	5	0	Write to write command timing on different bank groups.	Read
cfg_t_param_wr_to_rd	11	6	Write to read command timing.	Read
cfg_t_param_wr_to_rd_diff_chip	17	12	Write to read command timing on different chips.	Read
cfg_t_param_wr_to_rd_diff_bg	23	18	Write to read command timing on different bank groups.	Read
cfg_t_param_wr_to_pch	29	24	Write to precharge command timing.	Read

caltiming4

address=35(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_wr_ap_to_valid	5	0	Write with autoprecharge to valid command timing.	Read
cfg_t_param_pch_to_valid	11	6	Precharge to valid command timing.	Read
cfg_t_param_pch_all_to_valid	17	12	Precharge all to banks being ready for bank activation command.	Read
cfg_t_param_arf_to_valid	25	18	Auto Refresh to valid DRAM command window.	Read
cfg_t_param_pdn_to_valid	31	26	Power down to valid bank command window.	Read

caltiming9

address=40(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_t_param_4_act_to_act	7	0	The four-activate window timing parameter.	Read

dramaddrw

address=42(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_col_addr_width	4	0	The number of column address bits for the memory devices in your memory interface.	Read
cfg_row_addr_width	9	5	The number of row address bits for the memory devices in your memory interface.	Read
cfg_bank_addr_width	13	10	The number of bank address bits for the memory devices in your memory interface.	Read
cfg_bank_group_addr_width	15	14	The number of bank group address bits for the memory devices in your memory interface.	Read
cfg_cs_addr_width	18	16	The number of chip select address bits for the memory devices in your memory interface.	Read

sideband0

address=43(32 bit)

Field	Bit High	Bit Low	Description	Access
mr_cmd_trigger	0	0	Mode Register Command Request. When asserted, indicates user request to execute mode register command. Controller clears bit to 0 when operation is completed. Register offset 37h and 38h must be properly configured before requesting Mode Register Command. Read offset 31h for Mode Register Command Status.	Read/Write

sideband1

address=44(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_refresh_req	3	0	Rank Refresh Request. When asserted, indicates a refresh request to the specific rank. Controller clears this bit to 0 when the refresh is executed.	Read/Write

sideband2

address=45(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_zqcal_long_req	0	0	Long ZQ calibration request. Asserting this bit sends a ZQ calibration command to the memory device. This is a self-clearing bit, the controller sets this bit back to 0 when the command is executed.	Read/Write

sideband3

address=46(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_zqcal_short_req	0	0	Short ZQ calibration request. Assertion of this bit sends the ZQ calibration command to the memory device. This is a self-clearing bit, the controller sets this bit back to 0 once the command is executed.	Read/Write

sideband4

address=47(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_self_rfsh_req	3	0	Self-refresh request. When asserted, indicates a self-refresh request to DRAM. All 4 bits must be asserted or de-asserted at the same time. User clear to exit self refresh.	Read/Write

sideband5

address=48(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_dpd_mps_req	0	0	Deep Power Down/Maximum Power Saving request. Assertion of this bit invokes the deep power down/maximum power saving mode. You should poll for the acknowledge signal. When the acknowledge goes high, it indicates that the system has entered deep power down/maximum power saving mode. You may de-assert this bit to exit deep power down/maximum power saving mode, or keep this bit asserted to maintain deep power down/maximum power saving mode.	Read/Write

sideband6

address=49(32 bit)

Field	Bit High	Bit Low	Description	Access
mr_cmd_ack	0	0	Register Command In Progress. When asserted, indicates Mode Register Command in progress.	Read

sideband7

address=50(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_refresh_ack	0	0	Refresh In Progress. Acknowledgement signal for refresh request. Indicates that refresh is in progress. Asserts when refresh request is sent out to PHY until`tRFC`/`t_param_arf_to_valid` is fulfilled.	Read

sideband8

address=51(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_zqcal_ack	0	0	ZQ Calibration in Progress. Acknowledgement signal for ZQ calibration request. When asserted, indicates that ZQ Calibration is in progress. Asserts when ZQ Calibration is sent to the PHY until the tZQoper(t_param_zqcl_period) / tZQCS(t_param_zqcs_period) is fulfilled.	Read

sideband9

address=52(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_self_rfsh_ack	0	0	Self-refresh In Progress. Acknowledgement signal for the self-refresh request. A value of 1 indicates that memory is in self refresh mode.	Read

sideband10

address=53(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_dpd_mps_ack	0	0	Deep Power Down/Maximum Power Saving In Progress. Acknowledgement signal for the deep power down/maximum power saving request. A value of 1 indicates that the memory is in deep power down/maximum power saving mode.	Read

sideband11

address=54(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_auto_pd_ack	0	0	Auto Power Down In Progress. Acknowledgement signal for auto power down. A value of 1 indicates that the memory is in auto power down mode.	Read

sideband12

address=55(32 bit)

