Presentation: Intel Senior Fellow Mark Bohr discusses the manufacturing advances of 14 nm process technology, including the tri-gate transistor, logic area scaling, costs, product benefits, and System on Chip features.
Intel's Babak Sabi shares how Embedded Multi-die Interconnect Bridge provides solutions for high-speed chip communication.
Intel 3-D transistors manufactured at 22 nm ensure the pace of technology advancement for years to come.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Follow the computer chip making process using Intel's 22 nm technology with 3-D transistors.