The IFS Cloud Alliance will enable secure and trusted design environments on the cloud and improve customers’ efficiency and time to market by harnessing the power of massive on-demand compute and scale. Chip design is an incredibly complex process, requiring powerful software and hardware tools to create the intricate patterns that make up the layout of an integrated circuit.
Cloud-based design combines EDA tool scalability with the massive parallelism offered by the cloud, supporting critical design workloads that can benefit a wide variety of customers, from startups to companies with established on-premise compute farms.
Through the Cloud Alliance, IFS will collaborate with partners to ensure their EDA tools are optimized to take advantage of the scalability of the cloud, while meeting the requirements of Intel’s process design kits (PDKs). This will provide customers a secure and scalable path to adopt their preferred EDA tools, and flows in the cloud environment, through partnerships with leading EDA and cloud service providers.