We are the only true full-service provider to offer standard and customized solutions for every aspect of semiconductor design, manufacturing, packaging, and assembly.
We have long been a leader in silicon process, package, and test technology. We will continue our leadership through investment and innovation in this critical area. Our customers are reaping the benefits of our relentless investment in world-class, pioneering research and development.
The pursuit of Moore’s Law is in Intel’s DNA and is our driving force. The benefits can be seen across three value vectors, namely higher performance, lower power, and lower cost per transistor. As cost per transistor continues to drop, performance per watt is improving rapidly. This has been critical in enabling products from cloud to client and mobile computing.
Through the combination of access to leading-edge process technology and an extensive offering of diverse cost-effective packages, assembly, and test technology, our customers get significant time-to-market and time-to-yield benefits for their products. Our access to leading-edge materials and experience in co-optimization has allowed us to introduce technologies that break some traditional conventions. Our manufacturing platform offers highly optimized silicon engineering and production services to help customers take full advantage of Intel’s integrated device manufacturer (IDM) capabilities.
Intel Custom Foundry’s 22 nm and 14 nm technologies are the industry’s most advanced tri-gate technology and indeed the only tri-gate technologies in high volume production. They provide true density scaling and lower cost per transistor, thus continuously advancing Moore’s Law. The maturity of our technologies gives our customers significant time-to-market and time-to-yield advantages.
Intel Custom Foundry offers a variety of different package formats and sizes, including standard flip chip ball grid array (FCBGA) packaging for a variety of form factors. We also offer a variety of solutions for different needs—from multi die packaging solutions for high performance to chip scale package (CSP) solutions for high density.
Intel is a leader in multi-chip packaging (MCP) technology which allows for integration of multi-die devices in a single package. Integration can be enabled by high-performance heterogeneous multi-die interconnect technology, providing the benefit of traditional 2.5D and 3D approaches in a more cost-effective manner. These solutions can address the performance, memory bandwidth, and thermal challenges across multiple segments.
The embedded multi-die interconnect bridge (EMIB) is a breakthrough in advanced packaging technology for very high density interconnects between heterogeneous die in a package. EMIB technology avoids a silicon interposer by using a silicon “bridge” for chip-to-chip interconnect. This results in significant reduction in manufacturing complexity and cost for high bandwidth, multi-chip integrated solutions.
Intel offers innovative thermal solutions for both package and system cooling needs. This includes development of very high-conductive, thermal-interface materials.
Containment of signal noise is a significant challenge for devices operating in the multi-GHz range or using high speed interconnects. Intel is at the forefront of the development of advanced substrate materials, design techniques, and integrated solutions. We also offer design tools and techniques to meet the ever-increasing challenges of high speed and high bandwidth interconnects.
Intel Custom Foundry offers complete end-to-end test development capabilities to its customers from wafer test to final test. We have significant test technology-related R&D efforts in the industry with a mission to provide volume-ready world-class capabilities. Our test platform technology and capabilities are amongst the most advanced in the industry. Our test platforms have been used to support the breadth of product needs in high-performance and low-power market segments.
For the vast majority of modern flip chip packages, the best test solution is our proprietary High Density Modular Test technology platform. It is a combination of standardized hardware and software test modules that achieve an industry leading unit cost advantage via throughput without sacrificing reliability or robust capabilities. HDMT provides industry leading test costs per unit across a wide range of test instruments including DPS, digital, analog, and RF. It also can deliver higher yield and improved binning accuracy thanks to advanced active thermal control technologies.
Performance-oriented parts with high levels of I/O and parallelism demand more rigorous testing, such as parts used in networking.
Working with an integrated device manufacturer means having a single point of accountability. Entrusting Intel Custom Foundry with the entire process enables each piece of silicon to be traced from fabrication to shipping. This process is coordinated seamlessly, without the inefficiencies and costs associated with managing multiple vendors.