Design Services Alliance
Design Services include but are not limited to silicon design, silicon validation, package design, post silicon testing, product engineering, platform services and sustaining support.
Design Services partners are well-trained engineers and program managers who support complex SoC and ASIC processes. They complement the engineering team, help address the challenges of adopting the new leading-edge process technologies and minimize unexpected design and manufacturing costs that stand in the way of a successful silicon design execution.
The Intel Foundry Services (IFS) Accelerator - Design Services Alliance has been established to help our customers accelerate their silicon-product ideas into successful production. The members of the Design Services Alliance meet stringent criteria to assure high quality and reliability on Intel process technology. Design Services scope is versatile, with specialties ranging from analog and digital physical designs to post silicon tests and bring-up services to low-level system software. Depending on customer needs, experts from the Design Services Alliance can assist in different stages such as design, verification, implementation, emulation, and post silicon services. Moreover, they can interface with IFS manufacturing and appropriate OSATs to enable end-to-end co-development (RTL to tested products), and power up next generation silicon solutions.
The current partners of IFS Accelerator - Design Services Alliance include:
“We are very excited to be a founding member and partner of the IFS Design Alliance and a preferred provider of end-to-end chip design services for IFS customers. IFS brings much needed chip manufacturing capacity to an industry struggling to remediate the global chip shortage, and the Alliance creates an invaluable ecosystem of resources for IFS customers. As the largest engineering and R&D provider, Capgemini has a unique opportunity to support companies in their development projects as an alliance partner. Both fabless semiconductor manufacturers and system design houses can gain access to cutting-edge chip design, migrate to leading nodes, and leverage Intel’s advanced manufacturing and packaging expertise through the two companies’ collaboration. With its global footprint combined with its deep European foundations, Capgemini looks forward to working with IFS to enable a resilient supply chain for customers by targeting new design centers in and for Europe, and expanding its existing presence in the Americas.”
-- Aiman Ezzat, Chief Executive Officer, Capgemini Group
“At HCLTech, we are committed to helping our clients-including integrated device manufacturers (IDMs), fabless manufacturers, IP vendors, foundries and semi-equipment providers-with innovative, sustainable and agile solutions. As a member of the IFS Accelerator Design Services Alliance, we look forward to collaborating with IFS to bring added advantages to chip manufacturing. This collaboration brings together the in-depth domain expertise of HCLTech and IFS’ advanced process technologies to ensure delivery of high-performance chips.”
--Vijay Guntur, President & Head of Engineering and R&D Services, HCLTech
“The semiconductor industry is experiencing increased demand globally across sectors such as healthcare, telecommunications, manufacturing, aerospace, among others. As the industry continues to grow, this partnership with Intel Foundry Services will provide enterprises with innovative solutions on their breakthrough System-On-Chip by using Tech Mahindra’s deep expertise in software and silicon design, along with Intel’s design ecosystem of IP, Electronic Design Automation, and advanced packaging with at-scale manufacturing. Through this collaboration, we will continue to leverage our NXT.NOWTM strategy to deliver unique and future-ready solutions for enterprises globally.”
-- Harshul Asnani, Global Head of Technology Business, Tech Mahindra
"We are thrilled to be an integral part of the IFS Accelerator Design Services Alliance. This collaboration enables us to harness the cutting-edge manufacturing technologies and unparalleled expertise of IFS, propelling us to offer enhanced value to our customers. We are looking forward to this collaboration with IFS and fellow members of the Design Services Alliance, to collectively propel innovation within the semiconductor industry."
-- Huzefa Cutlerywala, SVP Sales and Marketing, Tessolve
“Together with Intel Foundry Services’ (IFS) Accelerator Alliance of industry leaders, we are working to accelerate design innovation that is critical to the global semiconductor ecosystem, particularly as the industry experiences exponential growth in demand. Wipro paves the way in global chip innovation, so our end-to-end design processes will play an integral part in enabling IFS to accelerate its chip manufacturing. Through a spirit of collaboration, we are showing both our customers and the market how persistent innovation can rise to solve any technology challenge we may face today, and in the future.”
-- Thierry Delaporte, CEO and Managing Director, Wipro Limited
Notices and Disclaimers
Other names and brands may be claimed as the property of others.