14. Variable Pitch BGA (VPBGA) Package Design of Intel Agilex® 5 FPGAs and SoCs
Compared to the standard ball grid array (BGA) packages, the VPBGA package has a variable ball pitch size with a minimum size of 0.65 mm.
The variable ball pitch helps reduce the package form factor. Despite the smaller package size, the VPBGA packages can provide the same I/O pin count and compatible electrical performance compared to the standard BGA packages.
As shown in the following figure, the variable ball grid pattern eases trace routability, reducing the design complexity, number of PCB layers, and board thickness and size—ultimately, reducing board cost and development time.
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