Partnering to Turn Silicon into Solutions
Intel is unleashing its silicon design and manufacturing expertise to build your world-changing products. Let’s build the future together. Services available now.
Engineering the Future
It’s an exciting time to be in semiconductors. The entire world is becoming digital, driven by four superpowers: the cloud, connectivity, artificial intelligence and the intelligent edge. But while the digitization of every industry is accelerating the global demand for semiconductors, a key challenge exists: access to manufacturing capacity. Intel is in a unique position to meet this growing demand while ensuring a sustainable and secure supply of semiconductors for the world. As a key pillar of our new integrated device manufacturer strategy – “IDM 2.0” – we are dramatically expanding our foundry business with a combination of leading-edge packaging and process technology, a world-class intellectual property (IP) portfolio and committed capacity in the United States and Europe. Intel Foundry Services is led by Dr. Randhir Thakur, a semiconductor industry veteran and IEEE Fellow who has served in a number of executive industry roles.
Leading-Edge Process Technology
We are ready to engage with customers today starting with our existing foundry offerings, including our 22FFL process technology, which provides a compelling combination of performance, power, density and ease of design for low-power and high-performance applications. And we are expanding to include our most advanced technologies, which are optimized for cutting-edge performance.
Advanced Packaging Technology: From 2D to 3D and Beyond
Intel’s advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. Intel® embedded multi-die interconnect bridge (EMIB) and Foveros are advanced 2D and 3D packaging technologies that are delivering high performance.
Investments in capacity are critical to delivering our customer commitments. We are accelerating our next major factory build-out starting in Arizona on our Ocotillo campus. This will be our first large-scale foundry operation and represents an investment of approximately $20 billion dollars.
We are driving collaboration across the industry to advance design and IP capabilities to support our customers. Tremendous investments have been made in developing industry standard PDK models, simplifying design rules, and building on our EDA partnerships to enable design tools for our foundry platforms. Foundry customers will have access to a world-class IP portfolio including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with ARM and RISC-V ecosystem IPs. We are also making investments in our competitive foundational IP offerings – complete with standard interfaces – as well as third-party IP availability. These IP offerings can be combined with access to silicon design services to help our customers seamlessly turn silicon into solutions.
Research & Development
As a global leader in research and development (R&D) and manufacturing, Intel invests tens of billions of dollars on R&D, while driving advancements in leading edge semiconductor technology. This provides an opportunity to optimize and deliver industry-leading platform solutions with our customers for every existing and evolving market segment. And now, to expedite our R&D innovation, Intel and IBM have announced plans to collaborate in research, focused on advanced silicon process and packaging. This collaboration puts two of the best semiconductor research organizations together to accelerate the velocity of process and packaging innovations into the future.