White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations

White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations

White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations

White Paper: PCB stack-up designs for Intel® architecture platforms meet high-speed needs and address the challenges of choosing materials, increasing speed, meeting industry standards, and reducing costs. (Dec. 2008)

Related Videos