Network Infrastructure Design Platforms
Network infrastructure is essential to the modern world, spanning communications and data center applications. Improving network infrastructure demands three key pieces of technology: technology density, high-speed SerDes, and innovative packaging.
Intel design platforms are unique combinations of technology, key IP, and manufacturing knowledge to generate not just world-class semiconductors, but to fully engineer new products and break ground in new markets. This is a collection of critical technologies and capabilities tailored for the network infrastructure market.
14 nm GP
14 nm General Purpose (GP) is the lead process node for networking products. Introduced in 2014, it is a process node in volume production. Using 2nd generation 3D tri-gate transistors, 14 GP delivers industry-leading performance, power, density, and cost per transistor, and is used to manufacture the highest performance products.
Introduced in 2011, 22 nm was the lead platform for Intel’s 3D tri-gate transistors. Now, as a mature process node, it is suited for networking products whose components benefit more from lower cost structures.
Ternary content addressable memory (TCAM) and multi-port register files are essential parts of the memory scheme in modern high-speed networking products. They are a foundational element of Intel’s networking design platform.
Storage Interface IP
Industry standard serial advanced technology attachment (SATA), mobile SATA (mSATA), and serial attached SCSI (SAS) interface IPs are available for networking storage.
Memory Interface IP
Intel offers high bandwidth memory (HBM 2.0) configurations and DDR for networking memory.
Reticle Limited Die Production
As an IDM, Intel has experience in building non-standard parts, including larger than usual die. Similarly, Intel is experienced in integrating large packages (> 55 mm).
Intel is perhaps known best for its own products, not just its process technology. This product-level experience gives an invaluable, holistic perspective when charting the technologies and processes recommended to our customers for each project.
Achieving a high, stable yield on a process technology is one of the fundamental drivers of the economics of Moore’s Law. Intel is in its second generation of manufacturing tri-gate transistors.
Embedded Multi-Die Interconnect Bridge (EMIB)
Building complex multi-chip modules is increasingly important for network infrastructure devices. Industry solutions are limited in the scale they can address and are difficult to yield. Intel’s proprietary solution, EMIB, uses a very small bridge die embedded in the package to create those connections. As a result, it can support high speed, high density interconnects while yielding like a traditional package.
High Speed Modeling Service
At high speeds, small noise can have a huge impact on performance. Intel knows the architecture and requirements of modern data center communications and can assist in designing around and debugging noise with our high speed modeling service.
Configurable Modular Test
Performance oriented parts with high levels of I/O and parallelism demand more rigorous testing, such as parts used in networking. CMT offers a robust, industry standard platform for testing networking chips.