Process & Packaging
Join Intel CEO Pat Gelsinger for a webcast detailing the company’s process and packaging innovations and updates.
Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging under its IDM 2.0 strategy announced in March. Join a webcast with CEO Pat Gelsinger and Dr. Ann Kelleher, Senior Vice President and General Manager of Technology Development, where they will provide a deeper look at Intel’s process and packaging roadmaps.
Pat Gelsinger, Intel Chief Executive Officer
Pat Gelsinger is chief executive officer of Intel Corporation and serves on its board of directors. On February 15, 2021, Gelsinger returned to Intel, the company where he had spent the first 30 years of his career.
Before rejoining Intel, Gelsinger was CEO of VMware. In that role, he transformed VMware into a recognized global leader in cloud infrastructure, enterprise mobility and cyber security – almost tripling the company’s annual revenues. Gelsinger was also ranked the best CEO in America in 2019, according to an annual survey by Glassdoor. Prior to joining VMware in 2012, Gelsinger was president and chief operating officer of EMC’s Information Infrastructure Products business, overseeing engineering and operations for information storage, data computing, backup and recovery, RSA security and enterprise solutions.
Dr. Ann B. Kelleher, Intel Senior Vice President/General Manager, Technology Development
Dr. Ann B. Kelleher is responsible for the research, development and deployment of next-generation silicon logic, packaging and test technologies that power the future of Intel’s innovation.
Previously, Kelleher was general manager of Manufacturing and Operations, where she oversaw Intel’s worldwide manufacturing operations including Fab Sort Manufacturing, Assembly Test Manufacturing and strategic planning, as well as corporate quality assurance and corporate services. Before that, she served as co-general manager of the Technology and Manufacturing Group.