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Technical Specifications

Audio

Headphone Out Quantity
1
Microphone In
Y

Battery

Energy Star Certified
Y

Design

Chipset
Intel® H170
Color
Black
Chassis type
Tower

Graphics

Integrated Graphics
Y
Graphics Controller
On-board graphics adapter model
Intel® HD Graphics 530
Discrete graphics adapter model
AMD Radeon RX 460
Graphics adapter Open GL support
Y
Number of discrete graphics adapters
1
On-board graphics adapter base frequency
350 MHz
On-board graphics adapter dynamic frequency (max)
950 MHz

Intel Technologies

Intel® Turbo Boost Technology
2.0
Intel® Hyper-Threading Technology
N
Intel® 64
Y
Intel® Quick Sync Video
Y
Intel® Identity Protection Technology
Y
Intel® VPro Technology
N
Intel® Small Business Advantage
Y
Intel InTru 3D Technology
Y
Intel Secure Key
Y
Intel Stable Image Platform Program (SIPP)
N

Memory

Internal Memory
8 GB
Internal Memory Type
DDR4-SDRAM
RAM Speed
2133 MHz
Memory slots
4x DIMM
Maximum internal memory
32 GB

Networking

Wireless Display
Y
Ethernet LAN
Y
Ethernet LAN (RJ-45) ports
1

Operating System

Ports Interface

Supported Flash Cards
MMC,MMC+,MS PRO,Memory Stick (MS),SD,SDHC,SDXC
Card Reader Integrated
Y
HDMI Ports
1

Processor

Processor Model
i5-6400
CPU Speed
2.7 GHz
Cores/Threads
4
Socket Type
LGA 1151 (Socket H4)
L2 cache
6 MB
Silicon
14 nm
Max TDP
65 W
Processor boost frequency
3.3 GHz
ShopConflictFree
Y
ShopGeneration
6
Processor threads
4

Storage

Storage Media Type
HDD
ShopHarddrivecapacity
1000 GB
Total Storage size
1000 GB

Weight Dimensions

Weight
18.5 lbs (8.38 kg)
Height
15.8" (400.5 mm)
Width
7.13" (181 mm)
Depth
18" (456.6 mm)

Reviews

Product and Performance Information

Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation.Performance varies depending on system configuration. No computer system can be absolutely secure.Check with your system manufacturer or retailer."Conflict-free" refers to products, suppliers, supply chains, smelters, and refiners that, based on our due diligence, do not contain or source tantalum, tin, tungsten or gold (referred to as conflict minerals by the U.S. Securities and Exchange Commission) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo or adjoining countries.