Cloud Alliance
The IFS Cloud Alliance will enable secure and trusted design environments on the cloud and improve customers’ efficiency and time to market by harnessing the power of massive on-demand compute and scale. Chip design is an incredibly complex process, requiring powerful software and hardware tools to create the intricate patterns that make up the layout of an integrated circuit.
Cloud-based design combines EDA tool scalability with the massive parallelism offered by the cloud, supporting critical design workloads that can benefit a wide variety of customers, from startups to companies with established on-premise compute farms.
Through the Cloud Alliance, IFS will collaborate with partners to ensure their EDA tools are optimized to take advantage of the scalability of the cloud, while meeting the requirements of Intel’s process design kits (PDKs). This will provide customers a secure and scalable path to adopt their preferred EDA tools, and flows in the cloud environment, through partnerships with leading EDA and cloud service providers.
The current partners of the IFS Accelerator - Cloud Alliance include:
“We are excited to be collaborating with Intel in the launch of the IFS Cloud Alliance,” said David Pellerin, Director of Semiconductor Industry Solutions at AWS. “We share a common goal to make semiconductor design and verification more scalable, and more accessible to a wide range of design teams, with the security and performance needed for reduced IC time-to-market and increased quality.”
-- David Pellerin, Director of Semiconductor Industry Solutions, AWS
"Our close collaboration with Intel Foundry Services has brought together advanced node manufacturing with cloud computing and collaboration technologies, to establish a foundation for the next round of growth in the semiconductor industry. By joining Intel Foundry Services’ Cloud Alliance, Microsoft is proud to expand on that collaboration to provide a secure and scalable path to advanced silicon manufacturing." said William Chappell, CTO, Mission Engineering, and VP, Mission Systems, at Microsoft Corporation. "This is the latest chapter in the partnership between Intel and Microsoft that stretches back more than 40 years."
-- William Chappell, CTO, Mission Engineering, and VP, Mission Systems, Microsoft Corporation
"Ansys’ comprehensive suite of interoperable, scalable multiphysics solutions plays a key role in IFS’ first design flow supported in the cloud,” said John Lee, Vice President and General Manager of the Semiconductor, Electronics, and Optics Business Unit at Ansys. "We look forward to continuing our long-standing collaboration with Intel to advance semiconductor design by ensuring that chip designers can access Ansys' gold standard multiphysics solution via the cloud regardless of their chosen EDA workflow."
-- John Lee, Vice President and General Manager of the Semiconductor, Electronics, and Optics Business Unit, Ansys
"Cadence has longstanding leadership providing EDA solutions in the cloud and has successfully enabled thousands of customers to accelerate their innovation with our proven cloud solutions. Using the industry-leading, production-proven Cadence Cloud portfolio, which features highly flexible business models, customers have increased engineering productivity, significantly decreased turnaround times and improved overall cost efficiency. By joining the Intel Foundry Services Cloud Alliance, we’re enabling our mutual customers to leverage the scalable compute power of the cloud with our production-proven portfolio along with Intel’s advanced process and packaging technologies in a secure design environment.”
-- Mahesh Turaga, Vice President, Cloud Business Development, Cadence
"Siemens EDA has been optimizing tools for large-scale compute environments for more than 15 years. As part of the IFS Cloud Alliance ecosystem, Siemens EDA will work closely with cloud vendors, customers, and Intel Foundry Services to leverage that experience to simplify the path to higher quality of results in less time. Siemens EDA is pleased to join the IFS Cloud Alliance ecosystem, and we look forward to extending the benefits of our industry-leading products and services to companies of all sizes who use Intel’s manufacturing services.”
-- Craig Johnson, Vice President EDA Cloud Solutions, Siemens EDA
"Chip design is moving to the cloud at lightning speed. The Intel Foundry Services Cloud Alliance program will further accelerate the semiconductor industry’s adoption of cloud-based design, ensuring that engineers can continue to use the best technology, tools and flows as they move design to the cloud. We are collaborating with IFS as part of the Cloud Alliance, to enable our mutual customers to deploy our tools quickly and efficiently on the public cloud and help them deliver better products faster while meeting increasingly complex design and verification challenges."
-- Sandeep Mehndiratta, Vice President, Enterprise Go-To-Market & Cloud, Synopsys
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