1. Intel® Agilex™ JTAG BST Overview
Intel® Agilex™ devices are implemented using multiple die inside the package, connected together using EMIB (Embedded Multi-die Interconnect Bridge) technology. The multiple die implementation is transparent to BST. There is a single boundary-scan chain for the complete device that includes every die inside the package.
You can perform BST on Intel® Agilex™ devices before, after, and during configuration.
Did you find the information on this page useful?