High Performing Compute Node Featuring a Bootable Intel® Xeon Phi™ Processor

Designed to support the demands of parallel processing with 6 DIMMs, up to 72 cores and optional support for Intel® Omni-Path Fabric for up to 100 Gb/s of node interconnect throughput delivering performance, high availability, and serviceability.

Key Features

  • Supporting bootable Intel® Xeon Phi™ product family
  • Supports Intel® Omni-Path Fabric via integrated silicon (-F processor) or PCIe*-based Add-In-Card
  • Intel® Omni-Path Port Upgrade Kit (2 Port) AXX2PFABKIT required for Intel® Xeon Phi™ product family -F processor
  • Up to six DDR4-2400 Registered ECC memory modules (RDIMM/LRDIMM), maximum 384GB capacity
  • Two PCIe* Gen 3 x16 low-profile slots, two USB 3.0 ports, four SATA Ports and mSATA port connector
  • Dual 1GbE Base-T ports for network and manageability
  • Optional 2U/4 node chassis with dual 2130W power supplies

Find a Supplier


Browse a list of Intel® Authorized Distributors and Approved Suppliers

Options for Flexibility and Choice

The Intel® Server Board S7200AP family is ideal for HPC workloads demanding a high level of parallel compute processing performance. To provide choice and flexibility about where to focus resources, the S7200AP board is available as a building block component with a chassis optimized for HPC systems, or it can be purchased as an unbranded, pre-integrated HPC Compute Block.

Designed to meet the power requirements of high demand HPC systems, the H2312XXLR2 and H2216XXLR2 chassis include dual 2130W power supply units to support the power demands of the S7200AP board.

Explore chassis options

Take advantage of Intel's latest data center technology with HPC Compute Block configurations based on the Intel® Server Board S7200AP family. Available as part of an early access program, these blocks are pre- configured, fully validated and feature the latest Intel® Xeon Phi™ processor family.

Learn more

Securing Your Business Throughout the Supply Chain


Manage risk end-to-end in the supply chain with the Intel® Transparent Supply Chain - a set of policies and procedures implemented at Intel’s factories enabling end users to validate where and when every component of a S7200AP product was manufactured.

Product Specifications for General Availability

Product Name  

Order Code

Expansion Options

TPM Version

Liquid Cooling Friendly

General Product Availability

Intel® Server Board S7200AP

View product images

BBS7200AP

1x PCI Express* 3.0 x16

1x PCI Express* 3.0 x16 or x4

2.0

No

Q1'17

Intel® Server Board S7200APL

BBS7200APL

1x PCI Express* 3.0 x16

1x PCI Express* 3.0 x16 or x4

2.0

Yes

Q1'17

Intel® Compute Module HNS7200AP

HNS7200AP

1x PCI Express* 3.0 x16

1x PCI Express* 3.0 x16 or x4

2.0

No

Q1'17

Intel® Compute Module HNS7200APL

HNS7200APL

1x PCI Express* 3.0 x16

1x PCI Express* 3.0 x16 or x4

2.0

Yes

Q1'17

Product Compatibility

Compatible Intel Products

Tested Hardware, Memory, Operating Systems Lists (Includes Third-Party Vendors)

Intel® Server Board S7200AP

Intel® Server Board S7200AP THOL

Intel® Server Board S7200APL

Intel® Server Board S7200APL THOL

Intel® Compute Module HNS7200AP

Intel® Compute Module HNS7200AP THOL

Intel® Compute Module HNS7200APL

Intel® Compute Module HNS7200APL THOL