Agilex™ 7 FPGAs and SoCs Device Overview

ID 683458
Date 4/01/2024
Document Table of Contents

16. Balls Anywhere Package Design of Intel® Agilex™ D-Series FPGAs and SoCs

The Intel® Agilex™ D-Series FPGA and SoC packages use the "balls anywhere" package design.

Compared to the standard ball grid array (BGA) packages, the "balls anywhere" package has a mixed ball pitch and differently-sized pads. The "balls anywhere" package has a mixed ball pitch size with a minimum ball pitch of 0.65 mm.

Figure 19. Comparison Between Standard Grid and Balls Anywhere

The mixed ball pitch helps reduce the package form factor by 1 mm to 2 mm. Despite the smaller package size, the "balls anywhere" packages can provide the same I/O pin count and compatible electrical performance compared to the standard BGA packages.

As shown in the following figure, the mixed ball grid pattern has differently-sized pads. This feature eases trace routability, reducing the design complexity, number of PCB layers, and board thickness and size—ultimately, reducing board cost and development time.

Figure 20. Example of PCB Trace Routing for Balls Anywhere Package