ADLINK Express-CF/CFE: COM Express® Basic Size Type 6 Module with Up to Hexa Core Intel® Xeon® E2000 series and Intel® Core™ 8000 series Processors (CFE with ECC)
About this offer
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor with Mobile Intel® QM370, HM370, CM246 Chipset. These Hexa-core processors support up to 12 threads (Intel® Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution. The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Intel® Xeon® processor and CM246 Chipset support both ECC and non-ECC SODIMMs. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel® Optane™ memory, allowing applications access to the highest speed storage solutions and include a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer. Key Features PICMG COM.0 R3.0 Type 6 module with Hexa core Intel® 8000 series and Xeon® E-2000 series processors Up to 48GB Dual Channel DDR4 at 2133/2400MHzThree DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays One PCIe x16 (Gen3), Eight PCIe x1 (Gen3) (supporting Intel® Optane™ Memory Technology) GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0Supports Smart Embedded Management Agent (SEMA) functions
Details
Availability and Pricing
Mass Production Schedule: 2018-09-01
Working Sample Schedule: 2018-05-09
Minimum Order Quantity (Unit): 1
Order Lead Time (Days): 40
Regional Coverage
Americas:
North America Region
Latin America Region
Asia, Pacific, and Japan:
Japan
Rest of Asia
People's Republic of China:
People's Republic of China
Use Case
Digital Signage
Smart City
Industry
Health and Life Sciences
Arts and Entertainment
Defense and Space
Retail
Transportation and Warehouse
Automotive
Technical Specifications
- Category:
- Component: Board
- Operating Systems:
-
Linux*:Wind River Linux family*
Linux*:Wind River Linux family*:VxWorks*
Included Intel Technology
Intel® Xeon® Processors
Intel® Xeon® E Processor
Intel® Core™ Processors
8th Generation Intel® Core™ i5 Processors
8th Generation Intel® Core™ i7 Processors
8th Generation Intel® Core™ i3 Processors
Intel vPro® Platform Technology
Data Center Technology
Memory and Storage Technology
Networking Technology
Resources
ADLINK TECHNOLOGY INC.
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ADLINK TECHNOLOGY INC.
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ADLINK Technology is a global leader in edge computing. Our mission is to affect positive change in society and industry by connecting people, places and things with AI. We do this through the delivery of leading edge, robust solutions addressing our customer’s critical business and technology challenges. Our offerings include robust boards, modules and systems; real-time data acquisition solutions; and application enablement for Artificial Intelligence + Internet of Things (AIoT). ADLINK serves customers in many vertical markets including: manufacturing, networking and communications, healthcare, military and aerospace, infotainment, retail, energy and transportation. We’re a Premier Member of the Intel® Internet of Things Solutions Alliance and a contributor to many standards and interoperability initiatives, including Eclipse, OCP, OMG, PICMG, SGeT and ROS 2 TSC. ADLINK’s products are available in over 40 countries, either directly or through our worldwide network of value-adding distributors and systems integrators. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on TAIEX (Stock Code: 6166).
Adlink Express-cf/cfe: Com Express® Basic Size Type 6 Module With Up To Hexa Core Intel® Xeon® E2000 Series And Intel® Core™ 8000 Series Processors (cfe With Ecc)
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