Intel FPGA Programmable Acceleration Card N3000-N Data Sheet

ID 683434
Date 12/11/2020

5.1. Cooling Requirements

Figure 8. Forward and Reverse Flow Cooling Curve
Note: Cooling curve generated in a ducted wind-tunnel configuration using 2 x 2 x 25G configuration with 5 C FPGA junction temperature margin.
Note: Your in-system testing is required to confirm cooling capability of server and Intel® FPGA PAC N3000-N installation.
Table 9.  Local Air Inlet Temperature and Air Flow Values for Forward and Reverse Cooling
FPGA Power = 65 W FPGA Power = 70 W
TLA (°C) Air Flow (CFM) TLA (°C) Air Flow (CFM)
48 14.7 45 14.7
52 17.5 49 17.5
56 22.0 53 22.0
Note: TLA values shown in the tables and charts of this section are informational for maintaining junction temperature and board temperature within thermal limits, and may represent conditions outside of the supported operating range.
Note: These flow curves are based on numerical analysis and wind tunnel testing and should be used as a starting point for thermal design estimation. Thermal performance of host systems may vary. Therefore, you should perform in-system thermal validation using the thermal power load (TPL) FPGA workload provided with the Intel FPGA Programmable Acceleration Card N3000-N Platform Qualification Guidelines. Contact your Intel® Sales representative to obtain this guide and TPL FPGA workload.