External Memory Interface Handbook Volume 2: Design Guidelines

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ID 683385
Date 5/08/2017
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7.4.8.4. Arria 10 EMIF IP RLDRAM 3 Parameters: Mem Timing

These parameters should be read from the table in the datasheet associated with the speed bin of the memory device (not necessarily the frequency at which the interface is running).
Table 274.  Group: Mem Timing / Parameters dependent on Speed Bin
Display Name Identifier Description
Speed bin MEM_RLD3_SPEEDBIN_ENUM The speed grade of the memory device used. This parameter refers to the maximum rate at which the memory device is specified to run.
tCKDK_max MEM_RLD3_TCKDK_MAX_CYC tCKDK_max refers to the maximum skew from the memory clock (CK) to the write strobe (DK).
tCKDK_min MEM_RLD3_TCKDK_MIN_CYC tCKDK_min refers to the minimum skew from the memory clock (CK) to the write strobe (DK).
tCKQK_max MEM_RLD3_TCKQK_MAX_PS tCKQK_max refers to the maximum skew from the memory clock (CK) to the read strobe (QK).
tDH (base) DC level MEM_RLD3_TDH_DC_MV tDH (base) DC level refers to the voltage level which the data bus must not cross during the hold window. The signal is considered stable only if it remains above this voltage level (for a logic 1) or below this voltage level (for a logic 0) for the entire hold period.
tDH (base) MEM_RLD3_TDH_PS tDH (base) refers to the hold time for the Data (DQ) bus after the rising edge of CK.
tDS (base) AC level MEM_RLD3_TDS_AC_MV tDS (base) AC level refers to the voltage level which the data bus must cross and remain above during the setup margin window. The signal is considered stable only if it remains above this voltage level (for a logic 1) or below this voltage level (for a logic 0) for the entire setup period.
tDS (base) MEM_RLD3_TDS_PS tDS(base) refers to the setup time for the Data (DQ) bus before the rising edge of the DQS strobe.
tIH (base) DC level MEM_RLD3_TIH_DC_MV tIH (base) DC level refers to the voltage level which the address/command signal must not cross during the hold window. The signal is considered stable only if it remains above this voltage level (for a logic 1) or below this voltage level (for a logic 0) for the entire hold period.
tIH (base) MEM_RLD3_TIH_PS tIH (base) refers to the hold time for the Address/Command (A) bus after the rising edge of CK. Depending on what AC level the user has chosen for a design, the hold margin can vary (this variance will be automatically determined when the user choses the "tIH (base) AC level").
tIS (base) AC level MEM_RLD3_TIS_AC_MV tIS (base) AC level refers to the voltage level which the address/command signal must cross and remain above during the setup margin window. The signal is considered stable only if it remains above this voltage level (for a logic 1) or below this voltage level (for a logic 0) for the entire setup period.
tIS (base) MEM_RLD3_TIS_PS tIS (base) refers to the setup time for the Address/Command/Control (A) bus to the rising edge of CK.
tQH MEM_RLD3_TQH_CYC tQH specifies the output hold time for the DQ/DINV in relation to QK.
tQKQ_max MEM_RLD3_TQKQ_MAX_PS tQKQ_max describes the maximum skew between the read strobe (QK) clock edge to the data bus (DQ/DINV) edge.

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