Partnering to Turn Silicon into Solutions
Intel is unleashing its silicon design and manufacturing expertise to build your world-changing products. Let’s build the future together. Services available now.
What’s your next market-leading product? Our process roadmap supports a range of solutions including low-power and high-performance applications with world-class RF capabilities, flexible interconnect, and simple design rules. Plus, proven FinFET technology with enhanced performance and EUV optimization. As well as leading-edge and foundry-optimized offerings with innovative technology breakthroughs for competitive performance.
Read how Intel’s process innovations help drive our progress
Intel’s advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. Intel® embedded multi-die interconnect bridge (EMIB) and Foveros are advanced 2D and 3D packaging technologies that are delivering high performance.
Read about Intel’s leadership in advanced packaging technology
Notices and Disclaimers1
Product and Performance Information
This webpage contains forward-looking statements about Intel’s future plans or expectations, including with respect to future technology and products and the expected benefits and availability of such technology and products. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.