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  1. Intel at ISC 2022

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Intel at ISC 2022

Innovation Accelerated

Register Now!

Keynote: Accelerated Innovation for a More Sustainable and Open HPC-AI

Solving the world’s greatest challenges with technology has been at the center of high-performance computing for decades. As we enter the exascale era, we cannot solve one set of challenges and simultaneously create another set. Namely, we must dramatically curtail the energy consumption and resulting climate impact driven by today’s insatiable demand for computing capacity. There is also an increasing need for democratizing compute through open standards and a reliable software stack.

Hear from Jeff McVeigh, VP of Super Compute Group at Intel, as he details process, chip, and system-level innovations all designed to minimize “energy-to-solution” for the most demanding workloads. Special guests will join to discuss how Intel and its partners are accelerating deployment of these innovations through an open ecosystem and advanced software stack to achieve a future of sustainable and open HPC-AI.

Join us Tuesday, May 31 at 6:30pm CEST – on demand in the Intel Digital Lounge and live in-person at ISC 2022 Hall 4 – Ground Floor.

Intel Digital Lounge

Experience the latest Intel technology in the Intel Digital Lounge. Learn more about new HW and SW programming tools that are optimized for HPC AI workloads, including next-gen Xe architecture, High Bandwidth Memory, and high performance storage with DAOS.

Register Now!

Join Intel Live in Hamburg, Germany!

Visit our Intel Booth B201! Explore the exhibition to connect with Intel’s customers and HPC partners as they share exciting advancements and industry solutions that expedite deployment of the latest technologies.

Plus so much more:

  • Monday, May 30 - Wednesday, June 1: Visit the exhibition floor, Intel Booth B201, to view our latest demos
  • Monday, May 30, 1:00pm CEST in Hall 4: Vendor Showdown with leading HPC vendors including a Q&A with Ogi Brkic, VP, Accelerated Computing Systems & Graphics and GM, Super Compute Product Line, Intel
  • Tuesday, May 31 at 6:30pm CEST in Hall 4: Intel Keynote “Accelerated Innovation for a Sustainable and Open HPC-AI” with Jeff McVeigh, VP of Super Compute Group, Intel
  • Wednesday, June 1 at 1:00pm CEST in Hall G1: Vendor Roadmap Session “Accelerating Science with Intel HPC Technologies” with Ogi Brkic

oneAPI DevSummit at ISC 2022

Join us May 27th at 9:00am CEST for this year’s all-remote technical conference to see the growing momentum of oneAPI and learn about how the community is using oneAPI on various platforms such as ARM, NVIDIA, Intel and more for HPC and AI workloads.

This year offers a full day of hands-on tutorials, tech talks, and workshops spanning all things high-performance computing and AI: hardware, oneAPI software tools, best-practice techniques, and more to advance and deploy next-generation innovations that scale across platforms.

What you’ll get:

  • Fresh new content from industry-leading experts—SiPearl, Argonne, Pázmány Péter Catholic University, Durham University, and more
  • Topics covering cross-architecture computing, SYCL programming challenges and opportunities, AI analytics, and Exascale
  • Advance insight about the latest advancements shaping the future of high-performance computing
  • A deep dive into cross-architecture software development—tech talks, how-to’s, and hands-on training sessions

Register Now!

Intel at ISC 2022 Technical Content: Tech Talks, Demos and Fireside Chats

Hear from Intel and our customers and partners in tech talks, fireside chats, demos, and user stories across a wide range of topics in the Intel Digital Lounge, including the keynote address from the ISC Event Hall by Jeff McVeigh, VP of Super Compute Group at Intel.

Topic

Session Type

Speaker

Accelerated Innovation for a More Sustainable and Open HPC-AI

Keynote

Jeff McVeigh, Intel Corporation

Accelerating Science with Intel HPC Technologies

Vendor Roadmap

Ogi Brkic, Intel Corporation

Breakthrough Performance for Financial Services

Demo

 

High Performance with High Bandwidth Memory

Demo

 

Accelerate AI for HPC

Demo

 

High Performance Storage with DAOS

Demo

 

Argonne, HPE and Intel Are Preparing for Exascale Computing Technology with Aurora

Fireside Chat

Brijesh Tripathi, Intel Corporation; Rick Stevens, Argonne National Laboratory and University of Chicago; Mike Woodacre, Hewlett Packard Enterprise

Experiences Porting NAMD to the oneAPI/SYCL Programming Model

Tech Talk

David J. Hardy, University of Illinois at Urbana-Champaign, Beckman Institute of Advanced Science and Technology

HPC-AI Benchmark Performance1 on 4th Gen Intel® Xeon® Scalable Processor
Tech Talk Vikram Saletore, Intel Corporation

Configuring Intel® Xeon® Processors, Codenamed Sapphire Rapids HBM for Performance and Scalability, Showcasing the Performance of Ansys Fluent Simulations

Tech Talk

Ruchira Sasanka, Intel Corporation; Wim Slagter, Ansys

Powering Heterogeneous Computing with oneAPI on ARM and Intel Ponte Vecchio with SiPearl

Fireside Chat

Joachim Aertebjerg, Intel Corporation; Vincent Casillas, SiPearl

HPC’s Future Is Heterogeneous: Get Insights on the Transition While Mitigating Lock-in

Tech Talk

David Goudin, Atos Big Data and Security

Accelerating Genomics Data Processing at Scale

Tech Talk

Henry Gabb, Intel Corporation; Don Freed, Sentieon Inc.

Google Cloud and Intel DAOS High-Performance Storage

Fireside Chat

Kelsey Prantis, Intel Corporation; Dean Hildebrand, Google Cloud

World-Leading Academic/Industrial Collaboration – Cambridge University Exascale Lab

Fireside Chat

Dr. Nash Palaniswamy, Intel Corporation; Dr. Paul Calleja, University of Cambridge

Our Partner Collaborations Deliver New Innovation and Discovery

Partner Spotlight

Argonne National Laboratory; QCT; University of Cambridge; Lenovo; Supermicro; Inspur; AWS

View all Show less

Product and Performance Information

1Unverified performance Gains on MLPerf™ HPC-AI v 0.7 DeepCAM and Cosmoflow. Result not verified by MLCommons Association. Unverified results have not been through an MLPerf™ review and may use measurement methodologies and/or workload implementations that are inconsistent with the MLPerf™ specification for verified results. The MLPerf™ name and logo are trademarks of MLCommons Association in the United States and other countries. All rights reserved. Unauthorized use strictly prohibited. See www.mlcommons.org for more information.
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