This document provides guidelines for the design of thermal and mechanical solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform. The processors covered include those listed in the Intel® Xeon® processor E5-2400 product family datasheet - volume one. The components described... in this document include: • The processor thermal solution (heatsink) and associated retention hardware. • The LGA1356 socket, the independent loading mechanism (ILM) and back plate.
The goals of this document are: • To assist board and system thermal mechanical designers. • To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the appropriate datasheet.
Read the full Intel® Xeon® Processor E5-2400 Product Family TMDG: http://www.intel.com/content/www/us/en/processors/xeon/xeon-e5-2400-thermal-guide.html