16. Balls Anywhere Package Design of Intel® Agilex™ D-Series FPGAs and SoCs
Compared to the standard ball grid array (BGA) packages, the "balls anywhere" package has a mixed ball pitch and differently-sized pads. The "balls anywhere" package has a mixed ball pitch size with a minimum ball pitch of 0.65 mm.
The mixed ball pitch helps reduce the package form factor by 1 mm to 2 mm. Despite the smaller package size, the "balls anywhere" packages can provide the same I/O pin count and compatible electrical performance compared to the standard BGA packages.
As shown in the following figure, the mixed ball grid pattern has differently-sized pads. This feature eases trace routability, reducing the design complexity, number of PCB layers, and board thickness and size—ultimately, reducing board cost and development time.
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