Partnering to Turn Silicon into Solutions
Intel is unleashing its silicon design and manufacturing expertise to build your world-changing products. Let’s build the future together. Services available now.
New Investments in Our Foundry Business
As an integrated device manufacturer (IDM), our complementary capabilities mean we can fully integrate our design, process, and packaging into products that are truly the best in their class. This has never been more important than now – at a time when technology is leading the way and the entire world is becoming digital. In a recent announcement, Intel CEO, Pat Gelsinger, revealed the new investments being made in Intel’s foundry business and how we will use our technological leadership to help our foundry customers drive their next-generation innovations.
What’s your next market-leading product? Our process roadmap supports a range of solutions including low-power and high-performance applications with world-class RF capabilities, flexible interconnect, and simple design rules. Plus, proven FinFET technology with enhanced performance and EUV optimization. As well as leading-edge and foundry-optimized offerings with innovative technology breakthroughs for competitive performance.
Read how Intel’s process innovations help drive our progress
Intel’s advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. Intel® embedded multi-die interconnect bridge (EMIB) and Foveros are advanced 2D and 3D packaging technologies that are delivering high performance.
Read about Intel’s leadership in advanced packaging technology
Design Platform Options with a Unique Combination of Technology and IP
Whether your product needs front-end design, back-end design or both, when it is integrated with a unique combination of our foundry co-optimized development kits based on industry-standard electronic design automation (EDA) tools and flows and powerful silicon IPs, the result is true innovation.
Integrated Post-Silicon Solutions to Manufacture At-Scale
Intel Foundry Services offers a wide range of manufacturing services to meet your unique product needs, including our industry-leading sort and test capabilities.
Expanding Our Manufacturing Capacity
Expansion of our manufacturing capacity has begun, with a ~$20 billion investment to build two new fabs in Arizona. Intel also announced a $3.5 billion investment in our New Mexico site to support advanced semiconductor packaging technology. And in Oregon, our expansion construction project will be 1.1 million square feet of manufacturing space when it is complete. Oregon plays a critical role in our global manufacturing research and development.
Notices and Disclaimers1
Product and Performance Information
This webpage contains forward-looking statements about Intel’s future plans or expectations, including with respect to future technology and products and the expected benefits and availability of such technology and products. These statements are based on current expectations and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in such statements. For more information on the factors that could cause actual results to differ materially, see our most recent earnings release and SEC filings at www.intc.com.