Mobile Design Platforms
Mobile devices are the consummate fully-integrated consumer electronic device. As such, mobile devices are subject to both constant refinement and reinvention of what constitutes a mobile device. Meeting that pace of innovation demands leadership technology, organizational agility to reduce time to market, and a robust ecosystem to draw on a broad IP portfolio.
Our design platforms are unique combinations of technology, key IP, and manufacturing knowledge for customers to fulfill their product vision without compromise. This is a collection of critical technologies and capabilities tailored for the mobile market.
14 nm LP
14 nm Low Power (LP) is the lead process node for mobile products. Introduced in 2014, it is a process node in volume production. Using 2nd generation 3D tri-gate transistors, the 14 nm technology delivers industry-leading performance, power, density, and cost per transistor, and will be used to manufacture a wide range of products, from high performance to low power. Intel 14 nm technology provides good dimensional scaling from 22 nm. The transistor fins are taller, thinner, and more closely spaced for improved density and lower capacitance. Improved transistors require fewer fins, further improving density.
Intel features a number of standard SerDes interface IPs, primarily MIPI D-PHYs and M-PHYs and broad support for USB, including USB-C connectors and USB3.1, and PCIe through generation 4.
Display Interface IP
Industry standard HDMI 1.4 and 2.0 interconnects as well as eDP and DP are available for mobile display interface. Interface IP is available for integration through USB-C.
Storage Interface IP
Industry standard eMMC4/5 and SD3.0 interface IP is available for mobile storage.
Memory Interface IP
LPDDR3/4 is generally recommended for mobile memory interface.
High Volume and Time to Market
Shipping on-time and in high volume is essential to meeting growing customer demands. Silicon proven IP and a mature, leading edge process technology are the best foundation for rapid time-to-market.
Intel is perhaps known best for its own products, not just its process technology. This product-level experience gives an invaluable, holistic perspective when charting the technologies and processes recommended to our customers for each project.
Flip Chip Chip Scale Packages (FC-CSP)
FC-CSP is an essential industry standard for high speed and power applications. Intel has extensive experience designing for and building these chips.
High Density Modular Test (HDMT)
HDMT is a framework of hardware and software modules, purpose-built to address the challenges of modern final test. Beyond product quality, most test decisions are driven by the impact to unit cost and thus profitability. As its name implies, cost savings are derived by combining industry leading Automated Test Environment (ATE) capability and performance into a very small, modular package that can enable high throughput with low overhead.