Intel® Core™ i7-8705G Processor

(8M Cache, up to 4.10 GHz)

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Technical Specifications
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Technical Specifications Read the product brief

Essentials

Vertical Segment
Mobile
Product Collection
8th Generation Intel® Core™ i7 Processors
Processor Number
i7-8705G
Status
Announced
Launch Date
Q1'18
Lithography
14 nm

Performance

# of Cores
4
# of Threads
8
Processor Base Frequency
3.10 GHz
Max Turbo Frequency
4.10 GHz
Cache
8 MB
Bus Speed
8 GT/s

Supplemental Information

Embedded Options Available
No
Description
65W Package TDP

Memory Specifications

Max Memory Size (dependent on memory type)
64 GB
Memory Types
DDR4-2400
Max # of Memory Channels
2
Max Memory Bandwidth
37.5 GB/s
ECC Memory Supported ‡
No

Processor Graphics ‡
Intel® HD Graphics 630
Graphics Base Frequency
350 MHz
Graphics Max Dynamic Frequency
1.10 GHz
Graphics Video Max Memory
64 GB
Graphics Output
eDP 1.4, DP 1.2, HDMI 1.4, DVI
4K Support
Yes, at 60Hz
Max Resolution (HDMI)‡
4096 x 2160 @30Hz
Max Resolution (DP)‡
4096 x 2160 @60Hz
Max Resolution (eDP - Integrated Flat Panel)‡
4096 x 2160 @60Hz
DirectX* Support
12
OpenGL* Support
4.4
Intel® Quick Sync Video
Yes
Intel® InTru™ 3D Technology
Yes
Intel® Clear Video HD Technology
Yes
Intel® Clear Video Technology
Yes
# of Displays Supported ‡
3
Graphics Name‡
Radeon™ RX Vega M GL Graphics
Graphics Max Dynamic Frequency
1011 MHz
Graphics Base Frequency
931 MHz
Compute Units
20
Graphics Memory Bandwidth
179.2 GB/s
Graphics Memory Interface
1024 bit
Graphics Output
eDP 1.4, DP 1.4 w/ HDR, HDMI 2.0b, DVI
4K Support
Yes, at 60Hz
Max Resolution (HDMI)‡
4096 x 2160@60Hz
Max Resolution (DP)‡
4096 x 2160@60Hz
Max Resolution (eDP - Integrated Flat Panel)‡
4096 x 2160@60Hz
DirectX* Support
12
Vulkan* Support
Yes
OpenGL* Support
4.5
H.264 Hardware Encode/Decode
Yes
H.265 (HEVC) Hardware Encode/Decode
Yes, 10-bit
# of Displays Supported‡
6

Expansion Options

PCI Express Revision
3.0
PCI Express Configurations ‡
Up to 1x8, 2x4
Max # of PCI Express Lanes
8

Package Specifications

Sockets Supported
BGA2270
Max CPU Configuration
1
TJUNCTION
100°C
Package Size
31mm x 58.5mm

Advanced Technologies

Intel® Speed Shift Technology
Yes
Intel® Turbo Boost Technology ‡
2.0
Intel vPro® Platform Eligibility ‡
No
Intel® Hyper-Threading Technology ‡
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
Intel® Transactional Synchronization Extensions
No
Intel® 64 ‡
Yes
Instruction Set
64-bit
Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel® My WiFi Technology
Yes
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Thermal Monitoring Technologies
Yes
Intel® Flex Memory Access
Yes
Intel® Identity Protection Technology ‡
Yes
Intel® Stable Image Platform Program (SIPP)
No
Intel® Smart Response Technology
Yes

Security & Reliability

Intel® AES New Instructions
Yes
Secure Key
Yes
Intel® Software Guard Extensions (Intel® SGX)
Yes with Intel® ME
Intel® Memory Protection Extensions (Intel® MPX)
Yes
Intel® OS Guard
Yes
Intel® Trusted Execution Technology ‡
No
Execute Disable Bit ‡
Yes
Reviews

Reviews

Drivers and Downloads
Features and Performance

Features and Performance

Maximize Performance

A computer with a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics and 4 GB of dedicated high bandwidth memory for graphics delivers high-performance processing and the graphics required for rich content creation, 4K video editing, smooth game play at high-resolution settings, immersive VR, and mega-tasking.

VR to Go

Get a rich and deep immersive VR experience in a thin & light ultra-portable laptop or Mini-PC powered by a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics. VR in a compact computer has never been so easily available.

Create Like a Pro

Create 3D images from scratch and edit videos seamlessly with the next level of processing performance, at home or on the go, using your favorite creative applications. 3D rendering, shading and complex physics calculations on a small form-factor computer with a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics introduces a new definition of small and fast.

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EMIB

Embedded Multi-Die Interconnect Bridge

Embedded Multi-die Interconnect Bridge (EMIB) acts as an intelligent information bridge between the discrete graphics chip and high bandwidth memory, allowing those components to be bundled closely together in the same package. This creates space savings, which enables innovative thin and light devices that still deliver the performance to power your most demanding content creation, gaming and VR experiences.

Learn about EMIB

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Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.