Field	Bit High	Bit Low	Description	Access
mr_cmd_type	2	0	Register command type. Indicates the type of register command.	Read/Write
			000 - Mode Register Set (DDR3 and DDR4)
			Others - Reserved
mr_cmd_rank	6	3	Register command rank. Indicates the rank targeted by the register command.	Read/Write
			0001 - Chip select 0
			0010 - Chip select 1
			0011 - Chip select 0 and chip select 1
			1111 - all chip selects
			Mode Register Set - Any combination of chip selects.

sideband13

address=56(32 bit)

Field	Bit High	Bit Low	Description	Access
mr_cmd_opcode	31	0	Register Command Opcode. Information used for register command.	Read/Write
			DDR4
			[26:24] C2:C0
			[23] ACT
			[22:21] BG1:BG0
			[20] Reserved
			[19:18] BA1:BA0
			[17] A17
			[16] RAS#
			[15] CAS#
			[14] WE#
			[13:0] A13:A0
			MRS: [22:21] is BG1:BG0, [19:18] is BA1:BA0, [13:0] is Opcode[13:0]

			DDR3
			[26:21] Reserved
			[20:18] BA2:BA0
			[17] A14
			[16] RAS#
			[15] CAS#
			[14] WE#
			[13:0] A13:A0
			MRS: [19:18] is BA1:BA0, [13:0] is Opcode[13:0]

sideband14

address=57(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_refresh_cid	3	1	DDR4 3DS Chip ID Refresh. When asserted, indicates the logical rank chip ID for 3DS refresh. (This field is not applicable for DDR3.)	Read

dramsts

address=59(32 bit)

Field	Bit High	Bit Low	Description	Access
phy_cal_success	0	0	This bit is set to 1 if the PHY calibrates successfully.	Read
phy_cal_fail	1	1	This bit is set to 1 if the PHY does not calibrate successfully.	Read

niosreserve0

address=68(32 bit)

Field	Bit High	Bit Low	Description	Access
nios_reserve0	15	0	Indicates interface width.	Read

niosreserve1

address=69(32 bit)

Field	Bit High	Bit Low	Description	Access
nios_reserve1	15	0	Indicates ACDS version.	Read

sideband16

address=79(32 bit)

Field	Bit High	Bit Low	Description	Access
mmr_3ds_refresh_ack	31	0	DDR4 3DS Refresh Acknowledge. When asserted, indicates acknowledgement for the DDR4 3DS refresh.	Read
			[7:0] Refresh acknowledgement for logical rank [7:0] for physical rank 0.
			[15:8] Refresh acknowledgement for logical rank [7:0] for physical rank 1.
			[23:16] Refresh acknowledgement for logical rank [7:0] for physical rank 2.
			[31:24] Refresh acknowledgement for logical rank [7:0] for physical rank 3.

ecc3: ECC Error and Interrupt Configuration

address=130(32 bit)

Field	Bit High	Bit Low	Description	Access
cfg_gen_sbe	0	0	A value of 1 enables the generate SBE feature. Generates a single bit error during the write process.	Read/Write
cfg_gen_dbe	1	1	A value of 1 enables the generate DBE feature. Generates a double bit error during the write process.	Read/Write
cfg_enable_intr	2	2	A value of 1 enables the interrupt feature. The interrupt signal notifies if an error condition occurs. The condition is configurable.	Read/Write
cfg_mask_sbe_intr	3	3	A value of 1 masks the interrupt signal when SBE occurs.	Read/Write
cfg_mask_dbe_intr	4	4	A value of 1 masks the interrupt signal when DBE occurs.	Read/Write
cfg_mask_corr_dropped_intr	5	5	A value of 1 masks the interrupt signal when the auto correction command can’t be scheduled, due to back-pressure (FIFO full).	Read/Write
cfg_mask_hmi_intr	6	6	A value of 1 masks the interrupt signal when the hard memory interface asserts an interrupt signal via the `hmi_interrupt` port.	Read/Write
cfg_clr_intr	7	7	Writing a vale of 1 to this self-clearing bit clears the interrupt signal, error status, and address.	Read/Write
Reserved	31	8		Read

ecc4: Status and Error Information

address=144(32 bit)

