2.3. Intel® Agilex™ M-Series FPGAs and SoCs
Device | Logic Element | Adaptive Logic Module | M20K | MLAB | HBM2E DRAM (GB) | DSP | Crypto Block | |||
---|---|---|---|---|---|---|---|---|---|---|
Count | Size (Mb) | Count | Size (Mb) | Count | 18x19 Multiplier | |||||
AGM 032 | 3,245,000 | 1,100,000 | 15,932 | 311 | 55,000 | 33 | 16 / 32 | 9,375 | 18,750 | — |
AGM 039 | 3,851,520 | 1,305,600 | 18,960 | 370 | 65,280 | 40 | 16 / 32 | 12,300 | 24,600 | — |
Device | CXL* Lane |
F-Tile | R-Tile | HPS |
|||||
---|---|---|---|---|---|---|---|---|---|
Transceiver Channel | Ethernet Block |
PCIe* Controller |
PCIe* 32/ CXL* 35 Controller |
||||||
FGT 28 | FHT 29 | ||||||||
32 Gbps NRZ |
58 Gbps PAM4 |
58 Gbps NRZ |
116 Gbps PAM4 |
||||||
AGM 032 | 1627 | 64 |
48 | 8 |
8 | 4 33 | 4 34 | 1 | Yes |
AGM 039 | 1627 | 64 |
48 | 8 |
8 | 4 33 | 4 34 | 1 | Yes |
Device | Package (Grid Array: Hexagonal) |
|||||
---|---|---|---|---|---|---|
3184B (56 mm × 45 mm) 0.92 mm pitch |
||||||
GPIO | LVDS | F-Tile ×4 | ||||
FGT | FHT | |||||
32 Gbps NRZ |
58 Gbps PAM4 |
58 Gbps NRZ |
116 Gbps PAM4 |
|||
AGM 032 | 720 | 360 | 64 | 48 | 8 | 8 |
AGM 039 | 720 | 360 | 64 | 48 | 8 | 8 |
Device | Package (Grid Array: Hexagonal) |
|||||||
---|---|---|---|---|---|---|---|---|
3687A (56 mm × 52.5 mm) 0.92 mm pitch |
||||||||
GPIO | LVDS | F-Tile ×3 | R-Tile ×1 | |||||
FGT | FHT | 32 Gbps PCIe* |
CXL* | |||||
32 Gbps NRZ |
58 Gbps PAM4 |
58 Gbps NRZ |
116 Gbps PAM4 |
|||||
AGM 032 | 768 | 384 | 48 | 36 | 8 | 8 | 16 | 16 |
AGM 039 | 768 | 384 | 48 | 36 | 8 | 8 | 16 | 16 |
Device | Package (Grid Array: Hexagonal) |
||||||
---|---|---|---|---|---|---|---|
4700B (56 mm × 66 mm) 0.92 mm pitch |
|||||||
GPIO | LVDS | F-Tile ×3 | HBM2E (GB) | ||||
FGT | FHT | ||||||
32 Gbps NRZ |
58 Gbps PAM4 |
58 Gbps NRZ |
116 Gbps PAM4 |
||||
AGM 032 | 768 | 384 | 64 | 48 | 8 | 8 | 16 / 32 |
AGM 039 | 768 | 384 | 64 | 48 | 8 | 8 | 16 / 32 |
Device | Package (Grid Array: Hexagonal) |
||||||||
---|---|---|---|---|---|---|---|---|---|
4700A (56 mm × 66 mm) 0.92 mm pitch |
|||||||||
GPIO | LVDS | F-Tile ×3 | R-Tile ×1 | HBM2E (GB) | |||||
FGT | FHT | 32 Gbps PCIe* |
CXL* | ||||||
32 Gbps NRZ |
58 Gbps PAM4 |
58 Gbps NRZ |
116 Gbps PAM4 |
||||||
AGM 032 | 768 | 384 | 48 | 36 | 8 | 8 | 16 | 16 | 16 / 32 |
AGM 039 | 768 | 384 | 48 | 36 | 8 | 8 | 16 | 16 | 16 / 32 |
27 Available in package 3687A.
28 Maximum F-Tile general purpose transceiver (FGT) RS and KP FEC NRZ up to 32 Gbps, or PAM4 up to 58 Gbps.
29 Maximum F-Tile high speed transceiver (FHT) RS and KP FEC NRZ up to 58 Gbps, or PAM4 up to 116 Gbps.
30 Maximum 10, 25, 40, 50, 100, 200, or 400 GbE MAC and FEC hard IP blocks.
31 Maximum PCIe* hard IP blocks ( PCIe* 4.0 ×16) or bifurcatable two PCIe* 4.0 ×8 (EP) or four PCIe* 4.0 ×4 (RP).
32 Maximum PCIe* hard IP blocks ( PCIe* 5.0 ×16) or bifurcatable two PCIe* 5.0 ×8 (EP) or four PCIe* 5.0 ×4 (RP).
33 Maximum of four F-Tiles in package 3184B.
34 Maximum of four PCIe* controllers in package 3184B.