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Technical Specifications Read the product brief
Essentials
Code Name
Products formerly Kaby Lake G
Vertical Segment
Mobile
Processor Number
i7-8705G
Status
Announced
Q1'18
14 nm
Performance
3.10 GHz
4.10 GHz
Supplemental Information
Description
65W Package TDP
Memory Specifications
DDR4-2400
37.5 GB/s
Graphics Specifications
350.0 MHz
1.10 GHz
eDP 1.4, DP 1.2, HDMI 1.4, DVI
Yes, at 60Hz
4096 x 2160 @30Hz
4096 x 2160 @60Hz
4096 x 2160 @60Hz
4.4
# of Displays Supported ‡
3
Expansion Options
Up to 1x8, 2x4
Package Specifications
FCBGA2270
Max CPU Configuration
1
100°C
Package Size
31mm x 58.5mm
Low Halogen Options Available
See MDDS
Advanced Technologies
Yes
64-bit
Intel® SSE4.1,Intel® SSE4.2,Intel® AVX2
Security & Reliability
OS Guard
Yes
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Results
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Features and Performance
Maximize Performance
A computer with a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics and 4 GB of dedicated high bandwidth memory for graphics delivers high-performance processing and the graphics required for rich content creation, 4K video editing, smooth game play at high-resolution settings, immersive VR, and mega-tasking.
VR to Go
Get a rich and deep immersive VR experience in a thin & light ultra-portable laptop or Mini-PC powered by a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics. VR in a compact computer has never been so easily available.
Create Like a Pro
Create 3D images from scratch and edit videos seamlessly with the next level of processing performance, at home or on the go, using your favorite creative applications. 3D rendering, shading and complex physics calculations on a small form-factor computer with a 8th Gen Intel® Core™ mobile processor with Radeon* RX Vega M graphics introduces a new definition of small and fast.
Embedded Multi-Die Interconnect Bridge
Embedded Multi-die Interconnect Bridge (EMIB) acts as an intelligent information bridge between the discrete graphics chip and high bandwidth memory, allowing those components to be bundled closely together in the same package. This creates space savings, which enables innovative thin and light devices that still deliver the performance to power your most demanding content creation, gaming and VR experiences.
Related Materials
Product and Performance Information
This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.