Field	Bit High	Bit Low	Description	Access
sts_ecc_intr	0	0	Indicates the interrupt status; a value of 1 indicates an interrupt occurred.	Read
sts_sbe_error	1	1	Indicates the SBE status; a value of 1 indicates SBE occurred.	Read
sts_dbe_error	2	2	Indicates the DBE status; a value of 1 indicates DBE occurred.	Read
sts_corr_dropped	3	3	Indicates the status of correction command dropped; a value of 1 indicates correction command dropped.	Read
sts_sbe_count	7	4	Indicates the number of times SBE error has occurred. The counter will overflow.	Read
sts_dbe_count	11	8	Indicates the number of times DBE error has occurred. The counter will overflow.	Read
sts_corr_dropped_count	15	12	Indicates the number of times correction command has dropped. The counter will overflow.	Read
Reserved	31	16		Read

ecc5: Address of Most Recent SBE/DBE

address=145(32 bit)

Field	Bit High	Bit Low	Description	Access
sts_err_addr*	31	0	Address of the most recent single-bit error or double-bit error.	Read

ecc6: Address of Most Recent Correction Command Dropped

address=146(32 bit)

Field	Bit High	Bit Low	Description	Access
sts_corr_dropped_addr	31	0	Address of the most recent correction command dropped.	Read

ecc7: Extension for Address of Most Recent SBE/DBE

address=147(32 bit)

Field	Bit High	Bit Low	Description	Access
sts_err_addr_ext	2	0	Extension for address of the most recent single-bit error or double-bit error.	Read

ecc8: Extension for Address of Most Recent Correction Command Dropped

address=148(32 bit)

Field	Bit High	Bit Low	Description	Access
sts_corr_dropped_addr_ext	2	0	Extension for address of the most recent correction command dropped.	Read

Intel Stratix 10 EMIF – Simulating Memory IP

To simulate your design you require the following components:

A simulator—The simulator must be an Intel-supported VHDL or Verilog HDL simulator:
- Aldec Riviera-Pro
- Cadence NC Sim
- Mentor Graphics^® ModelSim
- Synopsys^® VCS/VCS-MX
A design using Intel’s External Memory Interface (EMIF) IP
An example driver or traffic generator (to initiate read and write transactions)
A testbench and a suitable memory simulation model

The Intel External Memory Interface IP is not compatible with the Platform Designer Testbench System. Instead, use the simulation design example from your generated IP to validate memory interface operation, or as a reference for creating a full simulatable design. The provided simulation design example contains the generated memory interface, a memory model, and a traffic generator. For more information about the EMIF simulation design example, refer to the Intel^® Stratix^® 10 EMIF IP Design Example User Guide.

Memory Simulation Models

There are two types of memory simulation models that you can use:

Intel-provided generic memory model
Vendor-specific memory model

The Intel^® Quartus^® Prime software generates the generic memory simulation model with the simulation design example. The model adheres to all the memory protocol specifications, and can be parameterized.

Vendor-specific memory models are simulation models for specific memory components from memory vendors such as Micron and Samsung. You can obtain these simulation models from the memory vendor's website.

Note: Intel does not provide support for vendor-specific memory models.

Simulation Options

The following simulation options are available with the example testbench to improve simulation speed:

Full calibration—Calibrates the same way as in hardware, and includes all phase sweeps, delay adjustments, and data centering.
Skip calibration—Loads memory configuration settings and enters user mode, providing the fastest simulation time.

Note: For proper simulation of DQS Tracking, you must enable full calibration.

Both simulation options represent accurate controller efficiency and do not take into account board skew. This may cause a discrepancy in the simulated interface latency numbers. For more information regarding simulation assumptions and differences between RTL simulation and post-fit implementation, refer to the Simulation Versus Hardware Implementation chapter in the Intel^® Stratix^® 10 EMIF IP Design Example User Guide.

Table 172. Typical Simulation Times Using Intel^® Stratix^® 10 EMIF IP
Calibration Mode/Run Time ⁽¹⁾	Estimated Simulation Time
Calibration Mode/Run Time ⁽¹⁾	Small Interface (×8 Single Rank)	Large Interface (×72 Quad Rank)
Full Full calibration Includes all phase/delay sweeps and centering	20 minutes	~ 1 day
Skip Skip calibration Preloads calculated settings	10 minutes	25 minutes
Abstract PHY Replace PHY and external memory model with a single abstract PHY model. IMPORTANT: External memory model is NOT used in this mode. No I/O switching occurs to the external memory model.	1 minute	5 minutes

Intel® Stratix® 10 EMIF IP Protocol and Feature Support

Hard Sequencer

Hard PHY

Hard Memory Controller

PHY-Only Mode

High-Speed PHY Clock Tree

Automatic Clock Phase Alignment

Resource Sharing

I/O Bank Usage

Address and Command Calibration

Read Calibration

Write Calibration

Address and Command Calibration

Read Calibration

Write Calibration

Rules for Sharing I/O Banks

Method for Initiating a User-requested Reset

Supported Modes

Intel^® Stratix^® 10 EMIF IP Protocol and Feature Support